TWI522397B - A polyhydroxy resin, an epoxy resin, a manufacturing method thereof, an epoxy resin composition and a hardened product - Google Patents

A polyhydroxy resin, an epoxy resin, a manufacturing method thereof, an epoxy resin composition and a hardened product Download PDF

Info

Publication number
TWI522397B
TWI522397B TW100133959A TW100133959A TWI522397B TW I522397 B TWI522397 B TW I522397B TW 100133959 A TW100133959 A TW 100133959A TW 100133959 A TW100133959 A TW 100133959A TW I522397 B TWI522397 B TW I522397B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
carbon atoms
general formula
hydrogen
Prior art date
Application number
TW100133959A
Other languages
English (en)
Chinese (zh)
Other versions
TW201229097A (en
Inventor
Hisashi Yamada
Masaki Omura
Eijiro Aoyagi
Kazuhiko Nakahara
Masashi Kaji
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of TW201229097A publication Critical patent/TW201229097A/zh
Application granted granted Critical
Publication of TWI522397B publication Critical patent/TWI522397B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C08G8/30—Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/15—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW100133959A 2010-09-27 2011-09-21 A polyhydroxy resin, an epoxy resin, a manufacturing method thereof, an epoxy resin composition and a hardened product TWI522397B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010214971 2010-09-27

Publications (2)

Publication Number Publication Date
TW201229097A TW201229097A (en) 2012-07-16
TWI522397B true TWI522397B (zh) 2016-02-21

Family

ID=45892684

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100133959A TWI522397B (zh) 2010-09-27 2011-09-21 A polyhydroxy resin, an epoxy resin, a manufacturing method thereof, an epoxy resin composition and a hardened product

Country Status (7)

Country Link
JP (3) JP5324712B2 (ko)
KR (1) KR101410919B1 (ko)
CN (1) CN103140523B (ko)
MY (1) MY157418A (ko)
SG (1) SG188247A1 (ko)
TW (1) TWI522397B (ko)
WO (1) WO2012043213A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013187185A1 (ja) * 2012-06-12 2013-12-19 新日鉄住金化学株式会社 ポリヒドロキシポリエーテル樹脂、ポリヒドロキシポリエーテル樹脂の製造方法、そのポリヒドロキシポリエーテル樹脂を含有する樹脂組成物、及びそれから得られる硬化物
TWI631173B (zh) * 2012-10-11 2018-08-01 新日鐵住金化學股份有限公司 Epoxy resin composition and hardened material
JP6073720B2 (ja) * 2013-03-21 2017-02-01 新日鉄住金化学株式会社 アルカリ現像型感光性樹脂組成物及びその硬化物
US9771310B2 (en) 2013-11-25 2017-09-26 Korea Kumho Petrochemical Co., Ltd. Styrenated phenol useful as curing agent or plasticizing agent for epoxy resin
JP6406847B2 (ja) 2014-03-26 2018-10-17 新日鉄住金化学株式会社 変性多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
WO2017123595A1 (en) * 2016-01-17 2017-07-20 E Ink California, Llc Polyhydroxy compositions for sealing electrophoretic displays
TWI779446B (zh) * 2020-12-30 2022-10-01 聯茂電子股份有限公司 低膨脹係數低介電損耗高剛性無鹵樹脂組成物、積層板以及印刷電路板
TWI751064B (zh) * 2021-03-29 2021-12-21 長春人造樹脂廠股份有限公司 多元酚樹脂、多元酚樹脂之縮水甘油醚及其應用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4852895A (ko) * 1971-11-05 1973-07-25
JPS6166709A (ja) * 1984-09-08 1986-04-05 Cosmo Co Ltd ヒドロキシスチレン系化合物とフエノ−ル樹脂の付加重合体の製法
JPH0651780B2 (ja) * 1986-07-10 1994-07-06 住友ベ−クライト株式会社 半導体封止用エポキシ樹脂組成物
JP3133117B2 (ja) * 1991-11-12 2001-02-05 旭化成工業株式会社 無機顔料スラリー組成物
JP3196141B2 (ja) * 1991-11-14 2001-08-06 東都化成株式会社 エポキシ樹脂組成物
EP0549968A1 (de) * 1991-12-20 1993-07-07 Hoechst Aktiengesellschaft Grenzflächenaktive Verbindungen auf Basis modifizierter Novolakoxalklylate, ihre Herstellung und ihre Verwendung
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JP2004250479A (ja) 2003-02-18 2004-09-09 Sumitomo Bakelite Co Ltd フォトレジスト用樹脂、その製造方法及びフォトレジスト組成物
KR101423170B1 (ko) * 2006-10-04 2014-07-25 신닛테츠 수미킨 가가쿠 가부시키가이샤 에폭시 수지, 페놀 수지, 그들의 제조방법, 에폭시 수지 조성물 및 경화물
JP5320130B2 (ja) * 2009-03-31 2013-10-23 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP6073754B2 (ja) 2017-02-01
TW201229097A (en) 2012-07-16
JP5931234B2 (ja) 2016-06-08
SG188247A1 (en) 2013-04-30
KR20130099116A (ko) 2013-09-05
JP2015083704A (ja) 2015-04-30
KR101410919B1 (ko) 2014-06-24
WO2012043213A1 (ja) 2012-04-05
JP5324712B2 (ja) 2013-10-23
CN103140523B (zh) 2014-07-23
JP2013237859A (ja) 2013-11-28
JPWO2012043213A1 (ja) 2014-02-06
CN103140523A (zh) 2013-06-05
MY157418A (en) 2016-06-15

Similar Documents

Publication Publication Date Title
TWI522397B (zh) A polyhydroxy resin, an epoxy resin, a manufacturing method thereof, an epoxy resin composition and a hardened product
JP5320130B2 (ja) 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
KR102387998B1 (ko) 변성 다가 하이드록시 수지, 에폭시 수지, 에폭시 수지 조성물 및 그 경화물
TWI728084B (zh) 多價羥基樹脂、其之製造方法、環氧樹脂、環氧樹脂組成物及其之硬化物
JP6605828B2 (ja) 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP5548562B2 (ja) 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP6799370B2 (ja) 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
TWI548681B (zh) A polyvalent hydroxyl resin, an epoxy resin, a manufacturing method thereof, an epoxy resin composition and a hardened product thereof
JP5570449B2 (ja) エポキシ樹脂組成物及び硬化物
JP2015003972A (ja) エポキシ樹脂、エポキシ樹脂組成物、及びその硬化物
JP2017119768A (ja) 多価ヒドロキシ樹脂及びエポキシ樹脂の製造方法
TWI521009B (zh) The epoxy resin composition and cured
JP2019214736A (ja) 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP5548792B2 (ja) 多価ヒドロキシ樹脂、その製造方法、エポキシ樹脂組成物及びその硬化物
JP2006160868A (ja) ナフトール樹脂、エポキシ樹脂、それらの製造法、それらを用いたエポキシ樹脂組成物及びその硬化物
JP7193337B2 (ja) 多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2008231071A (ja) 新規多価ヒドロキシ化合物並びにエポキシ樹脂組成物及びその硬化物
TWI529189B (zh) Epoxy resin composition and hardened material