JP5996425B2 - 基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム - Google Patents

基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム Download PDF

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Publication number
JP5996425B2
JP5996425B2 JP2012288286A JP2012288286A JP5996425B2 JP 5996425 B2 JP5996425 B2 JP 5996425B2 JP 2012288286 A JP2012288286 A JP 2012288286A JP 2012288286 A JP2012288286 A JP 2012288286A JP 5996425 B2 JP5996425 B2 JP 5996425B2
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Japan
Prior art keywords
cleaning
substrate
processing apparatus
jig
substrate processing
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JP2012288286A
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Japanese (ja)
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JP2014130935A5 (enExample
JP2014130935A (ja
Inventor
波 宏 光 難
波 宏 光 難
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012288286A priority Critical patent/JP5996425B2/ja
Priority to US14/101,583 priority patent/US9508567B2/en
Priority to KR1020130156345A priority patent/KR101882033B1/ko
Priority to TW102147778A priority patent/TWI538044B/zh
Publication of JP2014130935A publication Critical patent/JP2014130935A/ja
Publication of JP2014130935A5 publication Critical patent/JP2014130935A5/ja
Application granted granted Critical
Publication of JP5996425B2 publication Critical patent/JP5996425B2/ja
Priority to KR1020170167469A priority patent/KR20170142136A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2012288286A 2012-12-28 2012-12-28 基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム Active JP5996425B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012288286A JP5996425B2 (ja) 2012-12-28 2012-12-28 基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム
US14/101,583 US9508567B2 (en) 2012-12-28 2013-12-10 Cleaning jig and cleaning method for cleaning substrate processing apparatus, and substrate processing system
KR1020130156345A KR101882033B1 (ko) 2012-12-28 2013-12-16 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템
TW102147778A TWI538044B (zh) 2012-12-28 2013-12-23 用來清洗基板處理裝置的清洗治具及清洗方法、與基板處理系統
KR1020170167469A KR20170142136A (ko) 2012-12-28 2017-12-07 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012288286A JP5996425B2 (ja) 2012-12-28 2012-12-28 基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム

Publications (3)

Publication Number Publication Date
JP2014130935A JP2014130935A (ja) 2014-07-10
JP2014130935A5 JP2014130935A5 (enExample) 2015-04-16
JP5996425B2 true JP5996425B2 (ja) 2016-09-21

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JP2012288286A Active JP5996425B2 (ja) 2012-12-28 2012-12-28 基板処理装置を洗浄するための洗浄治具および洗浄方法、および基板処理システム

Country Status (4)

Country Link
US (1) US9508567B2 (enExample)
JP (1) JP5996425B2 (enExample)
KR (2) KR101882033B1 (enExample)
TW (1) TWI538044B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105695936B (zh) * 2014-11-26 2018-11-06 北京北方华创微电子装备有限公司 预清洗腔室及等离子体加工设备
JP6512974B2 (ja) * 2015-07-14 2019-05-15 東京エレクトロン株式会社 基板処理装置
US9895711B2 (en) * 2015-02-03 2018-02-20 Tokyo Electron Limited Substrate liquid processing apparatus, substrate liquid processing method and substrate processing apparatus
JP6395673B2 (ja) * 2015-07-14 2018-09-26 東京エレクトロン株式会社 基板処理装置
US20170084470A1 (en) * 2015-09-18 2017-03-23 Tokyo Electron Limited Substrate processing apparatus and cleaning method of processing chamber
JP6665042B2 (ja) 2016-06-21 2020-03-13 東京エレクトロン株式会社 基板処理装置、基板処理装置の洗浄方法及び記憶媒体
CN110021535A (zh) * 2018-01-10 2019-07-16 弘塑科技股份有限公司 基板处理装置及其旋转台
TWI685045B (zh) * 2018-01-10 2020-02-11 弘塑科技股份有限公司 基板處理裝置及其旋轉台
KR102072999B1 (ko) * 2018-08-21 2020-02-04 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN109065484B (zh) * 2018-08-24 2024-05-28 宁波润华全芯微电子设备有限公司 一种用于去杂质的中空主轴结构
JP7034880B2 (ja) * 2018-10-05 2022-03-14 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
CN110129868B (zh) * 2019-05-23 2021-08-03 冠礼控制科技（上海）有限公司 一种半导体晶圆电镀夹具
KR102556992B1 (ko) 2020-09-10 2023-07-20 세메스 주식회사 세정 지그, 이를 포함하는 기판 처리 장치, 그리고 기판 처리 장치의 세정 방법
KR102612183B1 (ko) * 2020-09-29 2023-12-13 세메스 주식회사 처리 용기 및 액처리 장치
CN112593208B (zh) * 2020-11-25 2022-01-11 北京北方华创微电子装备有限公司 半导体工艺设备
KR102634281B1 (ko) * 2020-12-21 2024-02-07 세메스 주식회사 기판 처리 장치
US20240066561A1 (en) * 2021-01-19 2024-02-29 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR20220158515A (ko) * 2021-05-24 2022-12-01 에이디알씨 주식회사 스프레이 코터 및 이를 이용하여 제조된 박막 트랜지스터
KR102873045B1 (ko) 2021-06-07 2025-10-21 삼성전자주식회사 보울 세정 장치 및 이를 포함하는 pr 코팅 시스템
KR102584570B1 (ko) * 2021-12-31 2023-10-05 세메스 주식회사 기판 처리 장치 및 비산 저감 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3414916B2 (ja) * 1996-02-27 2003-06-09 大日本スクリーン製造株式会社 基板処理装置および方法
JPH10154679A (ja) * 1996-11-25 1998-06-09 Hitachi Ltd 基板洗浄装置
JP3587723B2 (ja) 1999-04-30 2004-11-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4990174B2 (ja) * 2008-02-04 2012-08-01 東京エレクトロン株式会社 基板処理装置
CN101620384B (zh) * 2008-07-04 2011-08-17 中芯国际集成电路制造(上海)有限公司 配置成从顶部和底部接收流体的光刻胶工具的清洗制具
JP2010016315A (ja) * 2008-07-07 2010-01-21 Tokyo Electron Ltd 回転塗布装置の洗浄用治具および洗浄方法
JP5122426B2 (ja) * 2008-12-08 2013-01-16 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体

Also Published As

Publication number Publication date
KR20170142136A (ko) 2017-12-27
US20140182631A1 (en) 2014-07-03
TWI538044B (zh) 2016-06-11
TW201442100A (zh) 2014-11-01
KR101882033B1 (ko) 2018-07-25
JP2014130935A (ja) 2014-07-10
KR20140086837A (ko) 2014-07-08
US9508567B2 (en) 2016-11-29

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