CN103140523B - 多羟基树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物 - Google Patents

多羟基树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物 Download PDF

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Publication number
CN103140523B
CN103140523B CN201180046406.8A CN201180046406A CN103140523B CN 103140523 B CN103140523 B CN 103140523B CN 201180046406 A CN201180046406 A CN 201180046406A CN 103140523 B CN103140523 B CN 103140523B
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China
Prior art keywords
epoxy resin
resin
composition
represent
phenol
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CN201180046406.8A
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Chinese (zh)
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CN103140523A (zh
Inventor
山田尚史
大村昌己
青柳荣次郎
中原和彦
梶正史
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C08G8/30—Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/15—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN201180046406.8A 2010-09-27 2011-09-13 多羟基树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物 Active CN103140523B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010214971 2010-09-27
JP2010-214971 2010-09-27
PCT/JP2011/070804 WO2012043213A1 (ja) 2010-09-27 2011-09-13 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
CN103140523A CN103140523A (zh) 2013-06-05
CN103140523B true CN103140523B (zh) 2014-07-23

Family

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CN201180046406.8A Active CN103140523B (zh) 2010-09-27 2011-09-13 多羟基树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物

Country Status (7)

Country Link
JP (3) JP5324712B2 (ko)
KR (1) KR101410919B1 (ko)
CN (1) CN103140523B (ko)
MY (1) MY157418A (ko)
SG (1) SG188247A1 (ko)
TW (1) TWI522397B (ko)
WO (1) WO2012043213A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013187185A1 (ja) * 2012-06-12 2013-12-19 新日鉄住金化学株式会社 ポリヒドロキシポリエーテル樹脂、ポリヒドロキシポリエーテル樹脂の製造方法、そのポリヒドロキシポリエーテル樹脂を含有する樹脂組成物、及びそれから得られる硬化物
TWI631173B (zh) * 2012-10-11 2018-08-01 新日鐵住金化學股份有限公司 Epoxy resin composition and hardened material
JP6073720B2 (ja) * 2013-03-21 2017-02-01 新日鉄住金化学株式会社 アルカリ現像型感光性樹脂組成物及びその硬化物
JP6063059B2 (ja) * 2013-11-25 2017-01-18 錦湖石油化學株式會▲社▼Ｋｏｒｅａ Ｋｕｍｈｏ Ｐｅｔｒｏｃｈｅｍｉｃａｌ Ｃｏ．， Ｌｔｄ． エポキシ樹脂の硬化剤または可塑剤として有効なスチレン化フェノール
JP6406847B2 (ja) 2014-03-26 2018-10-17 新日鉄住金化学株式会社 変性多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
EP3403141A4 (en) * 2016-01-17 2019-01-16 E Ink California, LLC POLYHYDROXYLATED COMPOSITIONS FOR ENCAPSULATING ELECTROPHORETIC DISPLAYS
TWI779446B (zh) * 2020-12-30 2022-10-01 聯茂電子股份有限公司 低膨脹係數低介電損耗高剛性無鹵樹脂組成物、積層板以及印刷電路板
TWI751064B (zh) * 2021-03-29 2021-12-21 長春人造樹脂廠股份有限公司 多元酚樹脂、多元酚樹脂之縮水甘油醚及其應用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101522739A (zh) * 2006-10-04 2009-09-02 新日铁化学株式会社 环氧树脂、酚醛树脂、这些的制造方法、环氧树脂组合物及固化物

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JPS4852895A (ko) * 1971-11-05 1973-07-25
JPS6166709A (ja) * 1984-09-08 1986-04-05 Cosmo Co Ltd ヒドロキシスチレン系化合物とフエノ−ル樹脂の付加重合体の製法
JPH0651780B2 (ja) * 1986-07-10 1994-07-06 住友ベ−クライト株式会社 半導体封止用エポキシ樹脂組成物
JP3133117B2 (ja) * 1991-11-12 2001-02-05 旭化成工業株式会社 無機顔料スラリー組成物
JP3196141B2 (ja) * 1991-11-14 2001-08-06 東都化成株式会社 エポキシ樹脂組成物
EP0549968A1 (de) * 1991-12-20 1993-07-07 Hoechst Aktiengesellschaft Grenzflächenaktive Verbindungen auf Basis modifizierter Novolakoxalklylate, ihre Herstellung und ihre Verwendung
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JP2004250479A (ja) 2003-02-18 2004-09-09 Sumitomo Bakelite Co Ltd フォトレジスト用樹脂、その製造方法及びフォトレジスト組成物
JP5320130B2 (ja) * 2009-03-31 2013-10-23 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101522739A (zh) * 2006-10-04 2009-09-02 新日铁化学株式会社 环氧树脂、酚醛树脂、这些的制造方法、环氧树脂组合物及固化物

Non-Patent Citations (2)

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Title
JP特开2004-250479A 2004.09.09
JP特开平5-295061A 1993.11.09

Also Published As

Publication number Publication date
KR20130099116A (ko) 2013-09-05
KR101410919B1 (ko) 2014-06-24
JP2015083704A (ja) 2015-04-30
JP5324712B2 (ja) 2013-10-23
MY157418A (en) 2016-06-15
SG188247A1 (en) 2013-04-30
CN103140523A (zh) 2013-06-05
TW201229097A (en) 2012-07-16
JP6073754B2 (ja) 2017-02-01
JP5931234B2 (ja) 2016-06-08
JP2013237859A (ja) 2013-11-28
WO2012043213A1 (ja) 2012-04-05
JPWO2012043213A1 (ja) 2014-02-06
TWI522397B (zh) 2016-02-21

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CI03 Correction of invention patent

Correction item: Claims

Correct: Correct

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Number: 30

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Volume: 30

RECT Rectification
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20191211

Address after: No.13-1, No.1, No.1, No

Patentee after: Nippon Iron Chemical Materials Co., Ltd.

Address before: Tokyo, Japan

Patentee before: Nippon Steel Chemical Co.