TWI543285B - 用以使半導體晶片從箔片脫離及移除之方法 - Google Patents

用以使半導體晶片從箔片脫離及移除之方法 Download PDF

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Publication number
TWI543285B
TWI543285B TW098138052A TW98138052A TWI543285B TW I543285 B TWI543285 B TW I543285B TW 098138052 A TW098138052 A TW 098138052A TW 98138052 A TW98138052 A TW 98138052A TW I543285 B TWI543285 B TW I543285B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
foil
wafer
ejector
holder
Prior art date
Application number
TW098138052A
Other languages
English (en)
Chinese (zh)
Other versions
TW201029093A (en
Inventor
史提芬 貝勒
Original Assignee
Ｅｓｅｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｅｓｅｃ股份有限公司 filed Critical Ｅｓｅｃ股份有限公司
Publication of TW201029093A publication Critical patent/TW201029093A/zh
Application granted granted Critical
Publication of TWI543285B publication Critical patent/TWI543285B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7622—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW098138052A 2008-11-12 2009-11-10 用以使半導體晶片從箔片脫離及移除之方法 TWI543285B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11376108P 2008-11-12 2008-11-12

Publications (2)

Publication Number Publication Date
TW201029093A TW201029093A (en) 2010-08-01
TWI543285B true TWI543285B (zh) 2016-07-21

Family

ID=41381913

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098138052A TWI543285B (zh) 2008-11-12 2009-11-10 用以使半導體晶片從箔片脫離及移除之方法

Country Status (8)

Country Link
US (1) US8715457B2 (https=)
EP (1) EP2359398B1 (https=)
JP (1) JP2012508460A (https=)
KR (1) KR20110086698A (https=)
CN (1) CN102217052B (https=)
MY (1) MY155371A (https=)
TW (1) TWI543285B (https=)
WO (1) WO2010054957A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230163010A1 (en) * 2018-07-30 2023-05-25 Ulvac Techno, Ltd. Substrate Lifting Apparatus and Substrate Transferring Method

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101397750B1 (ko) * 2012-07-25 2014-05-21 삼성전기주식회사 칩 이젝터 및 이를 이용한 칩 탈착 방법
JP2019029650A (ja) * 2017-07-26 2019-02-21 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置、半導体チップの実装装置および実装方法
CN107539596A (zh) * 2017-09-29 2018-01-05 常熟市荣达电子有限责任公司 一种芯片包装盒及其操作方法
CH715447B1 (de) * 2018-10-15 2022-01-14 Besi Switzerland Ag Chip-Auswerfer.
CN111341717B (zh) * 2020-03-10 2023-02-07 长江存储科技有限责任公司 一种拾取装置和拾取方法
US12394642B2 (en) * 2021-07-30 2025-08-19 Micraft System Plus Co., Ltd. Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel
JP7660459B2 (ja) * 2021-08-05 2025-04-11 東京エレクトロン株式会社 接合装置および接合方法
WO2026017270A1 (en) * 2024-07-19 2026-01-22 Nexperia B.V. Apparatus and method for separating an electronics component from a flexible, adhesive film

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6415000A (en) * 1987-07-09 1989-01-19 Sumitomo Electric Industries Chip packaging device
US4921564A (en) * 1988-05-23 1990-05-01 Semiconductor Equipment Corp. Method and apparatus for removing circuit chips from wafer handling tape
JPH05283506A (ja) 1992-04-01 1993-10-29 Sharp Corp チップ突き上げ装置
JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP3209736B2 (ja) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置
JP4482243B2 (ja) * 2001-03-13 2010-06-16 株式会社新川 ダイのピックアップ方法及びピックアップ装置
TW567574B (en) * 2001-12-05 2003-12-21 Esec Trading Sa Apparatus for mounting semiconductor chips
TWI225279B (en) * 2002-03-11 2004-12-11 Hitachi Ltd Semiconductor device and its manufacturing method
AU2003249592A1 (en) * 2002-07-17 2004-02-02 Matsushita Electric Industrial Co., Ltd Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
US20040105750A1 (en) * 2002-11-29 2004-06-03 Esec Trading Sa, A Swiss Corporation Method for picking semiconductor chips from a foil
EP1424722A1 (de) 2002-11-29 2004-06-02 Esec Trading S.A. Verfahren zum Aufnehmen von Halbleiterchips von einer Folie und Vorrichtung
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
EP1587138B1 (de) * 2004-04-13 2007-05-30 Oerlikon Assembly Equipment AG, Steinhausen Einrichtung für die Montage von Halbleiterchips und Verfahren zum Ablösen eines Halbleiterchips von einer Folie
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment
CH697213A5 (de) 2004-05-19 2008-06-25 Alphasem Ag Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils.
JP2006005030A (ja) * 2004-06-16 2006-01-05 Matsushita Electric Ind Co Ltd 半導体チップのピックアップ方法および装置
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
US20070158024A1 (en) * 2006-01-11 2007-07-12 Symbol Technologies, Inc. Methods and systems for removing multiple die(s) from a surface
JPWO2008004270A1 (ja) 2006-07-03 2009-12-03 キヤノンマシナリー株式会社 ピックアップ方法およびピックアップ装置
CN101511539B (zh) 2006-09-12 2012-08-22 株式会社荏原制作所 研磨装置及研磨方法
JP4755634B2 (ja) 2006-09-29 2011-08-24 東レエンジニアリング株式会社 ピックアップ装置及びピックアップ方法
US7665204B2 (en) * 2006-10-16 2010-02-23 Asm Assembly Automation Ltd. Die detachment apparatus comprising pre-peeling structure
US8221583B2 (en) * 2007-01-20 2012-07-17 Stats Chippac Ltd. System for peeling semiconductor chips from tape
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
WO2009047214A2 (en) * 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
CN102044404B (zh) * 2009-10-12 2015-12-09 桑迪士克科技公司 用于使经切分的半导体裸片与裸片贴胶带分离的系统

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230163010A1 (en) * 2018-07-30 2023-05-25 Ulvac Techno, Ltd. Substrate Lifting Apparatus and Substrate Transferring Method
US12020967B2 (en) * 2018-07-30 2024-06-25 Ulvac Techno, Ltd. Substrate lifting apparatus and substrate transferring method

Also Published As

Publication number Publication date
CN102217052B (zh) 2013-09-25
CN102217052A (zh) 2011-10-12
KR20110086698A (ko) 2011-07-29
EP2359398B1 (de) 2017-05-10
US20110214819A1 (en) 2011-09-08
WO2010054957A1 (de) 2010-05-20
EP2359398A1 (de) 2011-08-24
TW201029093A (en) 2010-08-01
MY155371A (en) 2015-10-15
JP2012508460A (ja) 2012-04-05
US8715457B2 (en) 2014-05-06

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