KR101663920B1 - 기판 검사 방법 및 기판 검사용 지그 - Google Patents

기판 검사 방법 및 기판 검사용 지그 Download PDF

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Publication number
KR101663920B1
KR101663920B1 KR1020157029036A KR20157029036A KR101663920B1 KR 101663920 B1 KR101663920 B1 KR 101663920B1 KR 1020157029036 A KR1020157029036 A KR 1020157029036A KR 20157029036 A KR20157029036 A KR 20157029036A KR 101663920 B1 KR101663920 B1 KR 101663920B1
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South Korea
Prior art keywords
wiring pattern
substrate
terminal
inspection
wiring
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KR1020157029036A
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English (en)
Korean (ko)
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KR20150130506A (ko
Inventor
무네히로 야마시타
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니혼덴산리드가부시키가이샤
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Publication of KR20150130506A publication Critical patent/KR20150130506A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G01R31/02—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • H01L22/20—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Environmental & Geological Engineering (AREA)
KR1020157029036A 2013-05-20 2014-05-19 기판 검사 방법 및 기판 검사용 지그 Active KR101663920B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013105984A JP6182974B2 (ja) 2013-05-20 2013-05-20 基板検査方法
JPJP-P-2013-105984 2013-05-20
PCT/JP2014/002631 WO2014188701A1 (en) 2013-05-20 2014-05-19 Board inspection method

Publications (2)

Publication Number Publication Date
KR20150130506A KR20150130506A (ko) 2015-11-23
KR101663920B1 true KR101663920B1 (ko) 2016-10-07

Family

ID=51933268

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157029036A Active KR101663920B1 (ko) 2013-05-20 2014-05-19 기판 검사 방법 및 기판 검사용 지그

Country Status (5)

Country Link
JP (1) JP6182974B2 (https=)
KR (1) KR101663920B1 (https=)
CN (1) CN105209924B (https=)
TW (2) TWI536027B (https=)
WO (1) WO2014188701A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576577B (zh) * 2015-07-07 2017-04-01 All Ring Tech Co Ltd Object detection method and device
US9991699B2 (en) * 2016-05-02 2018-06-05 Microsoft Technology Licensing, Llc Enablement of device power-on with proper assembly
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004361249A (ja) * 2003-06-04 2004-12-24 Nidec-Read Corp 基板検査装置
JP2005030882A (ja) 2003-07-11 2005-02-03 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2009250659A (ja) 2008-04-02 2009-10-29 Nidec-Read Corp 治具試験装置及び治具試験方法

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
JPS5078269U (https=) * 1973-11-19 1975-07-07
JPH04102079A (ja) * 1990-08-21 1992-04-03 Fujitsu Ltd 回路基板の試験装置及びその試験方法
JPH0821867A (ja) 1994-07-06 1996-01-23 Sumitomo Electric Ind Ltd 印刷配線基板のインサ−キットテスト法
US6525526B1 (en) * 1998-02-18 2003-02-25 Luther & Maelzer Gmbh Method and device for testing printed circuit boards
JP3311698B2 (ja) * 1998-11-19 2002-08-05 オー・エイチ・ティー株式会社 回路基板の導通検査装置、導通検査方法、導通検査用治具および記録媒体
JP2002005981A (ja) * 2000-06-16 2002-01-09 Oht Inc 検査装置及び検査方法
WO2002044799A1 (en) * 2000-12-01 2002-06-06 Toppan Printing Co., Ltd. Circuit pattern detecting device and circuit pattern detecting method
KR100877243B1 (ko) * 2001-02-19 2009-01-07 니혼 덴산 리드 가부시끼가이샤 회로 기판 검사 장치 및 회로 기판을 검사하기 위한 방법
JP3953087B2 (ja) * 2005-10-18 2007-08-01 日本電産リード株式会社 絶縁検査装置及び絶縁検査方法
JP2007178318A (ja) * 2005-12-28 2007-07-12 Nidec-Read Corp 基板検査装置及び方法
JP4730904B2 (ja) * 2006-04-28 2011-07-20 日本電産リード株式会社 基板検査装置及び基板検査方法
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
JP4918339B2 (ja) * 2006-11-30 2012-04-18 日本電産リード株式会社 基板検査装置
JP5004010B2 (ja) * 2007-05-09 2012-08-22 日本電産リード株式会社 基板検査装置及び基板検査方法
JP4995682B2 (ja) * 2007-09-27 2012-08-08 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP2010122202A (ja) * 2008-10-23 2010-06-03 Nidec-Read Corp 基板検査治具及びそれを備える基板検査装置
JP5208701B2 (ja) * 2008-12-04 2013-06-12 日置電機株式会社 絶縁検査方法および絶縁検査装置
JP5629545B2 (ja) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス プローブカード及び検査装置
WO2013012616A2 (en) * 2011-07-15 2013-01-24 Orbotech Ltd. Electrical inspection of electronic devices using electron-beam induced plasma probes
JP6069884B2 (ja) * 2012-05-08 2017-02-01 日本電産リード株式会社 絶縁検査方法及び絶縁検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004361249A (ja) * 2003-06-04 2004-12-24 Nidec-Read Corp 基板検査装置
JP2005030882A (ja) 2003-07-11 2005-02-03 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2009250659A (ja) 2008-04-02 2009-10-29 Nidec-Read Corp 治具試験装置及び治具試験方法

Also Published As

Publication number Publication date
TWI613451B (zh) 2018-02-01
KR20150130506A (ko) 2015-11-23
WO2014188701A1 (en) 2014-11-27
CN105209924B (zh) 2018-11-20
TWI536027B (zh) 2016-06-01
TW201627676A (zh) 2016-08-01
CN105209924A (zh) 2015-12-30
JP6182974B2 (ja) 2017-08-23
JP2014228301A (ja) 2014-12-08
TW201445145A (zh) 2014-12-01

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