TWI497673B - 用於窄互相連接開口之大晶粒尺寸傳導結構 - Google Patents

用於窄互相連接開口之大晶粒尺寸傳導結構 Download PDF

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Publication number
TWI497673B
TWI497673B TW099130515A TW99130515A TWI497673B TW I497673 B TWI497673 B TW I497673B TW 099130515 A TW099130515 A TW 099130515A TW 99130515 A TW99130515 A TW 99130515A TW I497673 B TWI497673 B TW I497673B
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TW
Taiwan
Prior art keywords
conductive
opening
metal
layer
forming
Prior art date
Application number
TW099130515A
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English (en)
Chinese (zh)
Other versions
TW201126683A (en
Inventor
楊智超
丹尼爾Ｃ 艾德爾史汀
野上毅
史帝芬Ｍ 羅森吉
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萬國商業機器公司
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Publication of TW201126683A publication Critical patent/TW201126683A/zh
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Publication of TWI497673B publication Critical patent/TWI497673B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/042—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/035—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/041—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being discontinuous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/034—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics bottomless barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/083—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts the openings being via holes penetrating underlying conductors

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW099130515A 2009-09-16 2010-09-09 用於窄互相連接開口之大晶粒尺寸傳導結構 TWI497673B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/560,878 US7956463B2 (en) 2009-09-16 2009-09-16 Large grain size conductive structure for narrow interconnect openings

Publications (2)

Publication Number Publication Date
TW201126683A TW201126683A (en) 2011-08-01
TWI497673B true TWI497673B (zh) 2015-08-21

Family

ID=43064611

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099130515A TWI497673B (zh) 2009-09-16 2010-09-09 用於窄互相連接開口之大晶粒尺寸傳導結構

Country Status (7)

Country Link
US (1) US7956463B2 (https=)
JP (1) JP5444471B2 (https=)
CN (1) CN102498560A (https=)
DE (1) DE112010003659T5 (https=)
GB (1) GB2485689B (https=)
TW (1) TWI497673B (https=)
WO (1) WO2011032812A1 (https=)

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Also Published As

Publication number Publication date
US7956463B2 (en) 2011-06-07
JP5444471B2 (ja) 2014-03-19
WO2011032812A1 (en) 2011-03-24
JP2013504886A (ja) 2013-02-07
US20110062587A1 (en) 2011-03-17
GB2485689A (en) 2012-05-23
CN102498560A (zh) 2012-06-13
TW201126683A (en) 2011-08-01
GB2485689B (en) 2013-06-12
GB201200519D0 (en) 2012-02-29
DE112010003659T5 (de) 2012-10-31

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