JPH02116795U - - Google Patents
Info
- Publication number
- JPH02116795U JPH02116795U JP2501389U JP2501389U JPH02116795U JP H02116795 U JPH02116795 U JP H02116795U JP 2501389 U JP2501389 U JP 2501389U JP 2501389 U JP2501389 U JP 2501389U JP H02116795 U JPH02116795 U JP H02116795U
- Authority
- JP
- Japan
- Prior art keywords
- board
- layer
- signal wiring
- electromagnetic shielding
- undercoat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図ａ乃至ｄは本考案の一実施例を示す各工
程時における断面図、第２図は従来例を示す断面
図、第３図はマイクロストリツプ線路を示す断面
図である。
１……基板、３，３′……信号配線、５ａ，５
ｂ，５ｃ，５……アンダーコート層、６……シー
ルド層。
1A to 1D are cross-sectional views showing an embodiment of the present invention at each step, FIG. 2 is a cross-sectional view showing a conventional example, and FIG. 3 is a cross-sectional view showing a microstrip line. 1... Board, 3, 3'... Signal wiring, 5a, 5
b, 5c, 5... undercoat layer, 6... shield layer.
Claims (1)
層を形成し、その上に銅ペースト等でシールド層
を形成した電磁シールド基板において、同一基板
内に、信号配線の容量、特性インピーダンス、伝
播速度をコントロールする厚みの異なるアンダー
コート層を備えてなることを特徴とする電磁シー
ルド基板。 In an electromagnetic shielding board in which an undercoat layer is formed on the signal wiring layer of a printed circuit board, and a shielding layer is formed on top of it using copper paste, etc., the capacitance, characteristic impedance, and propagation speed of the signal wiring are controlled within the same board. An electromagnetic shielding board characterized by comprising undercoat layers of different thicknesses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2501389U JPH02116795U (en) | 1989-03-03 | 1989-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2501389U JPH02116795U (en) | 1989-03-03 | 1989-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116795U true JPH02116795U (en) | 1990-09-19 |
Family
ID=31245363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2501389U Pending JPH02116795U (en) | 1989-03-03 | 1989-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116795U (en) |
-
1989
- 1989-03-03 JP JP2501389U patent/JPH02116795U/ja active Pending