FR2416958A1 - Procede d'obtention d'un depot de metal sur de petites pieces usinees et dispositif pour la mise en oeuvre de ce procede - Google Patents

Procede d'obtention d'un depot de metal sur de petites pieces usinees et dispositif pour la mise en oeuvre de ce procede

Info

Publication number
FR2416958A1
FR2416958A1 FR7803692A FR7803692A FR2416958A1 FR 2416958 A1 FR2416958 A1 FR 2416958A1 FR 7803692 A FR7803692 A FR 7803692A FR 7803692 A FR7803692 A FR 7803692A FR 2416958 A1 FR2416958 A1 FR 2416958A1
Authority
FR
France
Prior art keywords
bath
workpieces
mechanically
chemical deposition
soln
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7803692A
Other languages
English (en)
Other versions
FR2416958B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Priority to FR7803692A priority Critical patent/FR2416958A1/fr
Publication of FR2416958A1 publication Critical patent/FR2416958A1/fr
Application granted granted Critical
Publication of FR2416958B1 publication Critical patent/FR2416958B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1666—Ultrasonics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Abstract

Procédé d'obtention d'un dépôt de métal sur de petites pièces usinées et dispositif pour la mise en oeuvre de ce procédé. Selon la présente invention, un dépôt métallique est obtenu sur de petites pièces usinées en plaçant ces pièces dans un récipient contenant un bain à dépôt chimique, en soumettant ces pièces à une agitation mécanique, en évacuant l'air occupant l'espace libre au-dessus du bain et en soumettant le bain et les pièces qui y sont plongées à l'action d'ultrasons. Application au dépôt de métal à l'intérieur de trous borgnes miniatures.
FR7803692A 1978-02-09 1978-02-09 Procede d'obtention d'un depot de metal sur de petites pieces usinees et dispositif pour la mise en oeuvre de ce procede Granted FR2416958A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7803692A FR2416958A1 (fr) 1978-02-09 1978-02-09 Procede d'obtention d'un depot de metal sur de petites pieces usinees et dispositif pour la mise en oeuvre de ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7803692A FR2416958A1 (fr) 1978-02-09 1978-02-09 Procede d'obtention d'un depot de metal sur de petites pieces usinees et dispositif pour la mise en oeuvre de ce procede

Publications (2)

Publication Number Publication Date
FR2416958A1 true FR2416958A1 (fr) 1979-09-07
FR2416958B1 FR2416958B1 (fr) 1980-10-17

Family

ID=9204408

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7803692A Granted FR2416958A1 (fr) 1978-02-09 1978-02-09 Procede d'obtention d'un depot de metal sur de petites pieces usinees et dispositif pour la mise en oeuvre de ce procede

Country Status (1)

Country Link
FR (1) FR2416958A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004097929A2 (fr) * 2003-04-29 2004-11-11 Asm Nutool, Inc. Procede et appareil permettant de reduire les defauts dans des couches traitees par voie humide

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1032574A (en) * 1962-06-06 1966-06-08 Daystrom Inc Electrical resistors

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1032574A (en) * 1962-06-06 1966-06-08 Daystrom Inc Electrical resistors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7503830B2 (en) 2003-03-27 2009-03-17 Novellus Systems, Inc. Apparatus for reduction of defects in wet processed layers
WO2004097929A2 (fr) * 2003-04-29 2004-11-11 Asm Nutool, Inc. Procede et appareil permettant de reduire les defauts dans des couches traitees par voie humide
WO2004097929A3 (fr) * 2003-04-29 2004-12-29 Asm Nutool Inc Procede et appareil permettant de reduire les defauts dans des couches traitees par voie humide

Also Published As

Publication number Publication date
FR2416958B1 (fr) 1980-10-17

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Legal Events

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