JPS6387860U - - Google Patents
Info
- Publication number
- JPS6387860U JPS6387860U JP18305186U JP18305186U JPS6387860U JP S6387860 U JPS6387860 U JP S6387860U JP 18305186 U JP18305186 U JP 18305186U JP 18305186 U JP18305186 U JP 18305186U JP S6387860 U JPS6387860 U JP S6387860U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating sheet
- wiring
- integrated circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18305186U JPS6387860U (fr) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18305186U JPS6387860U (fr) | 1986-11-27 | 1986-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387860U true JPS6387860U (fr) | 1988-06-08 |
Family
ID=31129427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18305186U Pending JPS6387860U (fr) | 1986-11-27 | 1986-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387860U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016122758A (ja) * | 2014-12-25 | 2016-07-07 | イビデン株式会社 | 多層配線板 |
-
1986
- 1986-11-27 JP JP18305186U patent/JPS6387860U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016122758A (ja) * | 2014-12-25 | 2016-07-07 | イビデン株式会社 | 多層配線板 |