KR101625730B1 - 지지체 분리 장치 및 지지체 분리 방법 - Google Patents

지지체 분리 장치 및 지지체 분리 방법 Download PDF

Info

Publication number
KR101625730B1
KR101625730B1 KR1020140028952A KR20140028952A KR101625730B1 KR 101625730 B1 KR101625730 B1 KR 101625730B1 KR 1020140028952 A KR1020140028952 A KR 1020140028952A KR 20140028952 A KR20140028952 A KR 20140028952A KR 101625730 B1 KR101625730 B1 KR 101625730B1
Authority
KR
South Korea
Prior art keywords
support
laminate
holding
separating
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020140028952A
Other languages
English (en)
Korean (ko)
Other versions
KR20140130018A (ko
Inventor
신지 다카세
요시히로 이나오
아키히코 나카무라
Original Assignee
도오꾜오까고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도오꾜오까고오교 가부시끼가이샤 filed Critical 도오꾜오까고오교 가부시끼가이샤
Publication of KR20140130018A publication Critical patent/KR20140130018A/ko
Application granted granted Critical
Publication of KR101625730B1 publication Critical patent/KR101625730B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1195—Delaminating from release surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1994—Means for delaminating from release surface

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
KR1020140028952A 2013-04-30 2014-03-12 지지체 분리 장치 및 지지체 분리 방법 Active KR101625730B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013095969A JP5926700B2 (ja) 2013-04-30 2013-04-30 支持体分離装置及び支持体分離方法
JPJP-P-2013-095969 2013-04-30

Publications (2)

Publication Number Publication Date
KR20140130018A KR20140130018A (ko) 2014-11-07
KR101625730B1 true KR101625730B1 (ko) 2016-06-13

Family

ID=51788240

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140028952A Active KR101625730B1 (ko) 2013-04-30 2014-03-12 지지체 분리 장치 및 지지체 분리 방법

Country Status (4)

Country Link
US (1) US9238357B2 (enExample)
JP (1) JP5926700B2 (enExample)
KR (1) KR101625730B1 (enExample)
TW (1) TWI545685B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6216727B2 (ja) * 2014-05-08 2017-10-18 東京応化工業株式会社 支持体分離方法
CN106158691A (zh) * 2015-01-27 2016-11-23 精材科技股份有限公司 剥离装置及利用该装置剥离芯片封装体表面盖层的方法
JP6612648B2 (ja) * 2016-02-17 2019-11-27 東京応化工業株式会社 支持体分離装置及び支持体分離方法
JP6622661B2 (ja) 2016-06-29 2019-12-18 東京応化工業株式会社 支持体分離装置、及び支持体分離方法
JP6695227B2 (ja) * 2016-07-19 2020-05-20 東京応化工業株式会社 支持体分離装置および支持体分離方法
CN113299576B (zh) * 2020-02-21 2022-11-22 济南晶正电子科技有限公司 一种薄膜机械分离装置
US20230321752A1 (en) * 2021-01-21 2023-10-12 Shin-Etsu Engineering Co., Ltd. Workpiece separation device and workpiece separation method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005057046A (ja) 2003-08-04 2005-03-03 Sekisui Chem Co Ltd Ｉｃチップの製造方法及びｉｃチップの製造装置
JP2005191535A (ja) 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 貼り付け装置および貼り付け方法
JP2009289878A (ja) 2008-05-28 2009-12-10 Fujitsu Ltd 基板処理装置及び基板処理方法
US8360129B2 (en) 2009-08-31 2013-01-29 Asahi Glass Company, Limited Peeling device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187162B2 (en) * 2002-12-16 2007-03-06 S.O.I.Tec Silicon On Insulator Technologies S.A. Tools and methods for disuniting semiconductor wafers
JP2004266052A (ja) * 2003-02-28 2004-09-24 Canon Inc 重ね合わせ装置
JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
JP5210060B2 (ja) 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法
EP2357208B1 (en) * 2008-12-11 2014-05-07 DIC Corporation Curable resin compositions, coatings, and laminated plastics including the same
JP5795199B2 (ja) 2011-06-16 2015-10-14 株式会社ダイヘン 電力変換装置及び電力変換装置の制御方法
JP2014179355A (ja) * 2011-07-04 2014-09-25 Asahi Glass Co Ltd ガラス基板の剥離方法及びその装置
US8858756B2 (en) * 2011-10-31 2014-10-14 Masahiro Lee Ultrathin wafer debonding systems
JP5977710B2 (ja) * 2013-05-10 2016-08-24 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005057046A (ja) 2003-08-04 2005-03-03 Sekisui Chem Co Ltd Ｉｃチップの製造方法及びｉｃチップの製造装置
JP2005191535A (ja) 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 貼り付け装置および貼り付け方法
JP2009289878A (ja) 2008-05-28 2009-12-10 Fujitsu Ltd 基板処理装置及び基板処理方法
US8360129B2 (en) 2009-08-31 2013-01-29 Asahi Glass Company, Limited Peeling device

Also Published As

Publication number Publication date
US9238357B2 (en) 2016-01-19
TW201448107A (zh) 2014-12-16
JP5926700B2 (ja) 2016-05-25
JP2014216632A (ja) 2014-11-17
TWI545685B (zh) 2016-08-11
KR20140130018A (ko) 2014-11-07
US20140318714A1 (en) 2014-10-30

Similar Documents

Publication Publication Date Title
KR101625730B1 (ko) 지지체 분리 장치 및 지지체 분리 방법
TWI797492B (zh) 用於接合晶片之方法及裝置
US8852391B2 (en) Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
JP4130167B2 (ja) 半導体ウエハの剥離方法
KR102050541B1 (ko) 초박막 웨이퍼의 임시 본딩을 위한 방법 및 장치
JPWO1997008745A1 (ja) 半導体ウエハの保護粘着テープの剥離方法およびその装置
KR20110035904A (ko) 보호 테이프 박리 방법 및 그 장치
TW201133580A (en) Protective tape separating method and apparatus
JP6226596B2 (ja) 支持体分離装置
US20220367273A1 (en) Element chip manufacturing method and substrate processing method
TW201539584A (zh) 構件剝離方法、構件處理方法、及用於製造半導體晶片之方法
JP2019186399A (ja) 粘着テープ剥離方法および粘着テープ剥離装置
TW202123361A (zh) 片狀黏著材剝離裝置
US10964597B2 (en) Element chip manufacturing method
JP6612588B2 (ja) 支持体分離装置及び支持体分離方法
JP6349195B2 (ja) シート剥離装置および剥離方法
KR102643527B1 (ko) 지지체 분리 장치 및 지지체 분리 방법
CN112992762A (zh) 片状粘合材料剥离装置
WO2015087763A1 (ja) 封止シート貼付け方法
WO2015087762A1 (ja) 封止シート貼付け方法
CN113953133A (zh) 片材、以及保护部件的形成方法
JP2023112862A (ja) 粘着テープ剥離方法および粘着テープ剥離装置
KR20170053565A (ko) 지지체 분리 장치 및 지지체 분리 방법

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
A302 Request for accelerated examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20190429

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000