TWI538044B - 用來清洗基板處理裝置的清洗治具及清洗方法、與基板處理系統 - Google Patents

用來清洗基板處理裝置的清洗治具及清洗方法、與基板處理系統 Download PDF

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Publication number
TWI538044B
TWI538044B TW102147778A TW102147778A TWI538044B TW I538044 B TWI538044 B TW I538044B TW 102147778 A TW102147778 A TW 102147778A TW 102147778 A TW102147778 A TW 102147778A TW I538044 B TWI538044 B TW I538044B
Authority
TW
Taiwan
Prior art keywords
cleaning
substrate
liquid
lower member
substrate processing
Prior art date
Application number
TW102147778A
Other languages
English (en)
Chinese (zh)
Other versions
TW201442100A (zh
Inventor
難波宏光
Original Assignee
東京威力科創股份有限公司
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Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201442100A publication Critical patent/TW201442100A/zh
Application granted granted Critical
Publication of TWI538044B publication Critical patent/TWI538044B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW102147778A 2012-12-28 2013-12-23 用來清洗基板處理裝置的清洗治具及清洗方法、與基板處理系統 TWI538044B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012288286A JP5996425B2 (ja) 2012-12-28 2012-12-28 基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム

Publications (2)

Publication Number Publication Date
TW201442100A TW201442100A (zh) 2014-11-01
TWI538044B true TWI538044B (zh) 2016-06-11

Family

ID=51015748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102147778A TWI538044B (zh) 2012-12-28 2013-12-23 用來清洗基板處理裝置的清洗治具及清洗方法、與基板處理系統

Country Status (4)

Country Link
US (1) US9508567B2 (enExample)
JP (1) JP5996425B2 (enExample)
KR (2) KR101882033B1 (enExample)
TW (1) TWI538044B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105695936B (zh) * 2014-11-26 2018-11-06 北京北方华创微电子装备有限公司 预清洗腔室及等离子体加工设备
US9895711B2 (en) * 2015-02-03 2018-02-20 Tokyo Electron Limited Substrate liquid processing apparatus, substrate liquid processing method and substrate processing apparatus
JP6512974B2 (ja) * 2015-07-14 2019-05-15 東京エレクトロン株式会社 基板処理装置
JP6395673B2 (ja) * 2015-07-14 2018-09-26 東京エレクトロン株式会社 基板処理装置
US20170084470A1 (en) * 2015-09-18 2017-03-23 Tokyo Electron Limited Substrate processing apparatus and cleaning method of processing chamber
JP6665042B2 (ja) 2016-06-21 2020-03-13 東京エレクトロン株式会社 基板処理装置、基板処理装置の洗浄方法及び記憶媒体
TWI685045B (zh) * 2018-01-10 2020-02-11 弘塑科技股份有限公司 基板處理裝置及其旋轉台
CN110021535A (zh) * 2018-01-10 2019-07-16 弘塑科技股份有限公司 基板处理装置及其旋转台
KR102072999B1 (ko) * 2018-08-21 2020-02-04 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN109065484B (zh) * 2018-08-24 2024-05-28 宁波润华全芯微电子设备有限公司 一种用于去杂质的中空主轴结构
JP7034880B2 (ja) * 2018-10-05 2022-03-14 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
CN110129868B (zh) * 2019-05-23 2021-08-03 冠礼控制科技（上海）有限公司 一种半导体晶圆电镀夹具
KR102556992B1 (ko) 2020-09-10 2023-07-20 세메스 주식회사 세정 지그, 이를 포함하는 기판 처리 장치, 그리고 기판 처리 장치의 세정 방법
KR102612183B1 (ko) * 2020-09-29 2023-12-13 세메스 주식회사 처리 용기 및 액처리 장치
CN112593208B (zh) * 2020-11-25 2022-01-11 北京北方华创微电子装备有限公司 半导体工艺设备
KR102634281B1 (ko) * 2020-12-21 2024-02-07 세메스 주식회사 기판 처리 장치
US12564868B2 (en) 2021-01-19 2026-03-03 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR20220158515A (ko) * 2021-05-24 2022-12-01 에이디알씨 주식회사 스프레이 코터 및 이를 이용하여 제조된 박막 트랜지스터
KR102873045B1 (ko) 2021-06-07 2025-10-21 삼성전자주식회사 보울 세정 장치 및 이를 포함하는 pr 코팅 시스템
KR102584570B1 (ko) * 2021-12-31 2023-10-05 세메스 주식회사 기판 처리 장치 및 비산 저감 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3414916B2 (ja) * 1996-02-27 2003-06-09 大日本スクリーン製造株式会社 基板処理装置および方法
JPH10154679A (ja) * 1996-11-25 1998-06-09 Hitachi Ltd 基板洗浄装置
JP3587723B2 (ja) 1999-04-30 2004-11-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4990174B2 (ja) * 2008-02-04 2012-08-01 東京エレクトロン株式会社 基板処理装置
CN101620384B (zh) * 2008-07-04 2011-08-17 中芯国际集成电路制造(上海)有限公司 配置成从顶部和底部接收流体的光刻胶工具的清洗制具
JP2010016315A (ja) * 2008-07-07 2010-01-21 Tokyo Electron Ltd 回転塗布装置の洗浄用治具および洗浄方法
JP5122426B2 (ja) * 2008-12-08 2013-01-16 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体

Also Published As

Publication number Publication date
JP2014130935A (ja) 2014-07-10
JP5996425B2 (ja) 2016-09-21
TW201442100A (zh) 2014-11-01
KR20140086837A (ko) 2014-07-08
KR101882033B1 (ko) 2018-07-25
US9508567B2 (en) 2016-11-29
KR20170142136A (ko) 2017-12-27
US20140182631A1 (en) 2014-07-03

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