TWI525681B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI525681B
TWI525681B TW104107883A TW104107883A TWI525681B TW I525681 B TWI525681 B TW I525681B TW 104107883 A TW104107883 A TW 104107883A TW 104107883 A TW104107883 A TW 104107883A TW I525681 B TWI525681 B TW I525681B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
processing apparatus
plate body
liquid film
Prior art date
Application number
TW104107883A
Other languages
English (en)
Chinese (zh)
Other versions
TW201546891A (zh
Inventor
中井仁司
Original Assignee
斯克林集團公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯克林集團公司 filed Critical 斯克林集團公司
Publication of TW201546891A publication Critical patent/TW201546891A/zh
Application granted granted Critical
Publication of TWI525681B publication Critical patent/TWI525681B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW104107883A 2014-03-13 2015-03-12 基板處理裝置 TWI525681B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014049634A JP6134673B2 (ja) 2014-03-13 2014-03-13 基板処理装置

Publications (2)

Publication Number Publication Date
TW201546891A TW201546891A (zh) 2015-12-16
TWI525681B true TWI525681B (zh) 2016-03-11

Family

ID=54071636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104107883A TWI525681B (zh) 2014-03-13 2015-03-12 基板處理裝置

Country Status (6)

Country Link
US (1) US10103020B2 (ja)
JP (1) JP6134673B2 (ja)
KR (1) KR101770535B1 (ja)
CN (1) CN106104761B (ja)
TW (1) TWI525681B (ja)
WO (1) WO2015137188A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180013327A (ko) * 2016-07-29 2018-02-07 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6840061B2 (ja) * 2017-09-22 2021-03-10 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置および基板処理装置
JP7116550B2 (ja) * 2018-02-08 2022-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4325831B2 (ja) 2001-07-26 2009-09-02 大日本スクリーン製造株式会社 基板処理装置ならびに基板処理装置に備えられた回転板および周囲部材の洗浄方法
JP4236109B2 (ja) 2003-03-31 2009-03-11 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US7300598B2 (en) 2003-03-31 2007-11-27 Tokyo Electron Limited Substrate processing method and apparatus
ATE450885T1 (de) * 2006-04-18 2009-12-15 Tokyo Electron Ltd Flüssigkeitsverarbeitungsvorrichtung
JP4940066B2 (ja) 2006-10-23 2012-05-30 東京エレクトロン株式会社 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体
CN201140029Y (zh) 2007-12-26 2008-10-29 国家环境保护总局华南环境科学研究所 复杂有机废气吸收净化装置
JP5136127B2 (ja) * 2008-03-11 2013-02-06 東京エレクトロン株式会社 塗布装置、塗布方法及び記憶媒体
JP4983885B2 (ja) * 2009-10-16 2012-07-25 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5461236B2 (ja) 2010-02-26 2014-04-02 株式会社高田工業所 半導体基板の処理装置
JP5270607B2 (ja) * 2010-03-30 2013-08-21 大日本スクリーン製造株式会社 基板処理装置
JP5602691B2 (ja) * 2011-07-12 2014-10-08 東京エレクトロン株式会社 液処理装置および天板洗浄方法
KR101811066B1 (ko) 2011-07-12 2017-12-20 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법
JP5889691B2 (ja) 2012-03-28 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2013207265A (ja) * 2012-03-29 2013-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置
TWI576938B (zh) 2012-08-17 2017-04-01 斯克林集團公司 基板處理裝置及基板處理方法
JP5973299B2 (ja) 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5973300B2 (ja) 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101512560B1 (ko) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
JP6163315B2 (ja) 2013-02-14 2017-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2014157901A (ja) 2013-02-15 2014-08-28 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
KR102091291B1 (ko) 2013-02-14 2020-03-19 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
JP6118595B2 (ja) 2013-03-15 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2014179489A (ja) 2013-03-15 2014-09-25 Dainippon Screen Mfg Co Ltd 基板処理装置
US20140273498A1 (en) 2013-03-15 2014-09-18 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method
JP2014194965A (ja) 2013-03-28 2014-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JP6392046B2 (ja) 2014-09-17 2018-09-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
KR20160112001A (ko) 2016-09-27
KR101770535B1 (ko) 2017-08-22
WO2015137188A1 (ja) 2015-09-17
JP6134673B2 (ja) 2017-05-24
US10103020B2 (en) 2018-10-16
US20170098538A1 (en) 2017-04-06
CN106104761B (zh) 2019-04-02
CN106104761A (zh) 2016-11-09
JP2015176875A (ja) 2015-10-05
TW201546891A (zh) 2015-12-16

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