TWI502673B - Substrate processing method and substrate processing system - Google Patents

Substrate processing method and substrate processing system Download PDF

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Publication number
TWI502673B
TWI502673B TW101143242A TW101143242A TWI502673B TW I502673 B TWI502673 B TW I502673B TW 101143242 A TW101143242 A TW 101143242A TW 101143242 A TW101143242 A TW 101143242A TW I502673 B TWI502673 B TW I502673B
Authority
TW
Taiwan
Prior art keywords
substrate
treatment liquid
active species
processing
liquid
Prior art date
Application number
TW101143242A
Other languages
English (en)
Chinese (zh)
Other versions
TW201330153A (zh
Inventor
林航之介
松井繪美
中野晴香
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201330153A publication Critical patent/TW201330153A/zh
Application granted granted Critical
Publication of TWI502673B publication Critical patent/TWI502673B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
TW101143242A 2011-12-19 2012-11-20 Substrate processing method and substrate processing system TWI502673B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011277349A JP5858770B2 (ja) 2011-12-19 2011-12-19 基板処理システム

Publications (2)

Publication Number Publication Date
TW201330153A TW201330153A (zh) 2013-07-16
TWI502673B true TWI502673B (zh) 2015-10-01

Family

ID=48588398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101143242A TWI502673B (zh) 2011-12-19 2012-11-20 Substrate processing method and substrate processing system

Country Status (4)

Country Link
JP (1) JP5858770B2 (https=)
KR (1) KR101399801B1 (https=)
CN (1) CN103165411B (https=)
TW (1) TWI502673B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104347385A (zh) * 2013-07-23 2015-02-11 中芯国际集成电路制造(上海)有限公司 一种半导体器件的选择性刻蚀方法及bsi图像传感器制作方法
JP6352143B2 (ja) * 2013-11-13 2018-07-04 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
TWI630652B (zh) 2014-03-17 2018-07-21 SCREEN Holdings Co., Ltd. 基板處理裝置及使用基板處理裝置之基板處理方法
JP6324775B2 (ja) * 2014-03-17 2018-05-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置を用いた基板処理方法
JP6499414B2 (ja) 2014-09-30 2019-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6903446B2 (ja) * 2016-03-07 2021-07-14 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6918600B2 (ja) 2016-07-29 2021-08-11 芝浦メカトロニクス株式会社 処理液生成装置及びそれを用いた基板処理装置
CN106449688A (zh) * 2016-10-28 2017-02-22 中国电子科技集团公司第四十四研究所 制作光敏区布线层的方法
JP6973534B2 (ja) * 2020-03-10 2021-12-01 栗田工業株式会社 希薄薬液供給装置
JP7471182B2 (ja) * 2020-09-11 2024-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN115148634B (zh) * 2022-06-29 2025-12-19 上海集成电路装备材料产业创新中心有限公司 硅片湿法处理方法及系统
US20250273471A1 (en) * 2024-02-23 2025-08-28 Tokyo Electron Limited Methods To Improve Etch Uniformity Across A Semiconductor Substrate When Etching With A Hydrofluoric Acid (HF) And Nitric Acid (HNO3) Solution

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302600B1 (en) * 1999-05-26 2001-10-16 Nagase & Co., Ltd. Apparatus for treating surface of boards
US6614050B1 (en) * 1999-10-26 2003-09-02 Fab Solutions, Inc. Semiconductor manufacturing apparatus
US20080053493A1 (en) * 2006-09-05 2008-03-06 Masahiro Kimura Substrate processing apparatus
US20090056764A1 (en) * 2007-08-31 2009-03-05 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and storage medium

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1126425A (ja) * 1997-06-30 1999-01-29 Sumitomo Metal Ind Ltd 半導体基板のエッチング方法及びその装置
JP3653416B2 (ja) * 1999-05-19 2005-05-25 沖電気工業株式会社 エッチング方法およびエッチング装置
DE10248481B4 (de) * 2002-10-17 2006-04-27 Siltronic Ag Verfahren und Vorrichtung zur nasschemischen Behandlung von Silicium
KR100693252B1 (ko) * 2005-04-13 2007-03-13 삼성전자주식회사 기판 처리 장치, 기판 세정 장치 및 방법
JP2007251081A (ja) * 2006-03-20 2007-09-27 Dainippon Screen Mfg Co Ltd 基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302600B1 (en) * 1999-05-26 2001-10-16 Nagase & Co., Ltd. Apparatus for treating surface of boards
US6614050B1 (en) * 1999-10-26 2003-09-02 Fab Solutions, Inc. Semiconductor manufacturing apparatus
US20080053493A1 (en) * 2006-09-05 2008-03-06 Masahiro Kimura Substrate processing apparatus
US20090056764A1 (en) * 2007-08-31 2009-03-05 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and storage medium

Also Published As

Publication number Publication date
JP2013128063A (ja) 2013-06-27
TW201330153A (zh) 2013-07-16
CN103165411A (zh) 2013-06-19
KR20130070528A (ko) 2013-06-27
CN103165411B (zh) 2016-08-03
JP5858770B2 (ja) 2016-02-10
KR101399801B1 (ko) 2014-05-27

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