JP2016021599A5 - - Google Patents
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- JP2016021599A5 JP2016021599A5 JP2015216054A JP2015216054A JP2016021599A5 JP 2016021599 A5 JP2016021599 A5 JP 2016021599A5 JP 2015216054 A JP2015216054 A JP 2015216054A JP 2015216054 A JP2015216054 A JP 2015216054A JP 2016021599 A5 JP2016021599 A5 JP 2016021599A5
- Authority
- JP
- Japan
- Prior art keywords
- active species
- processing
- liquid
- substrate
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 claims description 377
- 238000005530 etching Methods 0.000 claims description 271
- 239000000758 substrate Substances 0.000 claims description 240
- 230000007246 mechanism Effects 0.000 claims description 134
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 96
- 229910052710 silicon Inorganic materials 0.000 claims description 96
- 239000010703 silicon Substances 0.000 claims description 96
- 238000000034 method Methods 0.000 claims description 91
- 230000008569 process Effects 0.000 claims description 77
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 72
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical compound ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 claims description 72
- 238000011084 recovery Methods 0.000 claims description 46
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 claims description 32
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 19
- 229910017604 nitric acid Inorganic materials 0.000 claims description 19
- 238000002156 mixing Methods 0.000 claims description 18
- 238000003672 processing method Methods 0.000 claims description 12
- 230000004913 activation Effects 0.000 claims description 11
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 166
- 235000012431 wafers Nutrition 0.000 description 58
- 238000010586 diagram Methods 0.000 description 31
- 239000000126 substance Substances 0.000 description 23
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 18
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000002699 waste material Substances 0.000 description 6
- 239000011550 stock solution Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 235000015073 liquid stocks Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015216054A JP6139634B2 (ja) | 2015-11-02 | 2015-11-02 | 基板処理方法及び基板処理システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015216054A JP6139634B2 (ja) | 2015-11-02 | 2015-11-02 | 基板処理方法及び基板処理システム |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011277349A Division JP5858770B2 (ja) | 2011-12-19 | 2011-12-19 | 基板処理システム |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016246855A Division JP6317801B2 (ja) | 2016-12-20 | 2016-12-20 | 基板処理システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016021599A JP2016021599A (ja) | 2016-02-04 |
| JP2016021599A5 true JP2016021599A5 (https=) | 2016-03-24 |
| JP6139634B2 JP6139634B2 (ja) | 2017-05-31 |
Family
ID=55266208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015216054A Active JP6139634B2 (ja) | 2015-11-02 | 2015-11-02 | 基板処理方法及び基板処理システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6139634B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599730A (zh) * | 2020-06-22 | 2020-08-28 | 上海华力微电子有限公司 | 刻蚀液供给装置及方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3077304B2 (ja) * | 1991-10-09 | 2000-08-14 | 日産自動車株式会社 | エッチング装置 |
| JPH1126425A (ja) * | 1997-06-30 | 1999-01-29 | Sumitomo Metal Ind Ltd | 半導体基板のエッチング方法及びその装置 |
| JP3653416B2 (ja) * | 1999-05-19 | 2005-05-25 | 沖電気工業株式会社 | エッチング方法およびエッチング装置 |
| DE10248481B4 (de) * | 2002-10-17 | 2006-04-27 | Siltronic Ag | Verfahren und Vorrichtung zur nasschemischen Behandlung von Silicium |
-
2015
- 2015-11-02 JP JP2015216054A patent/JP6139634B2/ja active Active
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