CN102217052B - 用于将半导体芯片从薄膜处揭下和移除的方法 - Google Patents

用于将半导体芯片从薄膜处揭下和移除的方法 Download PDF

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Publication number
CN102217052B
CN102217052B CN200980145287.4A CN200980145287A CN102217052B CN 102217052 B CN102217052 B CN 102217052B CN 200980145287 A CN200980145287 A CN 200980145287A CN 102217052 B CN102217052 B CN 102217052B
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semiconductor chip
chip
film
gripper
pusher
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CN200980145287.4A
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English (en)
Chinese (zh)
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CN102217052A (zh
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斯特凡·贝勒尔
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Besi Switzerland AG
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Esec AG
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7622—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN200980145287.4A 2008-11-12 2009-11-03 用于将半导体芯片从薄膜处揭下和移除的方法 Active CN102217052B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11376108P 2008-11-12 2008-11-12
US61/113,761 2008-11-12
PCT/EP2009/064535 WO2010054957A1 (de) 2008-11-12 2009-11-03 Verfahren zum ablösen und entnehmen eines halbleiterchips von einer folie

Publications (2)

Publication Number Publication Date
CN102217052A CN102217052A (zh) 2011-10-12
CN102217052B true CN102217052B (zh) 2013-09-25

Family

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Application Number Title Priority Date Filing Date
CN200980145287.4A Active CN102217052B (zh) 2008-11-12 2009-11-03 用于将半导体芯片从薄膜处揭下和移除的方法

Country Status (8)

Country Link
US (1) US8715457B2 (https=)
EP (1) EP2359398B1 (https=)
JP (1) JP2012508460A (https=)
KR (1) KR20110086698A (https=)
CN (1) CN102217052B (https=)
MY (1) MY155371A (https=)
TW (1) TWI543285B (https=)
WO (1) WO2010054957A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101397750B1 (ko) * 2012-07-25 2014-05-21 삼성전기주식회사 칩 이젝터 및 이를 이용한 칩 탈착 방법
JP2019029650A (ja) * 2017-07-26 2019-02-21 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置、半導体チップの実装装置および実装方法
CN107539596A (zh) * 2017-09-29 2018-01-05 常熟市荣达电子有限责任公司 一种芯片包装盒及其操作方法
JP7111816B2 (ja) * 2018-07-30 2022-08-02 アルバックテクノ株式会社 基板リフト装置及び基板搬送方法
CH715447B1 (de) * 2018-10-15 2022-01-14 Besi Switzerland Ag Chip-Auswerfer.
CN111341717B (zh) * 2020-03-10 2023-02-07 长江存储科技有限责任公司 一种拾取装置和拾取方法
US12394642B2 (en) * 2021-07-30 2025-08-19 Micraft System Plus Co., Ltd. Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel
JP7660459B2 (ja) * 2021-08-05 2025-04-11 東京エレクトロン株式会社 接合装置および接合方法
WO2026017270A1 (en) * 2024-07-19 2026-01-22 Nexperia B.V. Apparatus and method for separating an electronics component from a flexible, adhesive film

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US6561743B1 (en) * 1999-11-09 2003-05-13 Nec Machinery Corporation Pellet picking method and pellet picking apparatus
CN1669119A (zh) * 2002-07-17 2005-09-14 松下电器产业株式会社 拾取半导体芯片的方法和设备及为此使用的吸引和剥落工具
US20050224965A1 (en) * 2004-04-13 2005-10-13 Unaxis International Trading Ltd Method for detaching a semiconductor chip from a foil and apparatus for mounting semiconductor chips
US20080173407A1 (en) * 2007-01-20 2008-07-24 Gab Yong Min System for peeling semiconductor chips from tape

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JPS6415000A (en) * 1987-07-09 1989-01-19 Sumitomo Electric Industries Chip packaging device
US4921564A (en) * 1988-05-23 1990-05-01 Semiconductor Equipment Corp. Method and apparatus for removing circuit chips from wafer handling tape
JPH05283506A (ja) 1992-04-01 1993-10-29 Sharp Corp チップ突き上げ装置
JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP4482243B2 (ja) * 2001-03-13 2010-06-16 株式会社新川 ダイのピックアップ方法及びピックアップ装置
TW567574B (en) * 2001-12-05 2003-12-21 Esec Trading Sa Apparatus for mounting semiconductor chips
TWI225279B (en) * 2002-03-11 2004-12-11 Hitachi Ltd Semiconductor device and its manufacturing method
US20040105750A1 (en) * 2002-11-29 2004-06-03 Esec Trading Sa, A Swiss Corporation Method for picking semiconductor chips from a foil
EP1424722A1 (de) 2002-11-29 2004-06-02 Esec Trading S.A. Verfahren zum Aufnehmen von Halbleiterchips von einer Folie und Vorrichtung
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment
CH697213A5 (de) 2004-05-19 2008-06-25 Alphasem Ag Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils.
JP2006005030A (ja) * 2004-06-16 2006-01-05 Matsushita Electric Ind Co Ltd 半導体チップのピックアップ方法および装置
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JP4755634B2 (ja) 2006-09-29 2011-08-24 東レエンジニアリング株式会社 ピックアップ装置及びピックアップ方法
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JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
WO2009047214A2 (en) * 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
CN102044404B (zh) * 2009-10-12 2015-12-09 桑迪士克科技公司 用于使经切分的半导体裸片与裸片贴胶带分离的系统

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US6561743B1 (en) * 1999-11-09 2003-05-13 Nec Machinery Corporation Pellet picking method and pellet picking apparatus
CN1669119A (zh) * 2002-07-17 2005-09-14 松下电器产业株式会社 拾取半导体芯片的方法和设备及为此使用的吸引和剥落工具
US20050224965A1 (en) * 2004-04-13 2005-10-13 Unaxis International Trading Ltd Method for detaching a semiconductor chip from a foil and apparatus for mounting semiconductor chips
US20080173407A1 (en) * 2007-01-20 2008-07-24 Gab Yong Min System for peeling semiconductor chips from tape

Also Published As

Publication number Publication date
CN102217052A (zh) 2011-10-12
KR20110086698A (ko) 2011-07-29
EP2359398B1 (de) 2017-05-10
US20110214819A1 (en) 2011-09-08
WO2010054957A1 (de) 2010-05-20
EP2359398A1 (de) 2011-08-24
TW201029093A (en) 2010-08-01
MY155371A (en) 2015-10-15
JP2012508460A (ja) 2012-04-05
US8715457B2 (en) 2014-05-06
TWI543285B (zh) 2016-07-21

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