TWI497577B - A substrate processing method and a substrate processing apparatus - Google Patents

A substrate processing method and a substrate processing apparatus Download PDF

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Publication number
TWI497577B
TWI497577B TW096136351A TW96136351A TWI497577B TW I497577 B TWI497577 B TW I497577B TW 096136351 A TW096136351 A TW 096136351A TW 96136351 A TW96136351 A TW 96136351A TW I497577 B TWI497577 B TW I497577B
Authority
TW
Taiwan
Prior art keywords
substrate
processing
plasma
wafer
organic substance
Prior art date
Application number
TW096136351A
Other languages
English (en)
Chinese (zh)
Other versions
TW200832535A (en
Inventor
川村茂
林輝幸
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW200832535A publication Critical patent/TW200832535A/zh
Application granted granted Critical
Publication of TWI497577B publication Critical patent/TWI497577B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/093—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts
    • H10W20/095—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts by irradiating with electromagnetic or particle radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/093—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts
    • H10W20/097—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts by thermally treating

Landscapes

  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096136351A 2006-09-29 2007-09-28 A substrate processing method and a substrate processing apparatus TWI497577B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006269304A JP4661753B2 (ja) 2006-09-29 2006-09-29 基板処理方法、洗浄方法及び記憶媒体

Publications (2)

Publication Number Publication Date
TW200832535A TW200832535A (en) 2008-08-01
TWI497577B true TWI497577B (zh) 2015-08-21

Family

ID=39230250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096136351A TWI497577B (zh) 2006-09-29 2007-09-28 A substrate processing method and a substrate processing apparatus

Country Status (6)

Country Link
US (1) US8647440B2 (https=)
JP (1) JP4661753B2 (https=)
KR (1) KR101167355B1 (https=)
CN (2) CN101421828B (https=)
TW (1) TWI497577B (https=)
WO (1) WO2008038823A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2166564B1 (en) * 2008-09-19 2017-04-12 Imec Method for removing a hardened photoresist from a semiconductor substrate
US8528224B2 (en) * 2009-11-12 2013-09-10 Novellus Systems, Inc. Systems and methods for at least partially converting films to silicon oxide and/or improving film quality using ultraviolet curing in steam and densification of films using UV curing in ammonia
JP5859262B2 (ja) * 2011-09-29 2016-02-10 東京エレクトロン株式会社 堆積物除去方法
JP5996857B2 (ja) * 2011-09-30 2016-09-21 東京エレクトロン株式会社 駆動装置及び基板処理システム
JP6024272B2 (ja) * 2011-12-22 2016-11-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP5837829B2 (ja) * 2012-01-11 2015-12-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6017170B2 (ja) * 2012-04-18 2016-10-26 東京エレクトロン株式会社 堆積物除去方法及びガス処理装置
JP6381332B2 (ja) * 2013-09-19 2018-08-29 浜松ホトニクス株式会社 半導体デバイスの製造方法
CN104576305A (zh) * 2013-10-23 2015-04-29 中微半导体设备(上海)有限公司 自清洁真空处理腔室
JP6428466B2 (ja) * 2014-06-23 2018-11-28 東京エレクトロン株式会社 基板処理方法、基板処理装置、基板処理システム及び記憶媒体
CN105448760A (zh) * 2014-08-20 2016-03-30 中芯国际集成电路制造(上海)有限公司 一种提高晶圆测试稳定性的方法
US10872760B2 (en) * 2016-07-26 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Cluster tool and manufacuturing method of semiconductor structure using the same
CN106847745A (zh) * 2017-03-03 2017-06-13 京东方科技集团股份有限公司 一种低温多晶硅基板的制作方法和低温多晶硅基板
JP7126468B2 (ja) * 2019-03-20 2022-08-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7315376B2 (ja) * 2019-05-24 2023-07-26 東京応化工業株式会社 基板洗浄方法、基板洗浄装置及び基板洗浄用キット
KR102633148B1 (ko) 2019-05-28 2024-02-06 삼성전자주식회사 관통 비아를 포함하는 반도체 장치 및 이의 제조 방법
CN114496737B (zh) * 2020-11-12 2024-09-13 长鑫存储技术有限公司 半导体器件及其制造方法
JP7653814B2 (ja) * 2021-03-18 2025-03-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、および、基板処理装置
US20230268223A1 (en) * 2022-02-24 2023-08-24 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor devices and methods of manufacture

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0483340A (ja) * 1990-07-26 1992-03-17 Dainippon Screen Mfg Co Ltd 基板の洗浄処理方法及び洗浄処理装置
US6465374B1 (en) * 1997-10-21 2002-10-15 Fsi International, Inc. Method of surface preparation
US20040203251A1 (en) * 2003-02-14 2004-10-14 Kawaguchi Mark N. Method and apparatus for removing a halogen-containing residue
US6831018B2 (en) * 2001-08-21 2004-12-14 Matsushita Electric Industrial Co., Ltd. Method for fabricating semiconductor device
JP2005052967A (ja) * 2004-10-15 2005-03-03 Sumitomo Precision Prod Co Ltd エッチング表面の洗浄方法
US20050245099A1 (en) * 2004-04-23 2005-11-03 Atsushi Endo Film formation apparatus and method of using the same
US20060093969A1 (en) * 2004-11-04 2006-05-04 Nec Lcd Technologies, Ltd Method of processing substrate and chemical used in the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708462B2 (ja) * 1988-04-28 1998-02-04 株式会社日立製作所 半導体基板の表面処理方法、半導体基板の表面処理装置及び半導体基板表面処理膜
JP2000173965A (ja) * 1998-12-07 2000-06-23 Japan Science & Technology Corp 高速剪断流による洗浄方法
JP2005228790A (ja) * 2004-02-10 2005-08-25 Mitsubishi Electric Corp レジスト除去方法およびレジスト除去装置ならびに半導体ウエハ
JP4349273B2 (ja) * 2004-12-17 2009-10-21 セイコーエプソン株式会社 成膜方法、液体供給ヘッドおよび液体供給装置
JP4308806B2 (ja) * 2004-12-21 2009-08-05 セイコーエプソン株式会社 半導体基板の処理方法、半導体部品および電子機器
US8057153B2 (en) * 2006-09-05 2011-11-15 Tokyo Electron Limited Substrate transfer device, substrate processing apparatus and substrate transfer method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0483340A (ja) * 1990-07-26 1992-03-17 Dainippon Screen Mfg Co Ltd 基板の洗浄処理方法及び洗浄処理装置
US6465374B1 (en) * 1997-10-21 2002-10-15 Fsi International, Inc. Method of surface preparation
US6831018B2 (en) * 2001-08-21 2004-12-14 Matsushita Electric Industrial Co., Ltd. Method for fabricating semiconductor device
US20040203251A1 (en) * 2003-02-14 2004-10-14 Kawaguchi Mark N. Method and apparatus for removing a halogen-containing residue
US20050245099A1 (en) * 2004-04-23 2005-11-03 Atsushi Endo Film formation apparatus and method of using the same
JP2005052967A (ja) * 2004-10-15 2005-03-03 Sumitomo Precision Prod Co Ltd エッチング表面の洗浄方法
US20060093969A1 (en) * 2004-11-04 2006-05-04 Nec Lcd Technologies, Ltd Method of processing substrate and chemical used in the same

Also Published As

Publication number Publication date
WO2008038823A1 (en) 2008-04-03
KR20090057065A (ko) 2009-06-03
CN101421828A (zh) 2009-04-29
KR101167355B1 (ko) 2012-07-19
US20100043820A1 (en) 2010-02-25
CN101421828B (zh) 2011-03-30
CN101958233A (zh) 2011-01-26
JP2008091534A (ja) 2008-04-17
US8647440B2 (en) 2014-02-11
CN101958233B (zh) 2013-01-02
TW200832535A (en) 2008-08-01
JP4661753B2 (ja) 2011-03-30

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