TWI538044B - 用來清洗基板處理裝置的清洗治具及清洗方法、與基板處理系統 - Google Patents
用來清洗基板處理裝置的清洗治具及清洗方法、與基板處理系統 Download PDFInfo
- Publication number
- TWI538044B TWI538044B TW102147778A TW102147778A TWI538044B TW I538044 B TWI538044 B TW I538044B TW 102147778 A TW102147778 A TW 102147778A TW 102147778 A TW102147778 A TW 102147778A TW I538044 B TWI538044 B TW I538044B
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- substrate
- liquid
- lower member
- substrate processing
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims description 204
- 239000000758 substrate Substances 0.000 title claims description 190
- 238000000034 method Methods 0.000 title claims description 21
- 239000007788 liquid Substances 0.000 claims description 106
- 230000002093 peripheral effect Effects 0.000 claims description 35
- 239000000470 constituent Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 description 38
- 239000000047 product Substances 0.000 description 26
- 239000007789 gas Substances 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 12
- 238000003860 storage Methods 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000012530 fluid Substances 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 4
- 239000003595 mist Substances 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012288286A JP5996425B2 (ja) | 2012-12-28 | 2012-12-28 | 基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201442100A TW201442100A (zh) | 2014-11-01 |
| TWI538044B true TWI538044B (zh) | 2016-06-11 |
Family
ID=51015748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102147778A TWI538044B (zh) | 2012-12-28 | 2013-12-23 | 用來清洗基板處理裝置的清洗治具及清洗方法、與基板處理系統 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9508567B2 (enExample) |
| JP (1) | JP5996425B2 (enExample) |
| KR (2) | KR101882033B1 (enExample) |
| TW (1) | TWI538044B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105695936B (zh) * | 2014-11-26 | 2018-11-06 | 北京北方华创微电子装备有限公司 | 预清洗腔室及等离子体加工设备 |
| JP6512974B2 (ja) * | 2015-07-14 | 2019-05-15 | 東京エレクトロン株式会社 | 基板処理装置 |
| US9895711B2 (en) * | 2015-02-03 | 2018-02-20 | Tokyo Electron Limited | Substrate liquid processing apparatus, substrate liquid processing method and substrate processing apparatus |
| JP6395673B2 (ja) * | 2015-07-14 | 2018-09-26 | 東京エレクトロン株式会社 | 基板処理装置 |
| US20170084470A1 (en) * | 2015-09-18 | 2017-03-23 | Tokyo Electron Limited | Substrate processing apparatus and cleaning method of processing chamber |
| JP6665042B2 (ja) | 2016-06-21 | 2020-03-13 | 東京エレクトロン株式会社 | 基板処理装置、基板処理装置の洗浄方法及び記憶媒体 |
| CN110021535A (zh) * | 2018-01-10 | 2019-07-16 | 弘塑科技股份有限公司 | 基板处理装置及其旋转台 |
| TWI685045B (zh) * | 2018-01-10 | 2020-02-11 | 弘塑科技股份有限公司 | 基板處理裝置及其旋轉台 |
| KR102072999B1 (ko) * | 2018-08-21 | 2020-02-04 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| CN109065484B (zh) * | 2018-08-24 | 2024-05-28 | 宁波润华全芯微电子设备有限公司 | 一种用于去杂质的中空主轴结构 |
| JP7034880B2 (ja) * | 2018-10-05 | 2022-03-14 | 株式会社荏原製作所 | 洗浄装置、これを備えためっき装置、及び洗浄方法 |
| CN110129868B (zh) * | 2019-05-23 | 2021-08-03 | 冠礼控制科技（上海）有限公司 | 一种半导体晶圆电镀夹具 |
| KR102556992B1 (ko) | 2020-09-10 | 2023-07-20 | 세메스 주식회사 | 세정 지그, 이를 포함하는 기판 처리 장치, 그리고 기판 처리 장치의 세정 방법 |
| KR102612183B1 (ko) * | 2020-09-29 | 2023-12-13 | 세메스 주식회사 | 처리 용기 및 액처리 장치 |
| CN112593208B (zh) * | 2020-11-25 | 2022-01-11 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
| KR102634281B1 (ko) * | 2020-12-21 | 2024-02-07 | 세메스 주식회사 | 기판 처리 장치 |
| US20240066561A1 (en) * | 2021-01-19 | 2024-02-29 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
| KR20220158515A (ko) * | 2021-05-24 | 2022-12-01 | 에이디알씨 주식회사 | 스프레이 코터 및 이를 이용하여 제조된 박막 트랜지스터 |
| KR102873045B1 (ko) | 2021-06-07 | 2025-10-21 | 삼성전자주식회사 | 보울 세정 장치 및 이를 포함하는 pr 코팅 시스템 |
| KR102584570B1 (ko) * | 2021-12-31 | 2023-10-05 | 세메스 주식회사 | 기판 처리 장치 및 비산 저감 방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3414916B2 (ja) * | 1996-02-27 | 2003-06-09 | 大日本スクリーン製造株式会社 | 基板処理装置および方法 |
| JPH10154679A (ja) * | 1996-11-25 | 1998-06-09 | Hitachi Ltd | 基板洗浄装置 |
| JP3587723B2 (ja) | 1999-04-30 | 2004-11-10 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP4990174B2 (ja) * | 2008-02-04 | 2012-08-01 | 東京エレクトロン株式会社 | 基板処理装置 |
| CN101620384B (zh) * | 2008-07-04 | 2011-08-17 | 中芯国际集成电路制造(上海)有限公司 | 配置成从顶部和底部接收流体的光刻胶工具的清洗制具 |
| JP2010016315A (ja) * | 2008-07-07 | 2010-01-21 | Tokyo Electron Ltd | 回転塗布装置の洗浄用治具および洗浄方法 |
| JP5122426B2 (ja) * | 2008-12-08 | 2013-01-16 | 東京エレクトロン株式会社 | 液処理方法、液処理装置および記憶媒体 |
-
2012
- 2012-12-28 JP JP2012288286A patent/JP5996425B2/ja active Active
-
2013
- 2013-12-10 US US14/101,583 patent/US9508567B2/en active Active
- 2013-12-16 KR KR1020130156345A patent/KR101882033B1/ko active Active
- 2013-12-23 TW TW102147778A patent/TWI538044B/zh active
-
2017
- 2017-12-07 KR KR1020170167469A patent/KR20170142136A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170142136A (ko) | 2017-12-27 |
| US20140182631A1 (en) | 2014-07-03 |
| JP5996425B2 (ja) | 2016-09-21 |
| TW201442100A (zh) | 2014-11-01 |
| KR101882033B1 (ko) | 2018-07-25 |
| JP2014130935A (ja) | 2014-07-10 |
| KR20140086837A (ko) | 2014-07-08 |
| US9508567B2 (en) | 2016-11-29 |
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