JPH03126099U - - Google Patents
Info
- Publication number
- JPH03126099U JPH03126099U JP3557190U JP3557190U JPH03126099U JP H03126099 U JPH03126099 U JP H03126099U JP 3557190 U JP3557190 U JP 3557190U JP 3557190 U JP3557190 U JP 3557190U JP H03126099 U JPH03126099 U JP H03126099U
- Authority
- JP
- Japan
- Prior art keywords
- signal pattern
- wiring board
- printed wiring
- shield
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 5
- 239000011229 interlayer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3557190U JPH03126099U (fr) | 1990-04-02 | 1990-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3557190U JPH03126099U (fr) | 1990-04-02 | 1990-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03126099U true JPH03126099U (fr) | 1991-12-19 |
Family
ID=31541040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3557190U Pending JPH03126099U (fr) | 1990-04-02 | 1990-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03126099U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010103722A1 (fr) * | 2009-03-10 | 2010-09-16 | 住友ベークライト株式会社 | Circuit imprimé |
| WO2014132610A1 (fr) * | 2013-02-27 | 2014-09-04 | 日本電気株式会社 | Substrat de câblage, dispositif à semi-conducteurs, carte de circuit imprimé et procédé permettant de produire un substrat de câblage |
-
1990
- 1990-04-02 JP JP3557190U patent/JPH03126099U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010103722A1 (fr) * | 2009-03-10 | 2010-09-16 | 住友ベークライト株式会社 | Circuit imprimé |
| WO2014132610A1 (fr) * | 2013-02-27 | 2014-09-04 | 日本電気株式会社 | Substrat de câblage, dispositif à semi-conducteurs, carte de circuit imprimé et procédé permettant de produire un substrat de câblage |