JPH02116795U - - Google Patents
Info
- Publication number
- JPH02116795U JPH02116795U JP2501389U JP2501389U JPH02116795U JP H02116795 U JPH02116795 U JP H02116795U JP 2501389 U JP2501389 U JP 2501389U JP 2501389 U JP2501389 U JP 2501389U JP H02116795 U JPH02116795 U JP H02116795U
- Authority
- JP
- Japan
- Prior art keywords
- board
- layer
- signal wiring
- electromagnetic shielding
- undercoat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2501389U JPH02116795U (fr) | 1989-03-03 | 1989-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2501389U JPH02116795U (fr) | 1989-03-03 | 1989-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116795U true JPH02116795U (fr) | 1990-09-19 |
Family
ID=31245363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2501389U Pending JPH02116795U (fr) | 1989-03-03 | 1989-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116795U (fr) |
-
1989
- 1989-03-03 JP JP2501389U patent/JPH02116795U/ja active Pending