TWI535528B - Grinding device - Google Patents
Grinding device Download PDFInfo
- Publication number
- TWI535528B TWI535528B TW101149798A TW101149798A TWI535528B TW I535528 B TWI535528 B TW I535528B TW 101149798 A TW101149798 A TW 101149798A TW 101149798 A TW101149798 A TW 101149798A TW I535528 B TWI535528 B TW I535528B
- Authority
- TW
- Taiwan
- Prior art keywords
- head cover
- polishing
- head
- pressure
- purge gas
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims description 180
- 238000010926 purge Methods 0.000 claims description 38
- 230000007246 mechanism Effects 0.000 claims description 22
- 238000009966 trimming Methods 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 65
- 239000007788 liquid Substances 0.000 description 20
- 230000001105 regulatory effect Effects 0.000 description 13
- 239000000126 substance Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- 239000003814 drug Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012003870A JP5844163B2 (ja) | 2012-01-12 | 2012-01-12 | 研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201332713A TW201332713A (zh) | 2013-08-16 |
| TWI535528B true TWI535528B (zh) | 2016-06-01 |
Family
ID=48945959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101149798A TWI535528B (zh) | 2012-01-12 | 2012-12-25 | Grinding device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9028297B2 (enExample) |
| JP (1) | JP5844163B2 (enExample) |
| KR (1) | KR101617493B1 (enExample) |
| TW (1) | TWI535528B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3740982A1 (de) | 1987-12-03 | 1989-06-15 | Babcock Werke Ag | Vorrichtung zum reinigen von rohren |
| CN104742008B (zh) * | 2013-12-27 | 2017-03-22 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨方法及化学机械研磨装置 |
| JP6342198B2 (ja) * | 2014-03-31 | 2018-06-13 | 株式会社荏原製作所 | 研磨装置の構成部品用のカバー、研磨装置の構成部品、および、研磨装置 |
| SG10201808052SA (en) * | 2014-04-30 | 2018-10-30 | Ebara Corp | Substrate Polishing Apparatus |
| CN104117898B (zh) * | 2014-07-02 | 2016-08-17 | 吴志坚 | 艺术抛光工具 |
| KR102177123B1 (ko) * | 2014-08-28 | 2020-11-11 | 삼성전자주식회사 | 화학적 기계적 연마 장치 |
| CN106272038A (zh) * | 2015-06-04 | 2017-01-04 | 有研半导体材料有限公司 | 一种硅片抛光机边缘导轮 |
| JP7220648B2 (ja) * | 2019-12-20 | 2023-02-10 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
| CN112720247B (zh) * | 2020-12-30 | 2022-04-19 | 合肥晶合集成电路股份有限公司 | 一种化学机械平坦化设备及其应用 |
| CN117067101A (zh) * | 2023-08-22 | 2023-11-17 | 西可装备制造(衡阳)有限公司 | 一种研磨摆动机构及研磨抛光机 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2649439B1 (fr) | 1989-07-07 | 1991-09-20 | Ferco Int Usine Ferrures | Palier intermediaire pour fenetre, porte ou analogue |
| JP3043578B2 (ja) | 1993-10-25 | 2000-05-22 | 東芝機械株式会社 | 研磨装置 |
| JPH09195640A (ja) * | 1996-01-19 | 1997-07-29 | Tostem Corp | 換気框を備えたサッシまたは戸 |
| JPH1075507A (ja) * | 1996-08-29 | 1998-03-17 | Energy Support Corp | 開閉装置の防塵方法 |
| JP3722591B2 (ja) * | 1997-05-30 | 2005-11-30 | 株式会社日立製作所 | 研磨装置 |
| JPH11129132A (ja) * | 1997-10-28 | 1999-05-18 | Amada Eng Center Co Ltd | 板材加工複合機における防塵装置 |
| JP3013302B2 (ja) * | 1998-03-20 | 2000-02-28 | ユキワ精工株式会社 | 回転テーブル装置 |
| JPH11320385A (ja) * | 1998-05-14 | 1999-11-24 | Matsushita Electric Ind Co Ltd | 研磨方法及びその装置 |
| JP2000082859A (ja) * | 1998-07-13 | 2000-03-21 | Hitachi Metals Ltd | 固体レ―ザ装置 |
| US6033290A (en) | 1998-09-29 | 2000-03-07 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
| JP2007313644A (ja) * | 1999-05-17 | 2007-12-06 | Ebara Corp | ドレッシング装置 |
| US6419559B1 (en) * | 2000-07-10 | 2002-07-16 | Applied Materials, Inc. | Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet |
| JP2003306259A (ja) * | 2002-04-12 | 2003-10-28 | Shinko Electric Ind Co Ltd | 長尺帯状体の送り異常検知装置 |
| US7288165B2 (en) * | 2003-10-24 | 2007-10-30 | Applied Materials, Inc. | Pad conditioning head for CMP process |
| JP2008166709A (ja) | 2006-12-05 | 2008-07-17 | Ebara Corp | 基板研磨装置、及び基板研磨設備 |
| JP2009026569A (ja) * | 2007-07-19 | 2009-02-05 | Toyota Motor Corp | 密閉型電池の気密検査方法及び密閉型電池 |
-
2012
- 2012-01-12 JP JP2012003870A patent/JP5844163B2/ja active Active
- 2012-12-25 TW TW101149798A patent/TWI535528B/zh active
-
2013
- 2013-01-08 US US13/736,180 patent/US9028297B2/en active Active
- 2013-01-11 KR KR1020130003284A patent/KR101617493B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201332713A (zh) | 2013-08-16 |
| JP2013141735A (ja) | 2013-07-22 |
| JP5844163B2 (ja) | 2016-01-13 |
| US9028297B2 (en) | 2015-05-12 |
| US20130210324A1 (en) | 2013-08-15 |
| KR20130083406A (ko) | 2013-07-22 |
| KR101617493B1 (ko) | 2016-05-02 |
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