TWI545685B - 支承體分離裝置及支承體分離方法 - Google Patents

支承體分離裝置及支承體分離方法 Download PDF

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Publication number
TWI545685B
TWI545685B TW103108148A TW103108148A TWI545685B TW I545685 B TWI545685 B TW I545685B TW 103108148 A TW103108148 A TW 103108148A TW 103108148 A TW103108148 A TW 103108148A TW I545685 B TWI545685 B TW I545685B
Authority
TW
Taiwan
Prior art keywords
support
holding portion
laminate
support body
separation
Prior art date
Application number
TW103108148A
Other languages
English (en)
Chinese (zh)
Other versions
TW201448107A (zh
Inventor
高瀬真治
稲尾吉浩
中村彰彥
Original Assignee
東京應化工業股份有限公司
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Filing date
Publication date
Application filed by 東京應化工業股份有限公司 filed Critical 東京應化工業股份有限公司
Publication of TW201448107A publication Critical patent/TW201448107A/zh
Application granted granted Critical
Publication of TWI545685B publication Critical patent/TWI545685B/zh

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Classifications

    • H10P72/0442—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H10P72/0428—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H10P72/7442—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1195—Delaminating from release surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1994—Means for delaminating from release surface

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW103108148A 2013-04-30 2014-03-10 支承體分離裝置及支承體分離方法 TWI545685B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013095969A JP5926700B2 (ja) 2013-04-30 2013-04-30 支持体分離装置及び支持体分離方法

Publications (2)

Publication Number Publication Date
TW201448107A TW201448107A (zh) 2014-12-16
TWI545685B true TWI545685B (zh) 2016-08-11

Family

ID=51788240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108148A TWI545685B (zh) 2013-04-30 2014-03-10 支承體分離裝置及支承體分離方法

Country Status (4)

Country Link
US (1) US9238357B2 (enExample)
JP (1) JP5926700B2 (enExample)
KR (1) KR101625730B1 (enExample)
TW (1) TWI545685B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6216727B2 (ja) * 2014-05-08 2017-10-18 東京応化工業株式会社 支持体分離方法
CN106158691A (zh) * 2015-01-27 2016-11-23 精材科技股份有限公司 剥离装置及利用该装置剥离芯片封装体表面盖层的方法
JP6612648B2 (ja) * 2016-02-17 2019-11-27 東京応化工業株式会社 支持体分離装置及び支持体分離方法
JP6622661B2 (ja) 2016-06-29 2019-12-18 東京応化工業株式会社 支持体分離装置、及び支持体分離方法
JP6695227B2 (ja) * 2016-07-19 2020-05-20 東京応化工業株式会社 支持体分離装置および支持体分離方法
CN113299576B (zh) * 2020-02-21 2022-11-22 济南晶正电子科技有限公司 一种薄膜机械分离装置
CN115803851B (zh) * 2021-01-21 2023-06-30 信越工程株式会社 工件分离装置及工件分离方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187162B2 (en) * 2002-12-16 2007-03-06 S.O.I.Tec Silicon On Insulator Technologies S.A. Tools and methods for disuniting semiconductor wafers
JP2004266052A (ja) * 2003-02-28 2004-09-24 Canon Inc 重ね合わせ装置
JP2005057046A (ja) * 2003-08-04 2005-03-03 Sekisui Chem Co Ltd Ｉｃチップの製造方法及びｉｃチップの製造装置
JP2005191535A (ja) * 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 貼り付け装置および貼り付け方法
JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
JP5487560B2 (ja) * 2008-05-28 2014-05-07 富士通株式会社 基板処理装置及び基板処理方法
JP5210060B2 (ja) 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法
EP2357208B1 (en) * 2008-12-11 2014-05-07 DIC Corporation Curable resin compositions, coatings, and laminated plastics including the same
CN102202994B (zh) * 2009-08-31 2014-03-12 旭硝子株式会社 剥离装置
JP5795199B2 (ja) 2011-06-16 2015-10-14 株式会社ダイヘン 電力変換装置及び電力変換装置の制御方法
JP2014179355A (ja) * 2011-07-04 2014-09-25 Asahi Glass Co Ltd ガラス基板の剥離方法及びその装置
US8858756B2 (en) * 2011-10-31 2014-10-14 Masahiro Lee Ultrathin wafer debonding systems
JP5977710B2 (ja) * 2013-05-10 2016-08-24 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
JP2014216632A (ja) 2014-11-17
US9238357B2 (en) 2016-01-19
JP5926700B2 (ja) 2016-05-25
KR20140130018A (ko) 2014-11-07
TW201448107A (zh) 2014-12-16
KR101625730B1 (ko) 2016-06-13
US20140318714A1 (en) 2014-10-30

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