JP6139634B2 - 基板処理方法及び基板処理システム - Google Patents

基板処理方法及び基板処理システム Download PDF

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JP6139634B2
JP6139634B2 JP2015216054A JP2015216054A JP6139634B2 JP 6139634 B2 JP6139634 B2 JP 6139634B2 JP 2015216054 A JP2015216054 A JP 2015216054A JP 2015216054 A JP2015216054 A JP 2015216054A JP 6139634 B2 JP6139634 B2 JP 6139634B2
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processing
liquid
active species
substrate
etching
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JP2016021599A5 (https=
JP2016021599A (ja
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林　航之介
航之介 林
絵美 松井
絵美 松井
晴香 中野
晴香 中野
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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JP2011277349A Division JP5858770B2 (ja) 2011-12-19 2011-12-19 基板処理システム

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JP2016246855A Division JP6317801B2 (ja) 2016-12-20 2016-12-20 基板処理システム

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JP2016021599A JP2016021599A (ja) 2016-02-04
JP2016021599A5 JP2016021599A5 (https=) 2016-03-24
JP6139634B2 true JP6139634B2 (ja) 2017-05-31

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CN111599730A (zh) * 2020-06-22 2020-08-28 上海华力微电子有限公司 刻蚀液供给装置及方法

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JP3077304B2 (ja) * 1991-10-09 2000-08-14 日産自動車株式会社 エッチング装置
JPH1126425A (ja) * 1997-06-30 1999-01-29 Sumitomo Metal Ind Ltd 半導体基板のエッチング方法及びその装置
JP3653416B2 (ja) * 1999-05-19 2005-05-25 沖電気工業株式会社 エッチング方法およびエッチング装置
DE10248481B4 (de) * 2002-10-17 2006-04-27 Siltronic Ag Verfahren und Vorrichtung zur nasschemischen Behandlung von Silicium

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