TWI528426B - 具有覆蓋層之基板的沈積後清理方法及配方 - Google Patents

具有覆蓋層之基板的沈積後清理方法及配方 Download PDF

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Publication number
TWI528426B
TWI528426B TW097149704A TW97149704A TWI528426B TW I528426 B TWI528426 B TW I528426B TW 097149704 A TW097149704 A TW 097149704A TW 97149704 A TW97149704 A TW 97149704A TW I528426 B TWI528426 B TW I528426B
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TW
Taiwan
Prior art keywords
concentration
cleaning solution
integrated circuit
amine
acid
Prior art date
Application number
TW097149704A
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English (en)
Chinese (zh)
Other versions
TW200945424A (en
Inventor
亞圖 寇力克斯
李世真
第瑞區若巴里 阿瑞那吉拉
威廉 尤
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW200945424A publication Critical patent/TW200945424A/zh
Application granted granted Critical
Publication of TWI528426B publication Critical patent/TWI528426B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/037—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics the barrier, adhesion or liner layers being on top of a main fill metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/052—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by treatments not introducing additional elements therein
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW097149704A 2007-12-21 2008-12-19 具有覆蓋層之基板的沈積後清理方法及配方 TWI528426B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1642707P 2007-12-21 2007-12-21
US12/334,462 US8404626B2 (en) 2007-12-21 2008-12-13 Post-deposition cleaning methods and formulations for substrates with cap layers

Publications (2)

Publication Number Publication Date
TW200945424A TW200945424A (en) 2009-11-01
TWI528426B true TWI528426B (zh) 2016-04-01

Family

ID=40788967

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097149704A TWI528426B (zh) 2007-12-21 2008-12-19 具有覆蓋層之基板的沈積後清理方法及配方

Country Status (6)

Country Link
US (2) US8404626B2 (https=)
JP (2) JP5804706B2 (https=)
KR (2) KR101633940B1 (https=)
CN (1) CN101971296B (https=)
TW (1) TWI528426B (https=)
WO (1) WO2009086231A2 (https=)

Cited By (3)

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US12139693B2 (en) 2020-01-28 2024-11-12 Fujifilm Corporation Treatment liquid and method for treating object to be treated
US12187984B2 (en) 2019-09-02 2025-01-07 Fujifilm Corporation Treatment liquid and method for treating object to be treated
TWI902733B (zh) * 2019-12-26 2025-11-01 日商富士軟片股份有限公司 洗淨液、洗淨方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12187984B2 (en) 2019-09-02 2025-01-07 Fujifilm Corporation Treatment liquid and method for treating object to be treated
TWI902733B (zh) * 2019-12-26 2025-11-01 日商富士軟片股份有限公司 洗淨液、洗淨方法
US12139693B2 (en) 2020-01-28 2024-11-12 Fujifilm Corporation Treatment liquid and method for treating object to be treated
TWI879863B (zh) * 2020-01-28 2025-04-11 日商富士軟片股份有限公司 處理液、被處理物的處理方法

Also Published As

Publication number Publication date
WO2009086231A3 (en) 2009-08-27
KR101633940B1 (ko) 2016-06-27
US20090162537A1 (en) 2009-06-25
JP2011508438A (ja) 2011-03-10
CN101971296B (zh) 2012-05-30
US20130323410A1 (en) 2013-12-05
JP2014088569A (ja) 2014-05-15
US8404626B2 (en) 2013-03-26
KR20100108397A (ko) 2010-10-06
CN101971296A (zh) 2011-02-09
KR101698731B1 (ko) 2017-01-20
JP5804706B2 (ja) 2015-11-04
KR20160030326A (ko) 2016-03-16
WO2009086231A2 (en) 2009-07-09
US8790465B2 (en) 2014-07-29
TW200945424A (en) 2009-11-01

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