TWI500371B - 檢查記號及具有其之印刷電路板 - Google Patents

檢查記號及具有其之印刷電路板 Download PDF

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Publication number
TWI500371B
TWI500371B TW101109545A TW101109545A TWI500371B TW I500371 B TWI500371 B TW I500371B TW 101109545 A TW101109545 A TW 101109545A TW 101109545 A TW101109545 A TW 101109545A TW I500371 B TWI500371 B TW I500371B
Authority
TW
Taiwan
Prior art keywords
pattern
voltage application
opening
terminals
length
Prior art date
Application number
TW101109545A
Other languages
English (en)
Chinese (zh)
Other versions
TW201325359A (zh
Inventor
Sang Yoon Lee
Kyoung Ro Yoon
Soon Jin Cho
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201325359A publication Critical patent/TW201325359A/zh
Application granted granted Critical
Publication of TWI500371B publication Critical patent/TWI500371B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW101109545A 2011-12-09 2012-03-20 檢查記號及具有其之印刷電路板 TWI500371B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110131500A KR101499281B1 (ko) 2011-12-09 2011-12-09 검사용 마크 및 이를 갖는 인쇄회로기판

Publications (2)

Publication Number Publication Date
TW201325359A TW201325359A (zh) 2013-06-16
TWI500371B true TWI500371B (zh) 2015-09-11

Family

ID=48774825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101109545A TWI500371B (zh) 2011-12-09 2012-03-20 檢查記號及具有其之印刷電路板

Country Status (3)

Country Link
JP (1) JP5829165B2 (ja)
KR (1) KR101499281B1 (ja)
TW (1) TWI500371B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104573160A (zh) * 2013-10-25 2015-04-29 英业达科技有限公司 印刷电路检查方法与装置
TWI471066B (zh) * 2013-11-06 2015-01-21 Inventec Corp 印刷電路檢查方法與裝置
JP6852375B2 (ja) * 2016-12-08 2021-03-31 凸版印刷株式会社 無電解ニッケルめっき管理方法及び配線基板の製造方法
JP7277279B2 (ja) * 2019-06-20 2023-05-18 ファナック株式会社 劣化検出用プリント配線基板
TWI723829B (zh) * 2020-04-01 2021-04-01 頎邦科技股份有限公司 線路板
KR20220037857A (ko) 2020-09-18 2022-03-25 삼성전기주식회사 인쇄회로기판
TWI777806B (zh) * 2021-10-07 2022-09-11 易華電子股份有限公司 具有檢測標記之電路板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004045194A (ja) * 2002-07-11 2004-02-12 Nec Toppan Circuit Solutions Toyama Inc プリント配線基板の検査方法
WO2004111660A2 (en) * 2003-06-05 2004-12-23 Yieldboost Tech, Inc. System and method for classifying defects in and identifying process problems for an electrical circuit
TW201036311A (en) * 2009-03-31 2010-10-01 Semiconductor Components Ind Compensation method and circuit
JP2010263091A (ja) * 2009-05-07 2010-11-18 Fujitsu Semiconductor Ltd 配線基板の製造方法及び配線基板の検査方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3288320B2 (ja) * 1998-12-21 2002-06-04 沖電気工業株式会社 レジストマーク
JP2001024303A (ja) * 1999-07-09 2001-01-26 Nippon Avionics Co Ltd 認識マーク
JP2002064297A (ja) * 2000-08-22 2002-02-28 Nec Ibaraki Ltd 基板の位置合わせ装置
KR100894179B1 (ko) * 2007-10-26 2009-04-22 삼성전기주식회사 기판 스트립

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004045194A (ja) * 2002-07-11 2004-02-12 Nec Toppan Circuit Solutions Toyama Inc プリント配線基板の検査方法
WO2004111660A2 (en) * 2003-06-05 2004-12-23 Yieldboost Tech, Inc. System and method for classifying defects in and identifying process problems for an electrical circuit
TW201036311A (en) * 2009-03-31 2010-10-01 Semiconductor Components Ind Compensation method and circuit
JP2010263091A (ja) * 2009-05-07 2010-11-18 Fujitsu Semiconductor Ltd 配線基板の製造方法及び配線基板の検査方法

Also Published As

Publication number Publication date
JP5829165B2 (ja) 2015-12-09
JP2013123026A (ja) 2013-06-20
TW201325359A (zh) 2013-06-16
KR101499281B1 (ko) 2015-03-06
KR20130064891A (ko) 2013-06-19

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