TW200903599A - Base plate treating device - Google Patents

Abstract

The invention provides a substrate processing device, which can correctly hold the processing status of the substrate. The substrate processing device has processing grooves (10A-10C), for transmitting the substrate (S) slantly and meanwhile providing flushing liquid to the surface of the substrate (S) through a spray spout (14) in the processing grooves (10A-10C), also cleaning process is implemented. A first PH value measuring device (16) receives the cleaning liquid before the cleaning liquid gets to the bottom of the grooves flowing along the surface of the substrate (S) and measures the PH value, based on the measuring result measured by the PH value measuring device (16), the supply amount of the flushing liquid in the processing grooves (10A-10C) is controlled by a controller (40).

Description

The present invention relates to a substrate such as a glass substrate for a liquid crystal display (LCD), a PDP (Plasma Display Panel), and a semiconductor substrate. A substrate processing apparatus that performs various treatments by supplying a processing liquid. [Prior Art] As a substrate processing apparatus as described above, the processing liquid stored in the storage tank is transported to the processing tank, and the processing liquid is supplied to the substrate from the nozzle member disposed inside the processing tank. On the other hand, the treatment liquid after use is recovered from the treatment tank into the storage tank, whereby the treatment liquid is recycled. As such a device, for example, the following document discloses a device for measuring a state of contamination (deterioration) of a treatment liquid derived from a treatment tank, and specifically, measuring a pH value of the treatment liquid, and having a high degree of contamination in the treatment liquid After the start of the treatment, the discharged treatment liquid is completely discarded, and when the degree of contamination is reduced to a fixed level or lower, the treatment liquid is recovered into the storage tank. [Problem to be Solved by the Invention] In the substrate processing apparatus of the prior art, the processing liquid is usually supplied quantitatively to the substrate. For example, in the substrate processing apparatus that performs processing while transporting the substrate, the supply of the processing liquid and the stop of the supply of the processing liquid are performed based on the detection of the substrate by an inductor specially provided on the transport path or the like, and are fixed during the processing. The flow rate supplies the treatment liquid to the substrate. Therefore, there is also a case where the processing liquid is consumed arbitrarily by supplying the processing liquid excessively to a small-sized substrate or the like. In recent years, in order to process the substrate more economically, it is required to suppress the waste (supply) of the treatment liquid, and it is considered to monitor the contamination (deterioration) of the treatment liquid derived from the treatment tank as in the patent document, so that the supply amount of the treatment liquid is increased. Moderate amount. In other words, there is a certain degree of correlation between the state of contamination (deterioration) of the treatment liquid and the treatment state of the substrate. Therefore, it is considered that the treatment state of the substrate is estimated based on the contamination state of the treatment liquid, and the supply amount of the treatment liquid is controlled based on this. . However, when the contamination state of the treatment liquid derived from the treatment tank is monitored as in the above-mentioned document 1, the treatment liquid that has not passed through the substrate, that is, the surface of the treatment tank is sprayed to the wall surface of the treatment tank, and contains unnecessary contamination components attached to the wall surface. Since the liquid also becomes a monitoring target, it is not possible to sufficiently accurately grasp the processing state of the substrate. The present invention has been developed in view of the above problems, and a first object thereof is to enable a more accurate grasp of the processing state of a substrate, and a second object thereof is to suppress waste (supply) of a processing liquid to reasonably process the substrate. [Means for Solving the Problems] In order to solve the above problems, a substrate processing apparatus according to the present invention includes a processing tank that performs a specific processing on a substrate by supplying a processing liquid to a surface of a substrate by a nozzle member, and the substrate processing apparatus includes a measuring mechanism. The measuring means receives the treatment liquid before the treatment liquid flowing down from the surface of the substrate reaches the bottom of the treatment tank, and sets a specific physical quantity (request item 相关) associated with the deterioration state of the treatment liquid. When the treatment liquid flowing down from the surface of the substrate reaches the bottom of the treatment tank, the treatment liquid is directly received and the physical quantity is measured. According to this configuration, 129948.doc 200903599 can be used since the treatment liquid injected only into the substrate is the measurement target. Exclude excess contaminating components in the measurement object. Therefore, based on the measurement results of the above physical quantities, the processing state of the substrate can be more accurately grasped. More specifically, the substrate processing apparatus includes a support mechanism that supports the substrate in an inclined posture during processing, and the measurement mechanism is disposed below an edge of the lower side of the substrate supported by the support mechanism (request 2). For example, 'the surface is transported in an inclined position—facing the surface of the substrate

In the apparatus for processing the processing liquid, the processing liquid which flows down the inclination of the substrate can be satisfactorily received, and the physical quantity can be appropriately measured. Further, the money measuring structure may have a crotch portion that measures the physical quantity in contact with the treatment liquid phase, and a guiding portion that receives the treatment liquid flowing down from the substrate and guides the treatment liquid to the measurement unit (claim item 3) ). As described above, according to the configuration in which the treatment liquid discharged from the substrate is guided to the measurement unit, the treatment liquid can be brought into contact with the measurement unit to measure the physical quantity. Further, it is preferable that the substrate processing apparatus has a supply amount control mechanism for supplying the substrate! The control unit controls the supply amount of the processing liquid supplied to the substrate based on the measurement result of the physical quantity (request item 4). For example, it is preferable that the above-mentioned amount (4) mechanism controls the supply amount of the treatment liquid per unit (request item 5) based on the above-described enthalpy result. Further, the 供给 of the supply amount control means controls the supply of the processing liquid to the substrate based on the measurement result, 6), for example, when the substrate is transported to the surface of the substrate. The supply amount control means controls the conveyance speed of the substrate based on the measurement result of the above 129948.doc 200903599 (request item 7). In other words, since the deterioration state of the processing liquid and the processing state of the substrate are correlated, the physical quantity is measured by the measuring means as described above, and the supply amount of the processing liquid to the substrate is controlled based on the measurement result. It is possible to supply an appropriate amount of the treatment liquid in accordance with the processing state of the substrate, thereby suppressing waste of the treatment liquid. Further, by comparing the deterioration state of the treatment liquid before and after use, it is possible to more accurately grasp the processing state of the substrate. Therefore, when the measuring means is the first measuring means, the apparatus further includes a second measuring means different from the first measuring means, and the second measuring means measures the physical quantity related to the processing liquid before being supplied to the substrate. The supply amount control means controls the supply amount based on the difference between the measurement results of the first and second measurement means (request item 8). Further, the substrate processing apparatus may include: a treatment liquid circulation system that processes the treatment liquid that has been used in the treatment of the treatment tank and is recovered after use, and is reused in the treatment tank; and a liquid discharge mechanism The treatment liquid recovered after use in the treatment liquid circulating in the circulation system is discharged from the circulation system. The new liquid introduction mechanism introduces a new treatment liquid into the circulation system, and replaces the control mechanism. The liquid discharge mechanism and the new liquid introduction mechanism are controlled based on the measurement results of the measurement means, thereby replacing the treatment liquid in the circulation system (request item 9). According to this configuration, it is possible to effectively suppress the waste of the treatment liquid based on the measurement of the physical quantity in the processing of the substrate in which the treatment liquid is circulated in the treatment tank, and the liquid quality of the treatment liquid can be favorably maintained to promote the substrate 129948. Doc 200903599 processing. The processing device has a first processing chamber, wherein the second portion is a class; the processing liquid advances into the substrate that has been processed in the first processing tank, and the substrate processing device has the processing The system will be used in the processing of the first processing tank in the processing of the above-mentioned first processing tank, which is used in the processing of the processing tank and the processing liquid recovered after use in the processing of the second processing ladder. The 敎 mechanism is disposed in a processing tank, and the (4) mechanism controls the supply amount of the processing liquid supplied to the substrate in the first processing tank and the supply amount of the processing liquid to the substrate in the second processing tank based on the measurement result. At least one of them (request item 10). According to this configuration, in the apparatus in which the treatment tanks are connected in series, the waste of the treatment liquid can be completely suppressed. [Effects of the Invention]

According to the invention of the claims i to 3, since the unnecessary contamination component is excluded from the measurement object, the processing state of the substrate can be accurately grasped. Further, according to the inventions of claims 4 to 9, since the supply amount of the processing liquid to the substrate is controlled in accordance with the processing state of the substrate, the waste of the processing liquid can be suppressed, and the substrate can be processed economically. [Embodiment] A preferred embodiment of the present invention will be described using the drawings. Fig. 1 schematically shows a substrate processing apparatus of the present invention in a schematic view. The substrate processing apparatus shown in the figure is a cleaning process performed on, for example, a substrate after the surname processing (chemical liquid treatment). 129948.doc -10- 200903599 As shown in the figure, the substrate processing apparatus has three consecutive processing tanks ιο of the first to third (first processing tank 10A, second processing tank i〇b, third processing tank) H) C). In each of the _10A to 10C, a plurality of conveying rollers 12 are respectively provided at a specific interval, and the substrate S is conveyed from the left side to the right side in the state where the substrate § is supported by the conveying rollers 12. Further, as shown in Fig. 2, each of the transport rollers 12 is obliquely disposed in a direction orthogonal to the transport direction of the substrate S, whereby the substrate S is transported while being inclined at a specific angle with respect to the horizontal plane. Each of the processing tanks 10A to 10C is provided with a shower nozzle 14 (corresponding to the nozzle member of the present invention) for supplying the eluent (in the present embodiment, pure water) from the upper side of the substrate s. The third processing tank i〇c is provided with a shower nozzle 14 so as to supply the eluent from the upper and lower sides of the substrate S. The shower nozzle 14 has a plurality of nozzle openings which are dispersed, and a droplet-like eluent is ejected from each nozzle port and sprayed onto the substrate S. The supply system for supplying the eluent to each of the treatment tanks 10A to 10C is configured as follows. Storage tanks 20A, 20, 20B, and 20C (first storage tank 20A, second storage tank B, and third storage tank 20C) for storing the washing liquid are provided in the respective treatment tanks 10A, 10B, and 10C. Each of the storage tanks 20A to 2C is provided with a supply pipe 22 having a pump 23 and a valve 22a, and the pump 23 is operated by the respective storage tanks 20A to 20C for the respective processing tanks 1A to 1〇c. The eluent is discharged, and the eluent after use is led through the outlet tubes 24A to 24C which are respectively connected to the respective treatment tanks A to 丨〇c. Further, a waste liquid pipe 26 having a rinse liquid of the valve 26a is provided in each of the storage tanks 2A, A2, and 2c, and each of the storage tanks 20A can be operated by the operation of the 129948.doc 200903599 26a during maintenance. The eluent in ~20C is exported to the waste storage tank outside the figure. Among the above-mentioned outlet pipes 24a to 24C provided in the respective treatment tanks 10A to 10C, the outlet pipe 24C of the third treatment tank 10C is connected to the second treatment tank 1B, the second storage tank 20B, and the second treatment tank 10B. The outlet pipe 24B is connected to the first storage tank 20A of the first treatment tank 10A. Further, the outlet pipe ‘ 24A of the first treatment tank 1A is connected to the waste liquid storage tank outside the drawing. A new liquid supply pipe 28' is further connected to the third storage tank 2'c, and the new eluent is supplied from the eluent supply source 3 to the valve 28a (operating) attached to the new liquid supply pipe 28. The third storage tank 20C. That is, in the substrate processing apparatus, the new eluent is introduced from the eluent supply source 30 to the third storage tank 20C, and the eluent is transported to the third treatment tank 10C, and from the third treatment tank. The eluent after use of the 10C is introduced into the second storage tank 20B on the upstream side. Then, the eluent of the second storage tank 20B is sent to the second treatment tank 1b, and the eluent used in the second treatment tank 10B is further introduced into the first storage tank 20A on the upstream side. After the eluent of the first storage tank 20A is sent to the first treatment tank 1A, the eluent discharged from the first treatment tank 10A is introduced into the waste liquid storage tank outside the drawing. In short, the eluent used in the treatment tank on the downstream side is sequentially drawn to the upstream side and used in the treatment tank on the upstream side to form a supply system for the eluent liquid. In other words, the treatment tank i 〇A~1 〇c are connected in series via the supply system. In the following description, when the "upstream side" and the "downstream side" are referred to to the storage tanks 2A to 20C, the conveying direction of the substrate S corresponds. In the processing tanks 10A to 10C and the storage tanks 20A to 20C, respectively, 129948.doc • 12· 200903599 is provided for measuring a specific physical quantity associated with the deterioration state of the eluent. Specifically, a pH measuring device 16 (referred to as a first pH measuring device 16) is provided in each of the processing tanks 10A-10C, and the pH measuring device 16 is directly received in the processing substrate S and flows down the substrate S. The eluent, that is, the eluent received from the substrate S before reaching the bottom of the tank, the eluent is measured to determine the pH value; on the other hand, each of the storage tanks 2A to 2〇c is separately measured The second pH value measuring device % of the pH of the eluent in the storage tanks 20A to 20C. As shown in FIG. 1, the first pH measuring device 16 is located substantially at the center of the processing tanks 1A to 1b (substantially centered in the substrate conveying direction), and is disposed in the conveying roller 12 as shown in FIG. Below the end of the lower side of the substrate 8 supported in an inclined posture. As shown in the figure, the first pH measuring device 6 has a funnel-shaped liquid receiving portion 17 (corresponding to the guiding portion of the present invention) and a pH meter main body 18 (corresponding to the measuring portion of the present invention). It is disposed under the i 7 of the liquid contact portion and has a measuring head. The liquid receiving portion 17 receives the eluent flowing down the substrate S and guides it to the pH meter main body 18, thereby measuring the eluent liquid. The pH value is then output to the controller 40 described below corresponding to the measurement result. On the other hand, the second pH measuring device 36 is not shown in detail, but has a measuring head at a specific position inside each of the storage tanks 20A to 20C, and is measured and stored in each of the storage tanks 20A to 20C by the measuring head. The pH of the eluent is output to a controller corresponding to the shai measurement result. Further, the substrate processing apparatus has a controller 40 (corresponding to the supply amount control means of the present invention) for controlling a series of cleaning operations of the substrate 8. The control 129948.doc •13-200903599 40 is constituted by a CPU (Central pr〇cessing unit) or the like which performs logical operations, and drives the motor of the roller i2, the pump 23, and the valve 22a. 26a, 28a, and the pH measuring device 16, ^6, etc. are all electrically connected to the control (4). Then, based on the measurement results of the # value measuring devices 16, 36, the controller 4 is used to open and close the valve. Hereinafter, an example of the cleaning operation of the substrate S based on the control of the controller 4A will be described. As a preparation stage for starting the processing of the substrate s, a fixed amount of a new liquid (new eluent) is stored in each of the storage tanks 2a to 2〇c. The new liquid is cut as follows: the new liquid (four) wood washing liquid supply source 3 is introduced into the third storage tank 20C via the new liquid supply pipe 28, and the new liquid is transported to the storage tank on the upstream side via the liquid supply pipe outside the drawing. 20A, 20B. After the preparation of the respective grooves 20A to 20C is completed, the transport roller 12 is driven to start transporting the substrate S, and the substrate s after the chemical liquid treatment is transported from the upstream side in an inclined posture. Then, when the front end of the substrate s is detected by the substrate (front end) sensor disposed on the upstream side of the first processing tank 1A, the shower nozzle 14 in the first processing tank 10A is ejected and rinsed. The liquid starts to supply the eluent to the substrate s. Thereby, when the substrate s is carried into the first processing tank 10A, the eluent is supplied from the shower nozzle 14 to the upper surface of the substrate S to perform a specific cleaning process on the substrate 8. Further, in the cleaning process, a part of the eluent flowing down from the upper surface of the substrate s flows into the liquid contact portion 17 of the pH measuring device 6 (see FIG. 2), thereby measuring the use of the substrate 8 after use. The pH of the eluent.

Then, the substrate S is further transported, and is stopped when the substrate (back end) sensor disposed outside the downstream end of the first processing tank 丨0A I29948.doc •14-200903599 detects the rear end of the substrate s The cleaning liquid is supplied from the shower nozzle 14. The substrate S after passing through the first processing tank 10A is sequentially transported to the second processing tank 10B and the third processing tank i〇c by the driving of the conveying roller 12, and in the processing tanks 10B and 10C, by the pair The eluent is supplied to the upper surface of the substrate S, and the cleaning treatment is performed in the same manner. At this time, in each of the treatment tanks 10B and i〇c, similarly to the first treatment tank 10A, the pH value of the eluent flowing down from the substrate 8 is measured by the pH measuring device 16 during the treatment. Thus, after the substrate S passes through the respective processing tanks i 〇 A to 10C, the cleaning process of one of the substrates 8 is completed. Although the description has been omitted, the second and third processing tanks 10B and loc are also disposed on the substrate (front end) sensor disposed on the upstream side of the processing tanks 10B and 10C, and in the respective processing tanks 10B. The detection of the substrate S by the substrate (back end) sensor near the downstream end in 10C, and the control starts to supply and the supply of the eluent is stopped.

Further, in the cleaning process of the substrate s, based on the measurement result of the pH measuring device 16, the supply amount of the eluent to the substrate 8 in each of the processing tanks 10A to 10c is controlled as follows. That is, in the above apparatus for performing the cleaning treatment (using pure water as the cleaning treatment of the washing liquid) on the substrate s after the etching treatment (chemical liquid treatment), in the cleaning processing, after the use of the substrate S for cleaning The pH of the eluent changes as the treatment progresses. Specifically, the pH of the eluent was high immediately after the start of the treatment, and the pH value decreased as the treatment progressed. Therefore, in the controller 4, the pH 129948.doc 200903599 value (referred to as a reference value) corresponding to the reference cleaning level for each of the processing tanks 10A to 10C is stored in advance, and each processing tank 10A to 1c is calculated. The difference between the measured pH value (for example, the average value of the specific time) and the above-described reference value is based on the result, and the supply amount of the eluent to the substrate 8 in each of the processing tanks 10A to 10C is controlled. Specifically, when the pH value is higher than the reference value by a fixed level or higher, that is, when the substrate S is not sufficiently cleaned, the opening degree of the valve 22a is controlled so that the rinsing per unit time is performed. The supply of liquid only increases the specific flow rate. On the other hand, when the pH is lower than the fixed value of the reference value, that is, when the substrate S is excessively cleaned, the opening degree of the valve 22a is controlled so that the eluent per unit time The supply is only reduced by a specific flow. This control of the supply amount of the eluent to the substrate S is performed in a fixed cycle or in accordance with an input operation of the operator. Further, in the case where the pump 23 is, for example, a pump that uses a variable frequency motor as a drive source, instead of controlling the opening degree of the valve 22a, or controlling the opening degree, the rotation speed of the motor is changed, thereby controlling The supply flow rate of the eluent is supplied to the shower nozzle 14. On the other hand, in the cleaning process of the substrate s, the 1311 value of the eluent in each of the storage tanks 20A to 20C is measured by the second pH measuring device 36. In the controller 40, different from the reference value for the flow rate control, is the liquid management for each of the storage tanks 20A to 20C stored in advance? The reference value of the value of 11 is in any one of the storage tanks 20A to 20C, and if the measured pH value exceeds the reference value, that is, if the eluent in each of the storage tanks 20A to 20C deteriorates to a fixed level or higher, the inside of the storage tanks 20A to 20C is drenched. One part of the washing liquid is discarded through the waste liquid pipe %, or is sent to the storage tank on the upstream side via the liquid supply pipe outside the drawing, and the eluent liquid with less pollution is passed through the liquid supply pipe from the storage tank on the downstream side. Transfer 129948.doc • 16 - 200903599 to the tank to restore the eluent function. As described above, in the substrate processing apparatus of the above-described embodiment, the pH value of the eluent after use, which is correlated with the processing state of the substrate s, is measured by the _PH value measuring device 16, and it is judged based on the measured value. When the substrate S is sufficiently cleaned (when the measured pH value is higher than the reference value by a fixed level or more), the supply amount of the eluent to the substrate S is incrementally corrected; on the contrary, when it is judged that the substrate S is excessively performed In the case of cleaning (when the measured pH value is lower than the fixed value of the reference value), the amount of supply of the eluent to the substrate S is reduced, so that it is possible to supply the substrate s with sufficient necessity depending on the processing state of the substrate S. Wash the solution while washing. Therefore, it is possible to suppress the waste of the eluent, and it is possible to economically process the substrate S. In particular, in the apparatus, as described above, since the pH value is directly measured by the pH measuring device 16 to measure the pH of the eluent flowing down from the substrate S, there is an advantage that it can correspond to the actual processing condition of the substrate s. The amount of supply of the eluent to the substrate S is accurately controlled. That is, as another method, it is also considered to measure the eluent ipH value derived from each of the processing tanks 10A to 10C via the lead-out tubes 24A to 24C, but in this case, it is not injected into the substrate S and falls to the processing tank 10A. The eluent which adheres to the bottom of the inside of the 10c and the like, and the excess contaminating component attached to the inner bottom or the like also becomes the target of the p Η value. Therefore, the measurement result does not become a value corresponding to the actual processing condition of the substrate s. It is difficult to accurately control the supply amount of the eluent according to the processing state of the substrate 8. However, according to the configuration of the above-described embodiment, the eluent to be treated is actually only injected into the substrate S. Since the object has a high reliability of the measured value, it is possible to accurately control the supply amount of the eluent to the substrate 8 in accordance with the processing state of the actual substrate s in 129948.doc 17 200903599. Next, a second embodiment of the present invention will be described using FIG. 3. Fig. 3 is a schematic view showing a substrate processing apparatus according to a second embodiment. The configuration of the substrate processing apparatus shown in the figure is different from the substrate processing apparatus of the first embodiment in the following points, and the other configuration is basically the same as that of the first embodiment. Therefore, the same portions as those in the first embodiment will be denoted by the same reference numerals, and the description will be omitted. Only the differences will be described in detail (this is also the same for the third embodiment described below). First, the outlet tubes 24A to 24C are provided in the apparatus so that the eluent used in each of the treatment tanks 10A to 10C is returned to the storage tanks 2A to 2A corresponding to the respective treatment tanks 10A to 10C. c. Therefore, if it is the first treatment tank 10A, the eluent of the first storage tank 2A is transported to the first treatment tank 1A and supplied to the substrate s, and the eluent after use is processed from the first treatment. The tank 1A is recovered to the first storage tank 20A. In this case, the cleaning process of the substrate s is performed while the eluent is circulated between the first treatment tank 1A and the first storage tank 20A. The supply system of the lotion. The same applies to the second treatment tank 10B and the second treatment tank 10C. Further, between the third storage tank 20C and the second storage tank 20B, a first liquid supply pipe 32 for transporting the eluent in the third storage tank 20C to the second storage tank 20B and having the record 32a is provided. Between the two storage tanks 2〇b and the first storage tank 20A, a second liquid supply pipe 34 is provided for conveying the eluent in the second storage tank 2B to the first storage tank 20A and having the pump 34a. The eluent is transported from the downstream side to the storage tank on the upstream side. 129948.doc -18- 200903599 That is, in the second embodiment of the substrate processing apparatus, the new eluent is introduced into the third storage tank 2〇c from the eluent supply source 30, and the eluent is simultaneously The liquid supply tubes 32 and 34 are sequentially transported to the storage tanks 20A and 20B on the upstream side, thereby storing the eluent in each of the storage tanks 2A to 2〇c, as described above, in each of the treatment tanks 10A. Between 1 and 〇c and the corresponding storage tanks 20A to 20C, the eluent is circulated, and the substrate 8 is cleaned. If necessary, the eluent of the first storage tank 20A is discarded through the waste liquid pipe %. At the same time, the eluent of the storage tanks 2〇8, 2〇c on the downstream side is sequentially conveyed to the upstream side via the liquid supply pipes 32 and 34. In the substrate processing apparatus of the second embodiment, based on ? As a result of the measurement by the 11-value measuring device 16'36, the above-described controller 4A controls the above-described valve 22a and the like in the following manner. In the controller 40, as the pH value corresponding to the reference cleaning level of each of the processing tanks 1A1 to 1〇c, the pH value of the eluent before use and the eluent after use are stored. The difference between the pH values and the reference value, that is, the measured value of the second pH measuring device 36 (corresponding to the second measuring means of the present invention) and the first pH measuring device 6 (corresponding to the present invention) The difference between the measured values of a measuring mechanism is relative to the reference value. Further, in the cleaning process, the pH value of the eluent before and after use is calculated for each treatment tank 10A to 10C in a fixed cycle or based on an operator's input operation, and is controlled based on the attack result. 〇A~〗 〇c The substrate § supply the supply of eluent. In addition, "before use" and "after use" refer to "before use" and "after use" of the eluent of each of the treatment tanks 10A to 10C_.

For example, if the first processing tank 丨0A is taken as an example, the eluent (the eluent after use) measured by the pH 129948.doc -19-200903599 value measuring device 16 is calculated. 1^ value, the difference between the pH value of the eluent (pre-use eluent) in the first storage tank 2A measured by the first pH measuring device 36, when the value is larger than the above reference value When the level is equal to or higher than the level, when it is judged that the substrate S is not sufficiently cleaned, the opening degree of the valve 22a is controlled so that the supply amount per unit time of the eluent is increased only by the specific flow rate. On the other hand, when the calculated value is lower than the reference value by a fixed level or higher, that is, when it is judged that the substrate 8 is excessively cleaned, the opening degree of the valve 22a or the like is controlled so that the supply of the eluent per unit time Γ is supplied. The amount only reduces the specific traffic. Thereby, the substrate S is supplied with a necessary eluent which is commensurate with the processing state of the substrate s. Further, although the processing of the first processing tank 10A has been described here as an example, the processing in the second processing tank 10B and the third processing tank i〇c is also the same. In other words, as described above, in the second embodiment in which the eluent is circulated between the respective processing tanks 1A to 1A and the corresponding storage tanks 20A to 20C, the substrate s is subjected to the raw-washing treatment. In the substrate processing apparatus, the eluent ejected from the shower nozzle 劣化 deteriorates with time. Therefore, as in the first embodiment in which the eluent is not deteriorated at any time, it is difficult to accurately grasp the processing state of the substrate S based only on the measurement result of the enthalpy measuring device 16. Therefore, in the second embodiment, the supply amount of the eluent to the substrate S is controlled based on the change in pH of the eluent before use and after use. Therefore, according to the substrate processing apparatus of the second embodiment, as described above, the eluent is passed between the respective processing samples 10A to 10C and the corresponding storage tanks 20A to 2C, and the substrate S is simultaneously performed. In the device configuration of the cleaning process, it is possible to enjoy the same effect as the device of the first embodiment, that is, it is possible to suppress the waste of the rinsing 129948.doc -20-200903599, and it is possible to economically process the substrate s. Next, a third embodiment of the present invention will be described using FIG. Fig. 4 is a schematic view showing a substrate processing apparatus according to a third embodiment. The substrate processing apparatus not shown in the figure is provided with a discharge tube ΜΑ, 24B, so that the eluent used in the first and second treatment tanks 1A, 1GB is returned to the respective treatment tanks 10A, 1B, respectively. Corresponding storage tanks 2〇a, 2〇b. Therefore, if it is the first treatment tank 1A, the eluent of the first storage tank 2A is sent to the first treatment tank 2A and supplied to the substrate s, and the eluent after use is used. A treatment tank 1A is recovered into the first storage tank 2A, in which case the eluent can be circulated between the first treatment tank 1A and the first storage tank 2A, while the substrate s is Cleaning treatment. The same applies to the second processing tank 10B. A valve 25 is provided on each of the outlet pipes 24A, 24B, and branch pipes 24A1, 24B branched from the upstream side of the valve 25 are provided. The branch pipe 24AI branched from the outlet pipe 24A of the first treatment tank 10A is connected to the waste liquid storage tank outside the drawing. On the other hand, the branch pipe 24B' branched from the outlet pipe 24B of the second treatment tank 1B is connected to the first Storage tank 2〇A. That is, the valve 25 is operated as needed, whereby the used eluent discharged from the first treatment tank 10A can be led to the waste liquid storage tank via the branch pipe 24A, and The eluent from which the treatment tank B is derived is sent to the first storage tank 20A via the branch pipe My. In this embodiment, the branch pipes 24A, '24B1, the valve 25, and the like correspond to the liquid discharge mechanism of the present invention. Further, in the apparatus, the storage tank 2〇c corresponding to the third treatment tank 1〇c is not provided, and the new liquid is directly rinsed from the 129948.doc -21 - 200903599 via the supply piping 22. The liquid supply source 3 is supplied to the third processing tank 10C. Further, a new liquid supply pipe 39 having a valve 39a (corresponding to the new liquid introduction mechanism of the present invention) is connected to each of the storage tanks 20A and 20B corresponding to the first and second treatment tanks 10A and 10B, and new The liquid is directly introduced into each of the storage tanks 20A and 20B from the eluent supply source 3〇. That is, in the substrate processing apparatus of the second embodiment, the eluent is self-cleaned

The eluent supply source 30 is stored in the first storage tank 2A and the second storage tank 2B, respectively, and the stars are supplied from the respective supply pipes 22 to the first to third slots 丨〇A to 丨〇c.

The eluent is separately transported to perform the cleaning process of the substrate 8. At this time, in the first and second processing tanks 10A and 10(10), the eluent is circulated between the corresponding storage tanks 2A and the hall. Simultaneously, the cleaning process of the substrate s is performed, and the eluent discharged from the first processing tank 10B is transported to the first storage tank 2A via the outlet pipe (the branch pipe 24B) according to the flat, and will be from the first place. The eluent derived from the inner tank 10A is discarded from the branch pipe "A," via the above-described outlet pipe 2.

In the device, the controller 40 is controlled by a 39a or the like. Based on the measurement results of the pH measuring devices 16, 36, the driving of the conveying roller 12 and the valve 25 are calculated as follows, and the 帛-positive value measuring device (10) in each of the processing tanks 1A to 1〇c is calculated. When the difference between the PH value and the reference value is measured, the PH value is higher than the reference value ^ ", and ^ (when the substrate s is not sufficiently performed), the conveying speed of the transporting roller 12 to transport the substrate s is reduced to a fixed speed, Thus, the cleaning time of the substrate s is extended with respect to the standard time, and the supply W for supplying the eluent to the substrate is increased. On the contrary, when the pH value is lower than the reference value fixed level of 129948.doc -22-200903599 (when the substrate S is excessively cleaned), the conveying speed of the conveying roller 12 to transport the substrate S is increased only by a fixed speed. This shortens the cleaning time of the substrate § and reduces the supply of the eluent to the substrate 8. Further, in the cleaning process of the substrate S, when the measured pH value of the first pH value measuring device 16 exceeds the reference value (the specific pH value for liquid management) in the first processing tank 10A, The eluent discharged from the treatment tank 1A is discarded through the above-described outlet pipe 24A (branch pipe 24A). Similarly, when the pH value exceeds the reference value in the second treatment tank 10B, the eluent discharged from the second treatment tank 1B is delivered to the storage tank 20A via the outlet pipe 24B (branch pipe 24B'). . X, new liquid is introduced into each of the storage tanks 20A, 20B via the new liquid supply pipe 39. Thereby, the function of circulating the eluent in each of the treatment tanks 1 〇A 10B can be restored. That is, in this embodiment, the controller 4G corresponds to the supply amount control means and the replacement control means of the present invention. According to the apparatus of the third embodiment as described above, when the substrate S is excessively cleaned, the conveying speed of the substrate 3 is increased only by a fixed speed, thereby suppressing the supply amount of the eluent to the substrate S, and conversely, when When the substrate δ is not sufficiently cleaned, the transport speed of the substrate S is lowered by a fixed speed, thereby increasing the supply amount of the eluent to the substrate s. Therefore, similarly to the first embodiment, the substrate s can be The washing liquid is supplied to the substrate s in response to the processing conditions, and the cleaning process is performed. Therefore, the waste of the eluent can be suppressed, and the substrate s can be processed economically. Further, in the above-described manner, the transport speed of the substrate S is increased in accordance with the progress of the cleaning process of the substrate s, so that the cleaning process is performed while the substrate s is always transported at a fixed speed of 129948.doc -23-200903599. Compared, there are advantages that can increase production. In addition, the substrate processing apparatus of the first to third embodiments described above is an example of a preferred embodiment of the substrate processing apparatus of the present invention, and the specific configuration thereof can be appropriately changed without departing from the scope of the invention. For example, in the embodiment, the eluent from the substrate s is received by the liquid-contacting unit 7 and the eluent is introduced into the pH meter main body 8 to constitute the first pH measuring device 16 However, it is of course possible to omit the liquid-contacting portion 17, and directly receive the eluent from the substrate s by the pH meter main body 18, and measure the pH. In short, the pH of the eluent can be measured before the eluent flowing down from the substrate s reaches the bottom of the treatment tanks 10A to 10C. However, the use of the first pH measuring device 16 as in the above embodiment enables the eluent to reliably react with the pH meter body even when the eluent flows sparsely along the substrate s. 18 contact, thus enabling a more reliable determination of the pH. Further, in the embodiment, the processing state of the substrate s is grasped based on the degree of deterioration of the eluent, and as described above, the degree of deterioration of the eluent is detected by measuring the pH of the eluent, but of course, The physical quantity associated with the degree of deterioration of the eluent can also be detected. A physical quantity other than 11 values. For example, the specific resistance or conductivity of the eluent can also be determined. Further, in the first embodiment, based on the measurement result of the pH value of the first processing tank 1A2, the supply amount of the eluent to the substrate §A is controlled in the first processing tank A, but for example, Controlling the supply amount of the eluent in the first treatment tank 1A, or controlling the supply amount of the eluent in the first treatment tank A to 129948.doc -24·200903599, and based on the first As a result of measuring the pH of the treatment tank 10A, the supply amount of the eluent to the substrate S in the treatment tanks 10B and 10C on the downstream side is controlled. Specifically, when it is determined that the substrate s has been cleaned in the first processing tank 1 (the measured value of the pH is lower than the reference value by a fixed level or more), it is possible to treat the processing tank 10B, 1〇. The supply amount of the eluent supplied to the substrate s in c is decremented, or any one of the processing tanks 10B and 10C is omitted (that is, only the eluent is not supplied and only the substrate s is passed). In short, it is also possible to control the supply amount of the eluent in the downstream side treatment tank and the like based on the measurement result of the 1) 11 value of the eluent in the upstream side treatment tank. This aspect is also the same for the second and third embodiments. Further, in the embodiment, the present invention is applied to an example of a substrate processing apparatus of the type that supplies the eluent to the upper surface thereof while transporting the substrate s. However, of course, the eluent is supplied to the substrate 8 in a stationary state. In order to perform the cleaning process, the substrate s is transported to the downstream side after the end of the cleaning, and the present invention can also be applied to the substrate processing apparatus of this type. In this case, the 1) 11 value of the eluent flowing down from the substrate S can be measured by the pH measuring device, and when the measured value is lowered to a fixed level at which the cleaning of the substrate S is considered to have ended, the eluent is stopped. The substrate S is supplied and carried out. As a result, the amount of eluent consumed and the stop time of the substrate S can be suppressed to the minimum required, so that the cleaning process of the substrate s can be performed economically and efficiently. In particular, when the third processing tank 10C is processed as described above, the problem that the substrate s having insufficient cleaning processing is carried out to the downstream side can be prevented in advance, and as a result, the cleaning processing can be further improved. The advantage of sex. 129948.doc -25- 200903599 Further, in order to increase or decrease the supply amount of the liquid to the substrate s according to the progress of the cleaning process, in the first and second embodiments, the mother time of the eluent is controlled. In the third embodiment, the conveyance speed of the substrate s (the processing time of the substrate s) is controlled. However, it is of course possible to control the discharge amount of the eluent from the cutting nozzle 14 and the substrate 8 Both of the transport speeds increase or decrease the supply amount of the eluent to the substrate s. Further, in the embodiment, the substrate processing apparatus which performs the cleaning process on the substrate S after the etching process is described as an application example of the present invention, but the present invention can also be applied to a substrate after the resist film peeling treatment, for example. S is the device for cleaning. Further, in addition to the apparatus for performing the cleaning treatment while flowing the eluent along the substrate S as described above, the present invention can also be applied to a device for performing chemical treatment while flowing the chemical liquid along the substrate s, in addition to The present invention can also be applied to the processing of supplying the processing liquid to the substrate 8 in the horizontal posture or the vertical posture, in addition to the device that performs the processing while supplying the processing liquid (cleaning liquid) to the substrate 8 in the inclined posture. Device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a substrate processing apparatus (first embodiment) of the present invention. Fig. 2 is a side elevational view showing the position of the substrate in each of the processing tanks and the position of the first pH value determining means and the processing unit of the first pH measuring means. Fig. 3 is a schematic view showing a substrate processing apparatus (second embodiment) of the present invention. 129948.doc -26- 200903599 Fig. 4 is a schematic view showing a substrate processing apparatus (third embodiment) of the present invention. [Description of main component symbols] 10A First processing tank 10B Second processing tank 10C Third processing tank 12 Conveying roller 14 Shower nozzle 16 ' 36 pH measuring device 17 Water receiving portion 18 pH meter main body 20A First storage tank 20B Second storage tank 20C Third storage tank 22 Supply piping 40 Controller 129948.doc -27-

Claims (1)

200903599 X. Patent application scope: 1. A substrate processing apparatus, which is characterized in that the processing tank is supplied with a processing liquid supplied from the mouthpiece member toward the surface of the substrate and the substrate is subjected to a specific treatment. 〃 Included in the measurement mechanism, the measurement means flows from the surface of the substrate: the treatment liquid receives the treatment liquid before reaching the bottom of the treatment tank, and measures a specific physical quantity associated with the deterioration state of the treatment liquid. The substrate processing apparatus according to claim 1, wherein L 3 is a supporting mechanism for supporting the substrate in an inclined posture during processing, and the crucible mechanism is disposed below an edge of a lower side of the substrate supported by the support mechanism. 3. The substrate processing apparatus according to claim 1 or 2, wherein the measuring means includes: a measuring unit that measures the physical quantity in contact with the processing liquid phase; and a guiding unit that receives the processing liquid flowing down from the substrate and the processing liquid Guided to the above measuring unit. 4. The substrate processing apparatus according to claim 1 or 2, wherein the substrate processing apparatus includes a supply amount control unit that controls a supply amount of the processing liquid supplied to the substrate based on a measurement result of the physical quantity. 5. The substrate processing apparatus according to claim 4, wherein the supply amount control means controls the supply amount of the processing liquid per unit time based on the measurement result. 6. The substrate processing apparatus according to claim 4, wherein the supply amount control means controls the supply time of the supply of the processing liquid to the substrate 129948.doc 200903599 based on the measurement result. The substrate processing apparatus according to claim 6, wherein the processing liquid is supplied to the substrate while the substrate is being transported, and the supply amount control means controls the transport speed of the substrate based on the measurement result. 8. The substrate processing apparatus according to claim 4, wherein when the measuring means is a first measuring means, further comprising a second meandering mechanism different from the first weir mechanism, the second measuring means measuring and supplying to the substrate The supply amount control means controls the supply amount based on the difference between the measurement results of the first and second enthalpy mechanisms. 9. The substrate processing apparatus according to claim 2 or 2, comprising: a circulation system for treating liquid, which is used in the treatment of the above treatment tank and used again in the treatment tank using the recovered treatment liquid ; a draining mechanism that discharges a treatment liquid recovered after use in a treatment liquid circulating in the circulation system from the circulation system; a new liquid introduction mechanism that introduces a new treatment liquid into the circulation system; and a replacement control mechanism The liquid discharge mechanism and the new liquid introduction mechanism are controlled based on the measurement results of the measurement unit to replace the treatment liquid in the circulation system. 10. The substrate processing apparatus of claim 4, comprising a first processing tank and a second processing tank as the processing tank, the 129948.doc 200903599 second processing tank is used and the first processing tank is ended in the first processing tank Treatment base: 21: a treatment liquid for treating a substrate, and a supply system including a treatment liquid, which is used for treating the treatment liquid which is used in the second treatment tank and recovered after use. In the processing in the first processing tank, the measuring unit is disposed in the first processing tank, and the supply amount control unit controls the supply amount of the processing liquid to the substrate in the first processing tank based on the measurement result, and At least one of the supply amount of the processing liquid is supplied to the substrate in the second processing tank. 129948.doc