JP6999071B1 - 透明導電基体 - Google Patents
透明導電基体 Download PDFInfo
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- JP6999071B1 JP6999071B1 JP2021564321A JP2021564321A JP6999071B1 JP 6999071 B1 JP6999071 B1 JP 6999071B1 JP 2021564321 A JP2021564321 A JP 2021564321A JP 2021564321 A JP2021564321 A JP 2021564321A JP 6999071 B1 JP6999071 B1 JP 6999071B1
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- Prior art keywords
- transparent conductive
- conductive substrate
- film
- transparent
- substrate according
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Abstract
Description
上記透明基材は非導電性であれば特に限定されない。無色が好適であるが、着色していてもよい。ただし、全光線透過率(可視光に対する透明性)は高い方が好ましく、全光線透過率が80%以上であることが好ましい。例えば、ポリエステル(ポリエチレンテレフタレート[PET]、ポリエチレンナフタレート[PEN]等)、ポリカーボネート、アクリル樹脂(ポリメチルメタクリレート[PMMA]等)、シクロオレフィンポリマー等の樹脂フィルムを好適に使用することができる。また、これら透明基材には光学特性、電気的特性や耐屈曲性を損なわない範囲で、易接着、光学調整(アンチグレア、アンチリフレクションなど)、ハードコートなどの機能を有する層を、単一または複数備えていてもよく、片面または両面に備えていてもよい。これらの樹脂フィルムの中でも、優れた光透過性(透明性)や柔軟性、機械的特性などの点からポリエチレンテレフタレート、シクロオレフィンポリマーを用いることが好ましい。シクロオレフィンポリマーとしては、ノルボルネンの水素化開環メタセシス重合型シクロオレフィンポリマー(ZEONOR(登録商標、日本ゼオン株式会社製)、ZEONEX(登録商標、日本ゼオン株式会社製)、ARTON(登録商標、JSR株式会社製)等)やノルボルネン/エチレン付加共重合型シクロオレフィンポリマー(APEL(登録商標、三井化学株式会社製)、TOPAS(登録商標、ポリプラスチックス株式会社製))を用いることができる。具体的には、コスモシャインA4100、A4160や、ZEONOR ZF-14、ZF-16、ARTON RX4500、RH4900、R5000が挙げられる。これらの中でもガラス転移温度(Tg)が100~170℃のものが引き出し配線やコネクタ部分などの後工程における加熱に耐えうるため好ましく、125~145℃のものがより好ましい。厚みは1~50μmであることが好ましく、5~25μmであることがより好ましく、8~23μmがさらに好ましく、10~20μmが特に好ましい。
透明導電膜を構成する上記導電性繊維としては、金属ナノワイヤ、カーボン繊維などが挙げられ、金属ナノワイヤを好適に使用することができる。金属ナノワイヤは、径がナノメーターオーダーのサイズである金属であり、ワイヤ状の形状を有する導電性材料である。なお、本実施形態では、金属ナノワイヤとともに(混合して)、または金属ナノワイヤに代えて、ポーラスあるいはノンポーラスのチューブ状の形状を有する導電性材料である金属ナノチューブを使用してもよい。本明細書において、「ワイヤ状」と「チューブ状」はいずれも線状であるが、前者は中央が中空ではないもの、後者は中央が中空であるものを意図する。性状は、柔軟であってもよく、剛直であってもよい。前者を「狭義の金属ナノワイヤ」、後者を「狭義の金属ナノチューブ」と呼び、以下、本願明細書において、「金属ナノワイヤ」は狭義の金属ナノワイヤと狭義の金属ナノチューブとを包括する意味で用いる。狭義の金属ナノワイヤ、狭義の金属ナノチューブは、単独で用いてもよく、混合して用いてもよい。
下記溶離液にバインダー樹脂を溶解させ、20時間静置した。この溶液におけるバインダー樹脂の濃度は0.05質量%である。
GPC:昭和電工株式会社製Shodex(登録商標)SYSTEM21
カラム:東ソー株式会社製TSKgel(登録商標)G6000PW
カラム温度:40℃
溶離液:0.1mol/L NaH2PO4水溶液+0.1mol/L Na2HPO4水溶液
流速:0.64mL/min
試料注入量:100μL
MALS検出器:ワイアットテクノロジーコーポレーション、DAWN(登録商標) DSP
レーザー波長:633nm
多角度フィット法:Berry法
透明導電膜を保護する保護膜は、硬化性樹脂組成物の硬化膜である。硬化性樹脂組成物としては、(A)カルボキシ基を含有するポリウレタンと、(B)エポキシ化合物と、(C)硬化促進剤と、(D)溶媒と、を含むものが好ましい。硬化性樹脂組成物を上記透明導電膜上に印刷、塗布等により形成し、硬化させて保護膜を形成する。硬化性樹脂組成物の硬化は、例えば熱硬化性樹脂組成物を用いる場合、これを加熱・乾燥させることにより行うことができる。
装置名:日本分光株式会社製HPLCユニット HSS-2000
カラム:ShodexカラムLF-804
移動相:テトラヒドロフラン
流速 :1.0mL/min
検出器:日本分光株式会社製 RI-2031Plus
温度 :40.0℃
試料量:サンプルル-プ 100μリットル
試料濃度:約0.1質量%に調製
酸価(mg-KOH/g)=〔B×f×5.611〕/S
B:0.1N水酸化カリウム-エタノール溶液の使用量(ml)
f:0.1N水酸化カリウム-エタノール溶液のファクター
S:試料の採取量(g)
(a1)ポリイソシアネート化合物としては、通常、1分子当たりのイソシアナト基が2個であるジイソシアネートが用いられる。ポリイソシアネート化合物としては、たとえば、脂肪族ポリイソシアネート、脂環式ポリイソシアネート等が挙げられ、これらの1種を単独でまたは2種以上を組み合わせて用いることができる。(A)カルボキシ基を含有するポリウレタンがゲル化をしない範囲で、イソシアナト基を3個以上有するポリイソシアネートも少量使用することができる。
(a2)ポリオール化合物(ただし、(a2)ポリオール化合物には、後述する(a3)カルボキシ基を有するジヒドロキシ化合物は含まれない。)の数平均分子量は通常250~50,000であり、好ましくは400~10,000、より好ましくは500~5,000である。この分子量は前述した条件でGPCにより測定したポリスチレン換算の値である。
(a3)カルボキシ基を含有するジヒドロキシ化合物としては、ヒドロキシ基、炭素原子数が1または2のヒドロキシアルキル基から選択されるいずれかを2つ有する分子量が200以下のカルボン酸またはアミノカルボン酸であることが架橋点を制御できる点で好ましい。具体的には2,2-ジメチロ-ルプロピオン酸、2,2-ジメチロ-ルブタン酸、N,N-ビスヒドロキシエチルグリシン、N,N-ビスヒドロキシエチルアラニン等が挙げられ、この中でも、溶媒への溶解度から、2,2-ジメチロ-ルプロピオン酸、2,2-ジメチロ-ルブタン酸が特に好ましい。これらの(a3)カルボキシ基を含有するジヒドロキシ化合物は、1種単独でまたは2種以上を組み合わせて用いることができる。
図1に示されるように、ロール状の長尺樹脂フィルムF(実施例1~5、8、9、比較例1~4はシクロオレフィンポリマーフィルムZF14-013(日本ゼオン株式会社製、ガラス転移温度136℃[カタログ値]、厚み13μm)、実施例6、7はシクロオレフィンポリマーフィルムZF14-023(日本ゼオン株式会社製、ガラス転移温度136℃[カタログ値]、厚み23μm)から、当該樹脂フィルムFの長手方向(MD)と長手方向が一致するようにA4サイズに透明基材Sを切り出した。
ポリビニルピロリドンK-90(株式会社日本触媒製)(0.98g)、AgNO3(1.04g)及びFeCl3(0.8mg)を、エチレングリコール(250ml)に溶解し、150℃で1時間加熱反応した。得られた銀ナノワイヤ粗分散液を水2000mlに分散させ、卓上小型試験機(日本ガイシ株式会社製、セラミック膜フィルター セフィルト使用、膜面積0.24m2、孔径2.0μm、寸法Φ30mm×250mm、ろ過差圧0.01MPa)に流し入れ、循環流速12L/min、分散液温度25℃にてクロスフロー濾過を実施し不純物を除去し、銀ナノワイヤ(平均直径:26nm、平均長さ:20μm)を得た。クロスフローろ過しながら水/エタノール置換を行い、最終的に水/エタノール混合溶媒の分散液(銀ナノワイヤ濃度3質量%、水/エタノール=41/56[質量比])を得た。得られた銀ナノワイヤの平均径の算出には、電界放出形走査電子顕微鏡JSM-7000F(日本電子株式会社製)を用い、任意に選択した100本の銀ナノワイヤ寸法を測定し、その算術平均値を求めた。また、得られた銀ナノワイヤの平均長の算出には、形状測定レーザマイクロスコープVK-X200(キーエンス株式会社製)を用い、任意に選択した100本の銀ナノワイヤ寸法を測定し、その算術平均値を求めた。また、上記エタノール、エチレングリコール、AgNO3、FeCl3は富士フイルム和光純薬株式会社製試薬を用いた。
上記ポリオール法で合成した銀ナノワイヤの水/エタノール混合溶媒の分散液5g(銀ナノワイヤ濃度3質量%、水/エタノール=41:56[質量比])、水6.4g、メタノール20g(富士フイルム和光純薬株式会社製)、エタノール39g(富士フイルム和光純薬株式会社製)、プロピレングリコールモノメチルエーテル(PGME、富士フイルム和光純薬株式会社製)25g、プロピレングリコール3g(PG、旭硝子株式会社製)、PNVA(登録商標)水溶液(昭和電工株式会社製、固形分濃度10質量%、重量平均分子量90万)1.8gを混合し、ミックスローターVMR-5R(アズワン株式会社製)で1時間、室温、大気雰囲気下で撹拌(回転速度100rpm)して銀ナノワイヤインク100gを作製した。最終的な混合比[質量比]は、銀ナノワイヤ/PNVA/水/メタノール/エタノール/PGME/PG=0.15:0.18:10:20:42:25:3であった。
空気雰囲気、温度条件:室温→(10℃/min)→700℃(コンプレッサーエアー100mL/min)
プラズマ処理装置(積水化学工業株式会社製AP-T03)を用いてプラズマ処理(使用ガス:窒素、搬送速度:50mm/sec、処理時間:6sec、設定電圧:400V)した、透明基材SとしてのA4サイズのシクロオレフィンポリマーフィルムZF14-013(日本ゼオン株式会社製、ガラス転移温度136℃[カタログ値]、厚み13μm)上に、TQC自動フィルムアプリケータースタンダード(コーテック株式会社製)とワイヤレスバーコータOSP-CN-22L(コーテック株式会社製)とを用い、ウェット膜厚が22μmとなるように銀ナノワイヤインクを透明基材Sの全面に塗布した(塗工速度500mm/sec)。その後、恒温器HISPEC HS350(楠本化成株式会社製)で80℃、1分間、大気雰囲気下で熱風乾燥し、銀ナノワイヤ層を形成した。
透明導電膜(銀ナノワイヤ層)の膜厚は光干渉法に基づく膜厚測定システムF20-UV(フィルメトリクス株式会社製)を用いて測定した。測定箇所を変え、3点測定した平均値を膜厚として用いた。解析には450nmから800nmのスペクトルを用いた。この測定システムによると、透明基材上に形成された銀ナノワイヤ層の膜厚(Tc)が直接測定できる。測定結果を表1に示す。
(A)カルボキシ基を含有するポリウレタンの合成例
攪拌装置、温度計、コンデンサーを備えた2L三口フラスコに、ポリオール化合物としてC-1015N(株式会社クラレ製、ポリカーボネートジオール、原料ジオールモル比:1,9-ノナンジオール:2-メチル-1,8-オクタンジオール=15:85、分子量964)42.32g、カルボキシ基を含有するジヒドロキシ化合物として2,2-ジメチロールブタン酸(日本化成株式会社製)27.32g、および溶媒としてジエチレングリコールモノエチルエーテルアセテート(株式会社ダイセル製)158gを仕込み、90℃で前記2,2-ジメチロールブタン酸を溶解させた。
上記透明基材S上に形成した銀ナノワイヤ層の上に、TQC自動フィルムアプリケータースタンダード(コーテック株式会社製)とワイヤレスバーコータOSP-CN-05M(コーテック株式会社製)を用い、ウェット膜厚が5μmになるように硬化性樹脂組成物を全面に塗布した(塗工速度333mm/sec)。その後、恒温器HISPEC HS350(楠本化成株式会社製)で80℃、1分間、大気雰囲気下で熱風乾燥(熱硬化)し、保護膜を形成して実施例に係る透明導電基体とした。
保護膜の膜厚は、前述の銀ナノワイヤ層の膜厚同様光干渉法に基づく膜厚測定システムF20-UV(フィルメトリクス株式会社製)を用いて測定した。測定箇所を変え、3点測定した平均値を膜厚として用いた。解析には450nmから800nmのスペクトルを用いた。この測定システムによると、透明基材上に形成された銀ナノワイヤ層の膜厚(Tc)とその上に形成された保護膜の膜厚(Tp)との総膜厚(Tc+Tp)が直接測定できるので、この測定値から先に測定した銀ナノワイヤ層の膜厚(Tc)を差し引くことにより保護膜の膜厚(Tp)が得られる。
上記方法で得た透明導電基体の両面に保護フィルムを貼付したのち、下記に示す方法で所定の大きさ(150mm×15mmと150mm×100mm)に裁断後、保護フィルムを剥離して、裁断部分の真直度が異なる試験片を得た。なお、150mm×15mmの大きさのサンプルは、図1に示されたs1及びs2の2種類のサンプルに裁断したものであり、150mm×100mmの大きさのサンプルは、図1に示されたs1のサンプルのみに裁断したものである。
0.028mm トムソン加工 自動裁断(装置使用)
0.050mm ディスクカッター 手動裁断
0.060mm レーザー切断 自動裁断(装置使用)
0.176mm カッターナイフ 手動裁断
屈曲試験には180°折り曲げ試験が可能な、小型卓上型耐久試験システムTension-Free(登録商標)Folding Clamshell -type(ユアサシステム機器株式会社製 以後、装置ということがある)を用いた。銀ペーストは導電性ペーストDW-420L-2A(東洋紡株式会社製)を用い、これを試験片(サンプルs1、s2)の略中央(両短辺から75mm、両長辺から等距離の位置)からそれぞれ長手方向に40mm離れた位置に約2mm四方の端子の端辺を配置(両端子間距離:80mm)するように手塗りで約2mm四方に塗布したのち、恒温器HISPEC HS350(楠本化成株式会社製)で80℃、30分間、大気雰囲気下で熱風乾燥することで端子部分を形成した。
屈曲試験用の試験片とは別に、上記A4サイズに全面塗布した透明導電基体(銀ナノワイヤフィルム)から3cm×3cmの試験片を切り出し、4端子法に基づく抵抗率計ロレスタGP(株式会社三菱化学アナリテック製)で銀ナノワイヤ層のシート抵抗を測定した。測定モードおよび使用端子はESPモードを用いた。
上記3cm×3cmの試験片を用い、ヘーズメーターCOH7700(日本電色工業株式会社製)で測定した。測定結果を表1、2に示す。いずれも全光線透過率が85%以上と良好な透明性を有することを確認した。なお、全光線透過率は第1面と第2面を別個に測定することができないため、両面に導電層を有する実施例4~7では、第1面と第2面を合わせた値が得られる。本発明で用いた透明基材(樹脂フィルム)、透明導電膜(銀ナノワイヤ層)及び保護膜は、いずれも透明性に優れるため、両面に銀ナノワイヤ層を設けた場合でも、片面のみに導電層を設けた場合に比して、全光線透過率の低下が非常に小さいことが分かる。
Claims (13)
- 透明基材と、
前記透明基材の少なくとも一方の主面上に形成された透明導電膜と、
を含む透明導電基体であって、
前記透明導電基体の裁断部分の真直度が0.050mm以下であり、
曲率半径2.0mmに設定したクラムシェル型耐久試験機を用いて、前記透明導電基体を20万回屈曲する屈曲試験に供される前の前記透明導電基体の抵抗値(R 0 )に対する、前記屈曲試験に供された後の抵抗値(R)の比(R/R 0 )が2.0以下であることを特徴とする透明導電基体。 - さらに、曲率半径0.5mmに設定したクラムシェル型耐久試験機を用いて、前記透明導電基体を20万回屈曲する屈曲試験に供される前の前記透明導電基体の抵抗値(R 0 )に対する、前記屈曲試験に供された後の抵抗値(R)の比(R/R 0 )が2.0以下である、請求項1に記載の透明導電基体。
- 前記透明導電膜が少なくともバインダー樹脂および導電性繊維を含み、前記透明導電膜上に保護膜を有する、請求項1または2に記載の透明導電基体。
- 前記導電性繊維が金属ナノワイヤである、請求項3に記載の透明導電基体。
- 前記金属ナノワイヤが銀ナノワイヤである、請求項4に記載の透明導電基体。
- 前記バインダー樹脂がアルコール、水、あるいはアルコールと水との混合溶媒に可溶なバインダー樹脂である、請求項3~5のいずれかに記載の透明導電基体。
- 前記バインダー樹脂が、ポリ-N-ビニルピロリドン、親水性セルロース系樹脂、ブチラール樹脂、ポリ-N-ビニルアセトアミドからなる群のいずれかを含む、請求項3~6のいずれかに記載の透明導電基体。
- 前記透明基材がシクロオレフィンポリマー(COP)フィルムである、請求項1~7のいずれかに記載の透明導電基体。
- 前記シクロオレフィンポリマー(COP)フィルムの厚みが1~50μmである、請求項8に記載の透明導電基体。
- 前記シクロオレフィンポリマー(COP)フィルムの厚みが5~25μmである、請求項9に記載の透明導電基体。
- 前記シクロオレフィンポリマー(COP)フィルムのガラス転移温度(Tg)が100~170℃にある、請求項8~10のいずれかに記載の透明導電基体。
- 前記保護膜が硬化性樹脂組成物の硬化膜からなり、前記硬化性樹脂組成物の固形分中の芳香環含有化合物の含有割合が15質量%以下である、請求項3~7のいずれかに記載の透明導電基体。
- 前記透明基材が長尺または長尺から切り出された樹脂フィルムであり、長尺の長手方向に垂直な方向を屈曲軸として折り畳み可能である、請求項1または2に記載の透明導電基体。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011035213A (ja) * | 2009-08-03 | 2011-02-17 | Mitsubishi Shindoh Co Ltd | 薄板状電磁波シールド材及び車載用電磁波シールド部品 |
WO2018101334A1 (ja) * | 2016-12-01 | 2018-06-07 | 昭和電工株式会社 | 透明導電基板及びその製造方法 |
JP2020102362A (ja) * | 2018-12-21 | 2020-07-02 | 日東電工株式会社 | 透明導電性フィルム積層体 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4837257B2 (ja) * | 2004-02-26 | 2011-12-14 | 日東電工株式会社 | 帯電防止性粘着型光学フィルムおよび画像表示装置 |
WO2008073143A2 (en) | 2006-06-21 | 2008-06-19 | Cambrios Technologies Corporation | Methods of controlling nanostructure formations and shapes |
JP5409369B2 (ja) | 2006-10-12 | 2014-02-05 | カンブリオス テクノロジーズ コーポレイション | ナノワイヤベースの透明導電体およびその適用 |
WO2009035059A1 (ja) | 2007-09-12 | 2009-03-19 | Kuraray Co., Ltd. | 導電膜、導電部材および導電膜の製造方法 |
TWI504701B (zh) | 2011-04-28 | 2015-10-21 | Fujifilm Corp | 導電性構件、其製造方法、組成物、觸控面板及太陽電池 |
JP2015099748A (ja) * | 2013-11-20 | 2015-05-28 | デクセリアルズ株式会社 | 透明導電体及び透明導電体の製造方法 |
KR20170139564A (ko) * | 2015-04-21 | 2017-12-19 | 채슴 테크놀러지, 인코포레이티드 | 투명 전도성 필름 |
US10088931B2 (en) | 2015-11-16 | 2018-10-02 | Samsung Electronics Co., Ltd. | Silver nanowires, production methods thereof, conductors and electronic devices including the same |
CN108292183B (zh) * | 2016-01-20 | 2021-03-16 | 东洋纺株式会社 | 透明导电性膜 |
CN109476142A (zh) * | 2016-05-20 | 2019-03-15 | 大日本印刷株式会社 | 光学层叠体和图像显示装置 |
CN109153238B (zh) | 2016-06-29 | 2021-01-05 | 日本瑞翁株式会社 | 导电性膜 |
KR102510824B1 (ko) * | 2016-09-30 | 2023-03-17 | 다이니폰 인사츠 가부시키가이샤 | 도전성 필름, 터치 패널 및 화상 표시 장치 |
CN206322484U (zh) * | 2016-12-02 | 2017-07-11 | 天津宝兴威科技股份有限公司 | 一种柔性透明纳米银线导电膜 |
CN110945677A (zh) * | 2017-07-21 | 2020-03-31 | 3M创新有限公司 | 柔性导电显示器膜 |
WO2019151293A1 (ja) | 2018-01-31 | 2019-08-08 | 日本ゼオン株式会社 | 積層体及びその製造方法並びにタッチパネル |
KR102265033B1 (ko) * | 2019-06-20 | 2021-06-15 | 쇼와 덴코 가부시키가이샤 | 투명 도전 필름 적층체 및 그 가공 방법 |
CN114555366B (zh) * | 2019-10-18 | 2023-03-24 | 昭和电工株式会社 | 透明导电膜层合体及其加工方法 |
CN110739097B (zh) * | 2019-11-07 | 2021-07-16 | 浙江大学 | 功函数可调的银纳米线复合透明导电薄膜的制备方法 |
CN111341497B (zh) * | 2020-03-13 | 2021-06-08 | 浙江大学 | 银纳米线-MXene复合透明导电薄膜的制备方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011035213A (ja) * | 2009-08-03 | 2011-02-17 | Mitsubishi Shindoh Co Ltd | 薄板状電磁波シールド材及び車載用電磁波シールド部品 |
WO2018101334A1 (ja) * | 2016-12-01 | 2018-06-07 | 昭和電工株式会社 | 透明導電基板及びその製造方法 |
JP2020102362A (ja) * | 2018-12-21 | 2020-07-02 | 日東電工株式会社 | 透明導電性フィルム積層体 |
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