TWI536027B - 基板檢測方法 - Google Patents

基板檢測方法 Download PDF

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Publication number
TWI536027B
TWI536027B TW103117541A TW103117541A TWI536027B TW I536027 B TWI536027 B TW I536027B TW 103117541 A TW103117541 A TW 103117541A TW 103117541 A TW103117541 A TW 103117541A TW I536027 B TWI536027 B TW I536027B
Authority
TW
Taiwan
Prior art keywords
substrate
wiring pattern
detecting
terminal
unit
Prior art date
Application number
TW103117541A
Other languages
English (en)
Chinese (zh)
Other versions
TW201445145A (zh
Inventor
山下宗寛
Original Assignee
日本電產理德股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電產理德股份有限公司 filed Critical 日本電產理德股份有限公司
Publication of TW201445145A publication Critical patent/TW201445145A/zh
Application granted granted Critical
Publication of TWI536027B publication Critical patent/TWI536027B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Environmental & Geological Engineering (AREA)
TW103117541A 2013-05-20 2014-05-19 基板檢測方法 TWI536027B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013105984A JP6182974B2 (ja) 2013-05-20 2013-05-20 基板検査方法

Publications (2)

Publication Number Publication Date
TW201445145A TW201445145A (zh) 2014-12-01
TWI536027B true TWI536027B (zh) 2016-06-01

Family

ID=51933268

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103117541A TWI536027B (zh) 2013-05-20 2014-05-19 基板檢測方法
TW105106033A TWI613451B (zh) 2013-05-20 2014-05-19 基板檢測用夾具

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105106033A TWI613451B (zh) 2013-05-20 2014-05-19 基板檢測用夾具

Country Status (5)

Country Link
JP (1) JP6182974B2 (https=)
KR (1) KR101663920B1 (https=)
CN (1) CN105209924B (https=)
TW (2) TWI536027B (https=)
WO (1) WO2014188701A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576577B (zh) * 2015-07-07 2017-04-01 All Ring Tech Co Ltd Object detection method and device
US9991699B2 (en) * 2016-05-02 2018-06-05 Microsoft Technology Licensing, Llc Enablement of device power-on with proper assembly
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5078269U (https=) * 1973-11-19 1975-07-07
JPH04102079A (ja) * 1990-08-21 1992-04-03 Fujitsu Ltd 回路基板の試験装置及びその試験方法
JPH0821867A (ja) 1994-07-06 1996-01-23 Sumitomo Electric Ind Ltd 印刷配線基板のインサ−キットテスト法
US6525526B1 (en) * 1998-02-18 2003-02-25 Luther & Maelzer Gmbh Method and device for testing printed circuit boards
JP3311698B2 (ja) * 1998-11-19 2002-08-05 オー・エイチ・ティー株式会社 回路基板の導通検査装置、導通検査方法、導通検査用治具および記録媒体
JP2002005981A (ja) * 2000-06-16 2002-01-09 Oht Inc 検査装置及び検査方法
WO2002044799A1 (en) * 2000-12-01 2002-06-06 Toppan Printing Co., Ltd. Circuit pattern detecting device and circuit pattern detecting method
KR100877243B1 (ko) * 2001-02-19 2009-01-07 니혼 덴산 리드 가부시끼가이샤 회로 기판 검사 장치 및 회로 기판을 검사하기 위한 방법
JP2004361249A (ja) * 2003-06-04 2004-12-24 Nidec-Read Corp 基板検査装置
JP4264305B2 (ja) 2003-07-11 2009-05-13 日本電産リード株式会社 基板検査装置及び基板検査方法
JP3953087B2 (ja) * 2005-10-18 2007-08-01 日本電産リード株式会社 絶縁検査装置及び絶縁検査方法
JP2007178318A (ja) * 2005-12-28 2007-07-12 Nidec-Read Corp 基板検査装置及び方法
JP4730904B2 (ja) * 2006-04-28 2011-07-20 日本電産リード株式会社 基板検査装置及び基板検査方法
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
JP4918339B2 (ja) * 2006-11-30 2012-04-18 日本電産リード株式会社 基板検査装置
JP5004010B2 (ja) * 2007-05-09 2012-08-22 日本電産リード株式会社 基板検査装置及び基板検査方法
JP4995682B2 (ja) * 2007-09-27 2012-08-08 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP2009250659A (ja) 2008-04-02 2009-10-29 Nidec-Read Corp 治具試験装置及び治具試験方法
JP2010122202A (ja) * 2008-10-23 2010-06-03 Nidec-Read Corp 基板検査治具及びそれを備える基板検査装置
JP5208701B2 (ja) * 2008-12-04 2013-06-12 日置電機株式会社 絶縁検査方法および絶縁検査装置
JP5629545B2 (ja) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス プローブカード及び検査装置
WO2013012616A2 (en) * 2011-07-15 2013-01-24 Orbotech Ltd. Electrical inspection of electronic devices using electron-beam induced plasma probes
JP6069884B2 (ja) * 2012-05-08 2017-02-01 日本電産リード株式会社 絶縁検査方法及び絶縁検査装置

Also Published As

Publication number Publication date
TWI613451B (zh) 2018-02-01
KR20150130506A (ko) 2015-11-23
WO2014188701A1 (en) 2014-11-27
CN105209924B (zh) 2018-11-20
TW201627676A (zh) 2016-08-01
CN105209924A (zh) 2015-12-30
JP6182974B2 (ja) 2017-08-23
KR101663920B1 (ko) 2016-10-07
JP2014228301A (ja) 2014-12-08
TW201445145A (zh) 2014-12-01

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