JP2006525429A5 - - Google Patents

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Publication number
JP2006525429A5
JP2006525429A5 JP2006506167A JP2006506167A JP2006525429A5 JP 2006525429 A5 JP2006525429 A5 JP 2006525429A5 JP 2006506167 A JP2006506167 A JP 2006506167A JP 2006506167 A JP2006506167 A JP 2006506167A JP 2006525429 A5 JP2006525429 A5 JP 2006525429A5
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JP
Japan
Prior art keywords
processing
solution
degassing
workpiece
degassed
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Withdrawn
Application number
JP2006506167A
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English (en)
Japanese (ja)
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JP2006525429A (ja
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Priority claimed from US10/425,782 external-priority patent/US7189146B2/en
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Publication of JP2006525429A publication Critical patent/JP2006525429A/ja
Publication of JP2006525429A5 publication Critical patent/JP2006525429A5/ja
Withdrawn legal-status Critical Current

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JP2006506167A 2003-04-29 2004-04-23 湿式処理層の欠陥減少方法及びその装置 Withdrawn JP2006525429A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/425,782 US7189146B2 (en) 2003-03-27 2003-04-29 Method for reduction of defects in wet processed layers
PCT/GB2004/001739 WO2004097929A2 (en) 2003-04-29 2004-04-23 Method and apparatus for reduction of defects in wet processed layers

Publications (2)

Publication Number Publication Date
JP2006525429A JP2006525429A (ja) 2006-11-09
JP2006525429A5 true JP2006525429A5 (https=) 2007-08-16

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ID=33415924

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JP2006506167A Withdrawn JP2006525429A (ja) 2003-04-29 2004-04-23 湿式処理層の欠陥減少方法及びその装置

Country Status (5)

Country Link
US (3) US7189146B2 (https=)
JP (1) JP2006525429A (https=)
KR (1) KR20060007045A (https=)
TW (1) TW200503103A (https=)
WO (1) WO2004097929A2 (https=)

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US8168540B1 (en) * 2009-12-29 2012-05-01 Novellus Systems, Inc. Methods and apparatus for depositing copper on tungsten
US9816193B2 (en) * 2011-01-07 2017-11-14 Novellus Systems, Inc. Configuration and method of operation of an electrodeposition system for improved process stability and performance
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JP6397620B2 (ja) * 2012-12-11 2018-09-26 ノベラス・システムズ・インコーポレーテッドＮｏｖｅｌｌｕｓ Ｓｙｓｔｅｍｓ Ｉｎｃｏｒｐｏｒａｔｅｄ 電気メッキの方法及び装置
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
TWI517935B (zh) * 2013-04-16 2016-01-21 國立台灣科技大學 氣體添加硏磨液的供應系統及其方法
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