TWI495655B - 密封用組成物以及密封板 - Google Patents
密封用組成物以及密封板 Download PDFInfo
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- TWI495655B TWI495655B TW099111953A TW99111953A TWI495655B TW I495655 B TWI495655 B TW I495655B TW 099111953 A TW099111953 A TW 099111953A TW 99111953 A TW99111953 A TW 99111953A TW I495655 B TWI495655 B TW I495655B
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/048—Forming gas barrier coatings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Epoxy Resins (AREA)
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009101187 | 2009-04-17 |
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| TW201038610A TW201038610A (en) | 2010-11-01 |
| TWI495655B true TWI495655B (zh) | 2015-08-11 |
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| TW099111953A TWI495655B (zh) | 2009-04-17 | 2010-04-16 | 密封用組成物以及密封板 |
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| JP (1) | JP5696038B2 (ja) |
| KR (1) | KR101340253B1 (ja) |
| CN (1) | CN102388078B (ja) |
| HK (1) | HK1164349A1 (ja) |
| TW (1) | TWI495655B (ja) |
| WO (1) | WO2010119706A1 (ja) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5651421B2 (ja) * | 2010-10-07 | 2015-01-14 | 三井化学株式会社 | 封止用組成物及びそれを用いた封止用シート |
| EP2637229B1 (en) * | 2010-11-02 | 2018-01-03 | LG Chem, Ltd. | Adhesive film and method for encapsulating organic electronic device using the same |
| WO2012176472A1 (ja) * | 2011-06-23 | 2012-12-27 | 三井化学株式会社 | 光半導体用の面封止剤、それを用いた有機ｅｌデバイスの製造方法、有機ｅｌデバイスおよび有機ｅｌディスプレイパネル |
| KR20140048252A (ko) * | 2011-08-22 | 2014-04-23 | 미쓰이 가가쿠 가부시키가이샤 | 시트상 에폭시 수지 조성물 및 이를 포함하는 봉지용 시트 |
| KR101623670B1 (ko) * | 2012-01-18 | 2016-05-23 | 미쓰이 가가쿠 가부시키가이샤 | 조성물, 조성물로 이루어지는 표시 디바이스 단면 시일제, 표시 디바이스 및 그의 제조 방법 |
| CN104105733A (zh) * | 2012-02-10 | 2014-10-15 | 三井化学株式会社 | 有机el元件用面封装剂、使用该面封装剂的有机el装置及其制造方法 |
| KR102055869B1 (ko) * | 2012-07-05 | 2019-12-13 | 쓰리본드 화인 케미칼 가부시키가이샤 | 시트형상 접착제 및 이 시트형상 접착제를 사용한 유기 el 패널 |
| CN104870515B (zh) * | 2012-12-21 | 2017-07-07 | 三井化学株式会社 | 片状环氧树脂组合物、使用其的有机el器件的制造方法、有机el器件及有机el显示面板 |
| KR101483268B1 (ko) * | 2013-05-27 | 2015-01-15 | 도레이첨단소재 주식회사 | 투명 기판용 접착제 조성물 및 이를 이용한 투명 기판용 접착 필름 |
| WO2015146935A1 (ja) * | 2014-03-27 | 2015-10-01 | リンテック株式会社 | 封止シート、封止構造体及び装置 |
| JP2017186229A (ja) * | 2016-04-01 | 2017-10-12 | 旭硝子株式会社 | 車両用合わせガラス |
| JP6843664B2 (ja) * | 2017-03-23 | 2021-03-17 | 三井化学株式会社 | 表示素子用シール材およびこれを含む有機ｅｌ素子用面封止材、有機ｅｌデバイスおよびその製造方法、有機ｅｌディスプレイパネル、ならびに有機ｅｌ照明 |
| KR101891737B1 (ko) * | 2017-04-28 | 2018-09-28 | 주식회사 엘지화학 | 밀봉재 조성물 |
| CN110603277B (zh) * | 2017-06-23 | 2022-05-03 | 三井化学株式会社 | 图像显示装置密封材料及图像显示装置密封片 |
| WO2019065455A1 (ja) * | 2017-09-29 | 2019-04-04 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
| JP7109940B2 (ja) * | 2018-03-08 | 2022-08-01 | 日東電工株式会社 | 封止用接着シート |
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| JP2006179318A (ja) * | 2004-12-22 | 2006-07-06 | Three Bond Co Ltd | 有機ｅｌ素子封止用熱硬化型組成物 |
| CN101243117A (zh) * | 2005-10-24 | 2008-08-13 | 三邦株式会社 | 有机el组件密封用热硬化型组合物 |
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| CA1326096C (en) * | 1988-08-19 | 1994-01-11 | Katugi Kitagawa | Epoxy resin powder coating composition with excellent adhesibility |
| JPH02142820A (ja) * | 1988-11-22 | 1990-05-31 | Hitachi Chem Co Ltd | マルチワイヤー配線板用絶縁層 |
| JP3104314B2 (ja) * | 1991-05-16 | 2000-10-30 | 日立化成工業株式会社 | エポキシ樹脂組成物 |
| JP2005035189A (ja) * | 2003-07-16 | 2005-02-10 | Nitto Denko Corp | フィラー分散系樹脂シート、画像表示装置用基板および画像表示装置 |
| JP2006089651A (ja) * | 2004-09-24 | 2006-04-06 | Dainippon Printing Co Ltd | アンカー層形成用塗工液およびバリア性基板、ならびにそれらの製造方法 |
| JP4398500B2 (ja) * | 2007-04-06 | 2010-01-13 | 株式会社日本触媒 | 樹脂組成物及び光学部材 |
| JP2009019077A (ja) * | 2007-07-10 | 2009-01-29 | Kyocera Chemical Corp | 硬化性組成物、表示素子用接着剤及び接着方法 |
| JP2009235162A (ja) * | 2008-03-26 | 2009-10-15 | Toray Ind Inc | 熱硬化性樹脂組成物 |
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2010
- 2010-04-16 WO PCT/JP2010/002785 patent/WO2010119706A1/ja active Application Filing
- 2010-04-16 CN CN2010800163263A patent/CN102388078B/zh active Active
- 2010-04-16 TW TW099111953A patent/TWI495655B/zh active
- 2010-04-16 KR KR1020117023977A patent/KR101340253B1/ko active IP Right Grant
- 2010-04-16 JP JP2011509227A patent/JP5696038B2/ja active Active
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006179318A (ja) * | 2004-12-22 | 2006-07-06 | Three Bond Co Ltd | 有機ｅｌ素子封止用熱硬化型組成物 |
| CN101243117A (zh) * | 2005-10-24 | 2008-08-13 | 三邦株式会社 | 有机el组件密封用热硬化型组合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5696038B2 (ja) | 2015-04-08 |
| TW201038610A (en) | 2010-11-01 |
| CN102388078A (zh) | 2012-03-21 |
| JPWO2010119706A1 (ja) | 2012-10-22 |
| KR20120009447A (ko) | 2012-01-31 |
| WO2010119706A1 (ja) | 2010-10-21 |
| HK1164349A1 (en) | 2012-09-21 |
| CN102388078B (zh) | 2013-09-25 |
| KR101340253B1 (ko) | 2013-12-10 |
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