TWI504701B - 導電性構件、其製造方法、組成物、觸控面板及太陽電池 - Google Patents

導電性構件、其製造方法、組成物、觸控面板及太陽電池 Download PDF

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Publication number
TWI504701B
TWI504701B TW101115210A TW101115210A TWI504701B TW I504701 B TWI504701 B TW I504701B TW 101115210 A TW101115210 A TW 101115210A TW 101115210 A TW101115210 A TW 101115210A TW I504701 B TWI504701 B TW I504701B
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TW
Taiwan
Prior art keywords
conductive
compound
group
conductive layer
layer
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TW101115210A
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English (en)
Chinese (zh)
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TW201247810A (en
Inventor
Satoshi Tanaka
Shinichi Nakahira
Yuki Matsunami
Tomohito Asai
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Fujifilm Corp
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Publication of TW201247810A publication Critical patent/TW201247810A/zh
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Publication of TWI504701B publication Critical patent/TWI504701B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Conductive Materials (AREA)
  • Position Input By Displaying (AREA)
  • Photovoltaic Devices (AREA)
TW101115210A 2011-04-28 2012-04-27 導電性構件、其製造方法、組成物、觸控面板及太陽電池 TWI504701B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011102135 2011-04-28
JP2011265207 2011-12-02
JP2012068270 2012-03-23

Publications (2)

Publication Number Publication Date
TW201247810A TW201247810A (en) 2012-12-01
TWI504701B true TWI504701B (zh) 2015-10-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW101115210A TWI504701B (zh) 2011-04-28 2012-04-27 導電性構件、其製造方法、組成物、觸控面板及太陽電池

Country Status (6)

Country Link
US (1) US20140048131A1 (ko)
JP (1) JP5868771B2 (ko)
KR (1) KR101644680B1 (ko)
CN (1) CN103597550B (ko)
TW (1) TWI504701B (ko)
WO (1) WO2012147955A1 (ko)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5952119B2 (ja) * 2012-03-23 2016-07-13 富士フイルム株式会社 導電性部材およびその製造方法
KR20140054735A (ko) * 2012-10-29 2014-05-09 삼성전기주식회사 터치패널 및 이의 제조방법
US8957315B2 (en) * 2013-03-11 2015-02-17 Carestream Health, Inc. Stabilization agents for silver nanowire based transparent conductive films
KR101465071B1 (ko) * 2013-09-27 2014-11-27 성균관대학교산학협력단 세슘을 이용한 플렉서블 투명전극필름 제조방법 및 그에 의해 제조된 플렉서블 투명전극필름
JP6243813B2 (ja) * 2014-07-31 2017-12-06 富士フイルム株式会社 窓用断熱フィルム、窓用断熱フィルムの製造方法、窓用断熱ガラスおよび窓
JP2016060906A (ja) * 2014-09-12 2016-04-25 Jsr株式会社 導電性膜形成用組成物、導電性膜、めっき膜の製造方法、めっき膜および電子機器
EP3038164B1 (en) * 2014-12-22 2018-12-12 Total S.A. Opto-electronic device with textured surface and method of manufacturing thereof
JP6295224B2 (ja) 2015-03-25 2018-03-14 富士フイルム株式会社 遠赤外線反射フィルム、遠赤外線反射フィルム形成用の分散液、遠赤外線反射フィルムの製造方法、遠赤外線反射ガラスおよび窓
JP6079849B2 (ja) * 2015-04-06 2017-02-15 大日本印刷株式会社 導電性フィルムの製造方法及び導電性フィルム
KR102681839B1 (ko) * 2015-04-06 2024-07-04 다이니폰 인사츠 가부시키가이샤 도전성 적층체, 터치 패널 및 도전성 적층체의 제조 방법
JP6119818B2 (ja) * 2015-04-06 2017-04-26 大日本印刷株式会社 導電性積層体及びタッチパネル
US11247444B2 (en) 2015-04-06 2022-02-15 Dai Nippon Printing Co., Ltd. Electroconductive layered product, touch panel, and process for producing electroconductive layered product
KR102402759B1 (ko) * 2015-05-29 2022-05-31 삼성디스플레이 주식회사 플렉서블 표시 장치 및 이의 제조 방법
US10133428B2 (en) 2015-05-29 2018-11-20 Samsung Display Co., Ltd. Flexible display device including a flexible substrate having a bending part and a conductive pattern at least partially disposed on the bending part
US9786491B2 (en) 2015-11-12 2017-10-10 Asm Ip Holding B.V. Formation of SiOCN thin films
CN105468204B (zh) * 2016-02-04 2018-07-17 京东方科技集团股份有限公司 一种显示模组、显示装置
US20170236610A1 (en) * 2016-02-12 2017-08-17 Tyco Electronics Corporation Method for Enhancing Adhesion of Silver Nanoparticle Inks Using a Functionalized Alkoxysilane Additive and Primer Layer
KR102378021B1 (ko) 2016-05-06 2022-03-23 에이에스엠 아이피 홀딩 비.브이. SiOC 박막의 형성
KR20180026007A (ko) * 2016-09-01 2018-03-12 삼성디스플레이 주식회사 투명 전극 및 이의 제조 방법
WO2018062517A1 (ja) * 2016-09-30 2018-04-05 大日本印刷株式会社 導電性フィルム、タッチパネル、および画像表示装置
US10998463B2 (en) 2016-11-15 2021-05-04 Shin-Etsu Chemical Co., Ltd. High efficiency solar cell and method for manufacturing high efficiency solar cell
KR102276987B1 (ko) * 2017-04-05 2021-07-12 엘지이노텍 주식회사 터치 패널
US10847529B2 (en) 2017-04-13 2020-11-24 Asm Ip Holding B.V. Substrate processing method and device manufactured by the same
JP7249952B2 (ja) 2017-05-05 2023-03-31 エーエスエム アイピー ホールディング ビー．ブイ． 酸素含有薄膜の制御された形成のためのプラズマ増強堆積プロセス
TWI761636B (zh) 2017-12-04 2022-04-21 荷蘭商Ａｓｍ Ｉｐ控股公司 電漿增強型原子層沉積製程及沉積碳氧化矽薄膜的方法
JP7166800B2 (ja) * 2018-06-20 2022-11-08 キヤノン株式会社 配向性圧電体膜用塗工液組成物、配向性圧電体膜、並びに、液体吐出ヘッド
KR102185171B1 (ko) * 2018-12-04 2020-12-01 주식회사 디케이티 투명전극 디바이스
KR20210120006A (ko) * 2019-02-12 2021-10-06 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 페이스트, 전자 부품 및 적층 세라믹 콘덴서
US20220139591A1 (en) 2019-02-18 2022-05-05 Showa Denko K.K. Transparent conductive film, and touch panel including same
JP6999071B1 (ja) 2020-08-26 2022-02-14 昭和電工株式会社 透明導電基体
US11360622B2 (en) * 2020-10-16 2022-06-14 Cambrios Film Solutions Corporation Stack structure and touch sensor
KR20230045621A (ko) * 2021-09-27 2023-04-05 삼성디스플레이 주식회사 감광성 수지 조성물 및 이를 이용한 표시 장치의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1641493A (zh) * 2003-12-12 2005-07-20 株式会社金阳社 导电性构件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61183810A (ja) * 1985-02-07 1986-08-16 三井東圧化学株式会社 透明電極
US6387453B1 (en) * 2000-03-02 2002-05-14 Sandia Corporation Method for making surfactant-templated thin films
JP2003151362A (ja) * 2001-08-31 2003-05-23 Toppan Printing Co Ltd 導電膜および導電膜の製造方法
JP5546763B2 (ja) * 2005-08-12 2014-07-09 カンブリオス テクノロジーズ コーポレイション ナノワイヤに基づく透明導電体
KR101234233B1 (ko) * 2006-05-18 2013-02-18 삼성에스디아이 주식회사 포스페이트를 포함하는 반도체 전극 및 이를 채용한태양전지
TW200837403A (en) * 2006-10-12 2008-09-16 Cambrios Technologies Corp Functional films formed by highly oriented deposition of nanowires
JP5443881B2 (ja) * 2009-07-28 2014-03-19 パナソニック株式会社 透明導電膜付き基材
JP5068298B2 (ja) * 2009-10-08 2012-11-07 日揮触媒化成株式会社 透明導電性被膜形成用塗布液、透明導電性被膜付基材および表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1641493A (zh) * 2003-12-12 2005-07-20 株式会社金阳社 导电性构件

Also Published As

Publication number Publication date
JP2013225460A (ja) 2013-10-31
KR101644680B1 (ko) 2016-08-01
JP5868771B2 (ja) 2016-02-24
CN103597550B (zh) 2017-06-30
TW201247810A (en) 2012-12-01
KR20140042797A (ko) 2014-04-07
US20140048131A1 (en) 2014-02-20
CN103597550A (zh) 2014-02-19
WO2012147955A1 (ja) 2012-11-01

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