TWI492674B - 電路基板 - Google Patents

電路基板 Download PDF

Info

Publication number
TWI492674B
TWI492674B TW099105651A TW99105651A TWI492674B TW I492674 B TWI492674 B TW I492674B TW 099105651 A TW099105651 A TW 099105651A TW 99105651 A TW99105651 A TW 99105651A TW I492674 B TWI492674 B TW I492674B
Authority
TW
Taiwan
Prior art keywords
layer
signal circuit
circuit
signal
shielding layer
Prior art date
Application number
TW099105651A
Other languages
English (en)
Chinese (zh)
Other versions
TW201038149A (en
Inventor
Akira Oikawa
Hiroyuki Kuribayashi
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009056697A external-priority patent/JP2010212439A/ja
Priority claimed from JP2009211526A external-priority patent/JP2011061126A/ja
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW201038149A publication Critical patent/TW201038149A/zh
Application granted granted Critical
Publication of TWI492674B publication Critical patent/TWI492674B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW099105651A 2009-03-10 2010-02-26 電路基板 TWI492674B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009056697A JP2010212439A (ja) 2009-03-10 2009-03-10 回路基板
JP2009211526A JP2011061126A (ja) 2009-09-14 2009-09-14 回路基板

Publications (2)

Publication Number Publication Date
TW201038149A TW201038149A (en) 2010-10-16
TWI492674B true TWI492674B (zh) 2015-07-11

Family

ID=42728022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105651A TWI492674B (zh) 2009-03-10 2010-02-26 電路基板

Country Status (2)

Country Link
TW (1) TWI492674B (fr)
WO (1) WO2010103722A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5310949B2 (ja) * 2010-12-03 2013-10-09 株式会社村田製作所 高周波信号線路
US9949360B2 (en) 2011-03-10 2018-04-17 Mediatek Inc. Printed circuit board design for high speed application
JP5975195B1 (ja) * 2014-10-03 2016-08-23 Dic株式会社 シールドフィルム、シールドプリント配線板及びそれらの製造方法
CN108886378B (zh) * 2016-03-31 2020-10-09 株式会社村田制作所 前置电路和高频模块
TWI687136B (zh) * 2016-05-09 2020-03-01 易鼎股份有限公司 可選擇對應接地層的電路板結構
JP2019197785A (ja) * 2018-05-08 2019-11-14 三菱電機株式会社 プリント配線板
US11696390B2 (en) 2020-06-24 2023-07-04 Qualcomm Incorporated Systems for shielding bent signal lines
CN115023026B (zh) * 2021-10-27 2023-04-14 荣耀终端有限公司 电路板和电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235495A (ja) * 1992-02-21 1993-09-10 Sumitomo Electric Ind Ltd シールド付フレキシブルプリント配線板
CN1119903A (zh) * 1993-02-02 1996-04-03 Ast研究公司 一种含有屏蔽网的电路板装置和它的构造
JP2007123740A (ja) * 2005-10-31 2007-05-17 Sony Corp フレキシブル基板、光送受信モジュール及び光送受信装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3612744A (en) * 1969-02-27 1971-10-12 Hughes Aircraft Co Flexible flat conductor cable of variable electrical characteristics
US4644092A (en) * 1985-07-18 1987-02-17 Amp Incorporated Shielded flexible cable
JPH0442960Y2 (fr) * 1986-03-06 1992-10-12
JPH03126099U (fr) * 1990-04-02 1991-12-19
JP2004079818A (ja) * 2002-08-20 2004-03-11 Fujitsu Ltd 配線基板およびその製造方法
JP2006173310A (ja) * 2004-12-15 2006-06-29 Sumitomo Bakelite Co Ltd 回路基板
JP4634883B2 (ja) * 2005-07-25 2011-02-16 ソニーケミカル＆インフォメーションデバイス株式会社 シールド付き配線基板とその製造方法
JP4798483B2 (ja) * 2005-10-24 2011-10-19 住友ベークライト株式会社 回路基板
JP4981618B2 (ja) * 2007-10-23 2012-07-25 日東電工株式会社 配線回路基板
JP2009212329A (ja) * 2008-03-05 2009-09-17 Epson Imaging Devices Corp 回路基板、電気光学装置及び電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235495A (ja) * 1992-02-21 1993-09-10 Sumitomo Electric Ind Ltd シールド付フレキシブルプリント配線板
CN1119903A (zh) * 1993-02-02 1996-04-03 Ast研究公司 一种含有屏蔽网的电路板装置和它的构造
JP2007123740A (ja) * 2005-10-31 2007-05-17 Sony Corp フレキシブル基板、光送受信モジュール及び光送受信装置

Also Published As

Publication number Publication date
TW201038149A (en) 2010-10-16
WO2010103722A1 (fr) 2010-09-16

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