KR101882033B1 - 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템 - Google Patents

기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템 Download PDF

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Publication number
KR101882033B1
KR101882033B1 KR1020130156345A KR20130156345A KR101882033B1 KR 101882033 B1 KR101882033 B1 KR 101882033B1 KR 1020130156345 A KR1020130156345 A KR 1020130156345A KR 20130156345 A KR20130156345 A KR 20130156345A KR 101882033 B1 KR101882033 B1 KR 101882033B1
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South Korea
Prior art keywords
cleaning
substrate processing
processing apparatus
jig
processing system
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KR1020130156345A
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English (en)
Korean (ko)
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KR20140086837A (ko
Inventor
히로미츠 남바
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
KR1020130156345A 2012-12-28 2013-12-16 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템 Active KR101882033B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-288286 2012-12-28
JP2012288286A JP5996425B2 (ja) 2012-12-28 2012-12-28 基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020170167469A Division KR20170142136A (ko) 2012-12-28 2017-12-07 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템

Publications (2)

Publication Number Publication Date
KR20140086837A KR20140086837A (ko) 2014-07-08
KR101882033B1 true KR101882033B1 (ko) 2018-07-25

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130156345A Active KR101882033B1 (ko) 2012-12-28 2013-12-16 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템
KR1020170167469A Ceased KR20170142136A (ko) 2012-12-28 2017-12-07 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020170167469A Ceased KR20170142136A (ko) 2012-12-28 2017-12-07 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템

Country Status (4)

Country Link
US (1) US9508567B2 (enExample)
JP (1) JP5996425B2 (enExample)
KR (2) KR101882033B1 (enExample)
TW (1) TWI538044B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12055866B2 (en) 2020-09-10 2024-08-06 Semes Co., Ltd. Cleaning jig, substrate treating apparatus including the same, cleaning method of substrate treating apparatus

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
CN105695936B (zh) * 2014-11-26 2018-11-06 北京北方华创微电子装备有限公司 预清洗腔室及等离子体加工设备
US9895711B2 (en) * 2015-02-03 2018-02-20 Tokyo Electron Limited Substrate liquid processing apparatus, substrate liquid processing method and substrate processing apparatus
JP6512974B2 (ja) * 2015-07-14 2019-05-15 東京エレクトロン株式会社 基板処理装置
JP6395673B2 (ja) * 2015-07-14 2018-09-26 東京エレクトロン株式会社 基板処理装置
US20170084470A1 (en) * 2015-09-18 2017-03-23 Tokyo Electron Limited Substrate processing apparatus and cleaning method of processing chamber
JP6665042B2 (ja) 2016-06-21 2020-03-13 東京エレクトロン株式会社 基板処理装置、基板処理装置の洗浄方法及び記憶媒体
TWI685045B (zh) * 2018-01-10 2020-02-11 弘塑科技股份有限公司 基板處理裝置及其旋轉台
CN110021535A (zh) * 2018-01-10 2019-07-16 弘塑科技股份有限公司 基板处理装置及其旋转台
KR102072999B1 (ko) * 2018-08-21 2020-02-04 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN109065484B (zh) * 2018-08-24 2024-05-28 宁波润华全芯微电子设备有限公司 一种用于去杂质的中空主轴结构
JP7034880B2 (ja) * 2018-10-05 2022-03-14 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
CN110129868B (zh) * 2019-05-23 2021-08-03 冠礼控制科技（上海）有限公司 一种半导体晶圆电镀夹具
KR102612183B1 (ko) * 2020-09-29 2023-12-13 세메스 주식회사 처리 용기 및 액처리 장치
CN112593208B (zh) * 2020-11-25 2022-01-11 北京北方华创微电子装备有限公司 半导体工艺设备
KR102634281B1 (ko) * 2020-12-21 2024-02-07 세메스 주식회사 기판 처리 장치
US12564868B2 (en) 2021-01-19 2026-03-03 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR20220158515A (ko) * 2021-05-24 2022-12-01 에이디알씨 주식회사 스프레이 코터 및 이를 이용하여 제조된 박막 트랜지스터
KR102873045B1 (ko) 2021-06-07 2025-10-21 삼성전자주식회사 보울 세정 장치 및 이를 포함하는 pr 코팅 시스템
KR102584570B1 (ko) * 2021-12-31 2023-10-05 세메스 주식회사 기판 처리 장치 및 비산 저감 방법

Citations (1)

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US20110000509A1 (en) 2008-07-04 2011-01-06 Semiconductor Manufacturing International (Shanghai Corporation) Photoresist tool cleaning jig configured to receive flow from top and bottom

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JP3414916B2 (ja) * 1996-02-27 2003-06-09 大日本スクリーン製造株式会社 基板処理装置および方法
JPH10154679A (ja) * 1996-11-25 1998-06-09 Hitachi Ltd 基板洗浄装置
JP3587723B2 (ja) 1999-04-30 2004-11-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4990174B2 (ja) * 2008-02-04 2012-08-01 東京エレクトロン株式会社 基板処理装置
JP2010016315A (ja) * 2008-07-07 2010-01-21 Tokyo Electron Ltd 回転塗布装置の洗浄用治具および洗浄方法
JP5122426B2 (ja) * 2008-12-08 2013-01-16 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110000509A1 (en) 2008-07-04 2011-01-06 Semiconductor Manufacturing International (Shanghai Corporation) Photoresist tool cleaning jig configured to receive flow from top and bottom

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12055866B2 (en) 2020-09-10 2024-08-06 Semes Co., Ltd. Cleaning jig, substrate treating apparatus including the same, cleaning method of substrate treating apparatus

Also Published As

Publication number Publication date
JP2014130935A (ja) 2014-07-10
JP5996425B2 (ja) 2016-09-21
TW201442100A (zh) 2014-11-01
KR20140086837A (ko) 2014-07-08
US9508567B2 (en) 2016-11-29
KR20170142136A (ko) 2017-12-27
TWI538044B (zh) 2016-06-11
US20140182631A1 (en) 2014-07-03

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