TWI555115B - Vacuum processing device and its operation method - Google Patents

Vacuum processing device and its operation method Download PDF

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Publication number
TWI555115B
TWI555115B TW103101817A TW103101817A TWI555115B TW I555115 B TWI555115 B TW I555115B TW 103101817 A TW103101817 A TW 103101817A TW 103101817 A TW103101817 A TW 103101817A TW I555115 B TWI555115 B TW I555115B
Authority
TW
Taiwan
Prior art keywords
vacuum
vacuum transfer
chamber
container
processing
Prior art date
Application number
TW103101817A
Other languages
English (en)
Chinese (zh)
Other versions
TW201448095A (zh
Inventor
磯村僚一
工藤豊
下村隆浩
Original Assignee
日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TW201448095A publication Critical patent/TW201448095A/zh
Application granted granted Critical
Publication of TWI555115B publication Critical patent/TWI555115B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW103101817A 2013-03-14 2014-01-17 Vacuum processing device and its operation method TWI555115B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013051971A JP6120621B2 (ja) 2013-03-14 2013-03-14 真空処理装置及びその運転方法

Publications (2)

Publication Number Publication Date
TW201448095A TW201448095A (zh) 2014-12-16
TWI555115B true TWI555115B (zh) 2016-10-21

Family

ID=51503975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103101817A TWI555115B (zh) 2013-03-14 2014-01-17 Vacuum processing device and its operation method

Country Status (5)

Country Link
US (1) US9748124B2 (https=)
JP (1) JP6120621B2 (https=)
KR (1) KR101590533B1 (https=)
CN (1) CN104051295B (https=)
TW (1) TWI555115B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6718755B2 (ja) * 2016-06-22 2020-07-08 株式会社日立ハイテク 真空処理装置およびその運転方法
KR20190045410A (ko) * 2016-06-30 2019-05-02 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체
JP6902379B2 (ja) 2017-03-31 2021-07-14 東京エレクトロン株式会社 処理システム
JP7115879B2 (ja) 2018-03-23 2022-08-09 株式会社日立ハイテク 真空処理装置の運転方法
CN110544660B (zh) * 2018-08-02 2022-08-16 北京北方华创微电子装备有限公司 模块化晶圆传输系统和半导体设备
US10483142B1 (en) * 2018-09-14 2019-11-19 Lam Research Corporation Vacuum robot positioning system with reduced sensitivity to chamber pressure
KR102515863B1 (ko) 2020-03-24 2023-03-31 주식회사 히타치하이테크 진공 처리 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101688296A (zh) * 2007-09-10 2010-03-31 东京毅力科创株式会社 真空处理系统及基板搬送方法

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JP2000150618A (ja) * 1998-11-17 2000-05-30 Tokyo Electron Ltd 真空処理システム
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
JP2003059999A (ja) * 2001-08-14 2003-02-28 Tokyo Electron Ltd 処理システム
WO2003100836A1 (en) * 2002-05-21 2003-12-04 Asm America, Inc. Reduced cross-contamination between chambers in a semiconductor processing tool
US8029226B2 (en) * 2003-11-10 2011-10-04 Brooks Automation, Inc. Semiconductor manufacturing systems
US10086511B2 (en) * 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
JP2007258347A (ja) * 2006-03-22 2007-10-04 Nitto Koki Kk 化合物半導体の製造方法及び化合物半導体の製造装置
KR100847888B1 (ko) * 2006-12-12 2008-07-23 세메스 주식회사 반도체 소자 제조 장치
JP4825689B2 (ja) * 2007-01-12 2011-11-30 株式会社日立ハイテクノロジーズ 真空処理装置
JP5295808B2 (ja) * 2009-02-09 2013-09-18 東京エレクトロン株式会社 パーティクル付着防止方法及び被処理基板の搬送方法
TW201123340A (en) * 2009-11-12 2011-07-01 Hitachi High Tech Corp Vacuum processing system and vacuum processing method of semiconductor processing substrate
JP2012028659A (ja) * 2010-07-27 2012-02-09 Hitachi High-Technologies Corp 真空処理装置
JP5710194B2 (ja) * 2010-09-28 2015-04-30 株式会社日立ハイテクノロジーズ 真空処理装置
JP5785712B2 (ja) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ 真空処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101688296A (zh) * 2007-09-10 2010-03-31 东京毅力科创株式会社 真空处理系统及基板搬送方法

Also Published As

Publication number Publication date
KR101590533B1 (ko) 2016-02-01
US20140271049A1 (en) 2014-09-18
TW201448095A (zh) 2014-12-16
US9748124B2 (en) 2017-08-29
CN104051295B (zh) 2017-05-10
JP6120621B2 (ja) 2017-04-26
JP2014179431A (ja) 2014-09-25
CN104051295A (zh) 2014-09-17
KR20140113324A (ko) 2014-09-24

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