HK1164349A1 - Sealing composite and sealing sheet - Google Patents

Sealing composite and sealing sheet

Info

Publication number
HK1164349A1
HK1164349A1 HK12104950.6A HK12104950A HK1164349A1 HK 1164349 A1 HK1164349 A1 HK 1164349A1 HK 12104950 A HK12104950 A HK 12104950A HK 1164349 A1 HK1164349 A1 HK 1164349A1
Authority
HK
Hong Kong
Prior art keywords
sealing
composite
sheet
sealing sheet
sealing composite
Prior art date
Application number
HK12104950.6A
Inventor
Yasushi Takamatsu
Kenji Suzuki
Yugo Yamamoto
Yuichi Ito
Original Assignee
Mitsui Chemicalsinc Mitsui Kagaku Kabushikigaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicalsinc Mitsui Kagaku Kabushikigaisha filed Critical Mitsui Chemicalsinc Mitsui Kagaku Kabushikigaisha
Publication of HK1164349A1 publication Critical patent/HK1164349A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/048—Forming gas barrier coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
HK12104950.6A 2009-04-17 2012-05-21 Sealing composite and sealing sheet HK1164349A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009101187 2009-04-17
PCT/JP2010/002785 WO2010119706A1 (en) 2009-04-17 2010-04-16 Sealing composite and sealing sheet

Publications (1)

Publication Number Publication Date
HK1164349A1 true HK1164349A1 (en) 2012-09-21

Family

ID=42982378

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12104950.6A HK1164349A1 (en) 2009-04-17 2012-05-21 Sealing composite and sealing sheet

Country Status (6)

Country Link
JP (1) JP5696038B2 (en)
KR (1) KR101340253B1 (en)
CN (1) CN102388078B (en)
HK (1) HK1164349A1 (en)
TW (1) TWI495655B (en)
WO (1) WO2010119706A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5651421B2 (en) * 2010-10-07 2015-01-14 三井化学株式会社 Sealing composition and sealing sheet using the same
CN108084936B (en) * 2010-11-02 2021-05-18 Lg化学株式会社 Adhesive and method for encapsulating organic electronic device using the same
KR101604896B1 (en) * 2011-06-23 2016-03-18 미쓰이 가가쿠 가부시키가이샤 Surface sealant for optical semiconductor, method for manufacturing organic el device using same, organic el device, and organic el display panel
JPWO2013027389A1 (en) * 2011-08-22 2015-03-05 三井化学株式会社 Sheet-like epoxy resin composition and sealing sheet containing the same
JP6113082B2 (en) * 2012-01-18 2017-04-19 三井化学株式会社 Sealing agent, display device end face sealing agent, display device, and manufacturing method thereof
KR101682781B1 (en) * 2012-02-10 2016-12-05 미쓰이 가가쿠 가부시키가이샤 Surface sealing agent for organic el element, organic el device using same, and manufacturing method for same
KR102055869B1 (en) * 2012-07-05 2019-12-13 쓰리본드 화인 케미칼 가부시키가이샤 Sheet adhesive and organic el panel using same
WO2014097647A1 (en) * 2012-12-21 2014-06-26 三井化学株式会社 Sheet-like epoxy resin composition, method for manufacturing organic el device using same, organic el device and organic el display panel
KR101483268B1 (en) * 2013-05-27 2015-01-15 도레이첨단소재 주식회사 Adhesive Composition for Transparent Substrates and Film Adhesive Film for Transparent Substrates Using the Same
US20180170022A1 (en) * 2014-03-27 2018-06-21 Lintec Corporation Sealing sheet, and sealing structure and device
JP2017186229A (en) * 2016-04-01 2017-10-12 旭硝子株式会社 Glass laminate for vehicle
JP6843664B2 (en) * 2017-03-23 2021-03-17 三井化学株式会社 Sealing materials for display elements and surface encapsulants for organic EL elements including them, organic EL devices and their manufacturing methods, organic EL display panels, and organic EL lighting.
KR101891737B1 (en) * 2017-04-28 2018-09-28 주식회사 엘지화학 Encapsulating composition
CN110603277B (en) * 2017-06-23 2022-05-03 三井化学株式会社 Image display device sealing material and image display device sealing sheet
CN110741046B (en) * 2017-09-29 2022-05-17 三井化学株式会社 Image display device sealing material and image display device sealing sheet
JP7109940B2 (en) * 2018-03-08 2022-08-01 日東電工株式会社 Sealing adhesive sheet

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1326096C (en) * 1988-08-19 1994-01-11 Katugi Kitagawa Epoxy resin powder coating composition with excellent adhesibility
JPH02142820A (en) * 1988-11-22 1990-05-31 Hitachi Chem Co Ltd Insulation layer for multiwire wiring board
JP3104314B2 (en) * 1991-05-16 2000-10-30 日立化成工業株式会社 Epoxy resin composition
JP2005035189A (en) * 2003-07-16 2005-02-10 Nitto Denko Corp Filler dispersed resin sheet, substrate for image display device, and image display device
JP2006089651A (en) * 2004-09-24 2006-04-06 Dainippon Printing Co Ltd Coating liquid for forming anchor layer, substrate having barrier property and method for producing them
JP4816863B2 (en) * 2004-12-22 2011-11-16 株式会社スリーボンド Thermosetting composition for sealing organic EL elements
JP5288150B2 (en) * 2005-10-24 2013-09-11 株式会社スリーボンド Thermosetting composition for sealing organic EL elements
JP4398500B2 (en) * 2007-04-06 2010-01-13 株式会社日本触媒 Resin composition and optical member
JP2009019077A (en) * 2007-07-10 2009-01-29 Kyocera Chemical Corp Curable composition, adhesive for display element, and bonding method
JP2009235162A (en) * 2008-03-26 2009-10-15 Toray Ind Inc Thermosetting resin composition

Also Published As

Publication number Publication date
TW201038610A (en) 2010-11-01
JP5696038B2 (en) 2015-04-08
JPWO2010119706A1 (en) 2012-10-22
KR20120009447A (en) 2012-01-31
CN102388078B (en) 2013-09-25
KR101340253B1 (en) 2013-12-10
WO2010119706A1 (en) 2010-10-21
TWI495655B (en) 2015-08-11
CN102388078A (en) 2012-03-21

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