WO2010103722A1 - Circuit imprimé - Google Patents

Circuit imprimé Download PDF

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Publication number
WO2010103722A1
WO2010103722A1 PCT/JP2010/000659 JP2010000659W WO2010103722A1 WO 2010103722 A1 WO2010103722 A1 WO 2010103722A1 JP 2010000659 W JP2010000659 W JP 2010000659W WO 2010103722 A1 WO2010103722 A1 WO 2010103722A1
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WO
WIPO (PCT)
Prior art keywords
layer
signal wiring
circuit board
shield layer
characteristic impedance
Prior art date
Application number
PCT/JP2010/000659
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English (en)
Japanese (ja)
Inventor
及川昭
栗林宏行
Original Assignee
住友ベークライト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009056697A external-priority patent/JP2010212439A/ja
Priority claimed from JP2009211526A external-priority patent/JP2011061126A/ja
Application filed by 住友ベークライト株式会社 filed Critical 住友ベークライト株式会社
Publication of WO2010103722A1 publication Critical patent/WO2010103722A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors

Definitions

  • the present invention relates to a ground layer and a circuit board in which signal wirings are arranged with respect to the ground layer via an insulator layer.
  • a circuit board on which a device operating in a high frequency band is mounted has a characteristic impedance (hereinafter also referred to as Zo) of a signal transmission path (hereinafter also referred to as signal wiring) in order to suppress signal reflection and waveform distortion. It is necessary to match the input / output impedance of the device.
  • a microstrip structure in which a ground layer is opposed to a signal transmission path (strip line) having an appropriate pattern width with an insulating layer having an appropriate thickness interposed therebetween is employed. Yes.
  • the ground layer in the circuit board structure described above serves as an electrical reference plane that defines the characteristic impedance of the signal transmission path.
  • the characteristic impedance is often selected to be around 50 ⁇ for single-ended transmission and around 100 ⁇ for differential transmission.
  • Zo in the circuit board described above is a ratio of reactance L per unit length of the signal transmission path and capacitance C per unit area between the signal transmission path and the ground layer (reactance L / electrostatic capacity). It is a value approximated by the square root of the capacitance C).
  • the ground layer formed as a so-called solid electrode layer is removed in a mesh shape so that the opposing area between the ground layer and the signal wiring per unit area is substantially reduced. Proposals have been made to ensure the width of the signal wiring by making it smaller. This is disclosed in the following prior art documents.
  • the present invention has been made by paying attention to the technical problems described above, and can sufficiently control the characteristic impedance of the signal transmission path, and also exhibits the effect in the above-mentioned EMI countermeasures. It is an object of the present invention to provide a circuit board having a signal wiring capable of performing single-ended transmission and a circuit board having a pair of signal wirings capable of performing differential transmission.
  • the circuit board according to the present invention which has been made to solve the above-described problems, includes a ground layer and a signal wiring disposed through an insulator layer with respect to the ground layer, and capacitive coupling between the ground layer and the signal wiring.
  • an insulating coating layer is formed on the signal wiring disposed on the insulator layer, Further, a shield layer made of a conductive material is formed, and an opening of the shield layer where the shield layer is not laid is formed on the insulating coating layer facing the signal wiring.
  • the signal wiring on which the characteristic impedance is controlled is a signal wiring on which single-ended transmission is performed
  • the signal wiring on which the characteristic impedance is controlled when the thickness of the insulator layer is t1. It is preferable that the distance U between both outer sides of the shield layer and the opening edge of the shield layer is set in a range of 3t1 ⁇ U ⁇ 20t1.
  • the signal wiring for which characteristic impedance control is performed is a pair wiring that is differentially transmitted
  • the distance between the pair wirings is S
  • both outer sides of the pair wiring and the shield It is desirable that the distance U from the opening edge of the layer is set in a range of 3S ⁇ U ⁇ 20S.
  • the ground layer facing the signal wiring whose characteristic impedance is controlled is formed in a mesh-shaped conductor portion provided with a number of holes, and a solid electrode that is not provided with holes outside the mesh-shaped conductor portion.
  • the boundary between the mesh-like conductor portion and the solid electrode region coincides with the opening edge of the shield layer in a direction perpendicular to the substrate surface.
  • the insulating layer between the ground layer and the signal wiring and the insulating coating layer between the signal wiring and the shielding layer are each made of a thin circuit board having a thickness of 100 ⁇ m or less. The effect can be exhibited remarkably.
  • a linear guard pattern having the same potential as that of the ground layer is disposed on the insulator layer along both outer sides of the signal wiring for which characteristic impedance is controlled, and the linear guard is provided.
  • a circuit board configured so that the central portion in the width direction of the pattern is positioned at the opening edge of the shield layer can also be suitably employed.
  • the ground layer and the guard pattern are connected via a via hole, and the guard pattern and the shield layer are connected via an opening formed in the insulating coating layer.
  • the insulating coating layer facing the signal wiring that needs to be controlled by Zo is formed in the opening portion of the shield layer where the shield layer is not laid.
  • the degree of capacitance coupling between the two can be greatly reduced. Thereby, appropriate control of the characteristic impedance of the signal wiring can be achieved.
  • the signal wiring is provided with a circuit board capable of exhibiting a sufficient effect for the above-mentioned EMI countermeasures although the shield effect is slightly lowered by forming the opening of the shield layer. can do.
  • FIG. 1A shows the laminated structure of the first embodiment of the circuit board provided with the signal wiring for performing the above-mentioned single-end transmission
  • FIG. 1B shows the signal wiring on the insulator layer shown in FIG. 1A. It is the top view which showed the part at the substantially same scale.
  • the circuit board shown in FIGS. 1A and 1B is provided with a ground layer and a signal wiring for performing single-ended transmission with respect to the ground layer through an insulator layer, and a signal wiring that requires control of characteristic impedance.
  • a film-like base substrate is employed as the insulator layer 2, and the signal wirings 3A and 3B are provided on one surface (the upper side in FIG. 1A) of the base substrate 2.
  • the insulating coating layer 4 is laminated on the upper surface (the upper side in FIG. 1A) of the signal wirings 3A and 3B through an adhesive layer (not shown).
  • a ground layer 5 is formed on the other surface (lower side in FIG. 1A) of the base substrate 2, and a second insulating coating layer is formed on the lower surface of the ground layer 5 via an adhesive layer (not shown). 6 are stacked.
  • a shield layer 7 made of a conductive material is formed on the insulating coating layer 4 covering the signal wirings 3A and 3B on the surface opposite to the ground layer 5 through the base substrate 2, and has a characteristic impedance.
  • an opening 7a of the shield layer where the shield layer is not laid is formed on the insulating coating layer 4 facing the signal wiring 3A that needs to be controlled.
  • the base substrate 2 that functions as a central insulator layer in which the signal wiring is disposed has a function as a core of the circuit board 1.
  • the material of the base substrate 2 includes a resin film, a fiber substrate, and the like. Materials etc. can be mentioned.
  • the material constituting the resin film examples include polyimide resins such as polyimide resins, polyamide resins, and polyamideimide resins, thermosetting resins such as epoxy resins, and thermoplastic resins such as liquid crystal polymers.
  • a polyimide resin or a liquid crystal polymer is preferable.
  • a polyimide resin it is excellent in heat resistance and mechanical properties and is easy to obtain.
  • a liquid crystal polymer it is suitable for high-speed signal transmission due to its low relative dielectric constant, and it has excellent dimensional stability due to its low hygroscopicity.
  • the fiber base material used for the insulating layer examples include glass fiber base materials such as glass fiber cloth and glass non-fiber cloth, or inorganic fiber base materials such as fiber cloth and non-fiber cloth containing inorganic compounds other than glass, aromatic And organic fiber base materials composed of organic fibers such as aromatic polyamide resins, polyamide resins, aromatic polyester resins, polyester resins, polyimide resins, and fluororesins.
  • glass fiber base materials represented by glass fiber fabric are preferable in terms of strength and water absorption.
  • a fiber base material When a fiber base material is used for the insulator layer, it is preferably used in a state where the fiber base material is impregnated with a resin.
  • a resin impregnated in the fiber base material a thermosetting resin such as an epoxy resin or an acrylic resin is preferably used, and among these, an epoxy resin is preferable from the viewpoint of heat resistance.
  • the thickness t1 of the base substrate 2 is preferably in the range of 1 to 100 ⁇ m, more preferably in the range of 5 to 50 ⁇ m, and more preferably in the range of 10 to 30 ⁇ m.
  • the thickness of the base substrate 2 is preferably in the range of 1 to 100 ⁇ m, more preferably in the range of 5 to 50 ⁇ m, and more preferably in the range of 10 to 30 ⁇ m.
  • the signal wirings 3A and 3B arranged on one surface of the base substrate 2 may be provided directly on the base substrate 2, or may be provided via an adhesive. Then, at the end portion of each signal wiring or an appropriate intermediate portion, it is bonded to a mounting pad such as a semiconductor device (not shown) and functions as the circuit board 1.
  • the insulating coating layer 4 covering the signal wirings 3A and 3B via an adhesive layer is made of a resin material.
  • the resin material include polyester resins, polyimides, and liquid crystal polymers. Among these, polyimide is preferable. Thereby, heat resistance and flexibility can be improved.
  • the thickness t2 of the insulating coating layer 4 is preferably 1 to 100 ⁇ m, more preferably 5 to 50 ⁇ m, more preferably 10 to 30 ⁇ m.
  • an acrylic resin for example, an acrylic resin, an epoxy resin, a polyimide resin, or the like may be used. It can. Among these, an epoxy resin is preferable, and thereby heat resistance and flexibility can be improved.
  • the conductive portion as the ground layer 5 disposed on the other surface (back surface) of the base substrate 2 is made of a conductor made of a copper material.
  • a large number of holes formed in a parallelogram opening are formed in a portion facing the signal wiring 3A that requires impedance control.
  • a specific configuration of the ground layer 5 will be described later in detail with reference to FIG.
  • the second insulating coating layer 6 laminated on the lower surface of the ground layer 5 (the lower side in FIG. 1A) via an adhesive layer (not shown) is preferably made of a resin material.
  • the resin material include polyester resin, polyimide, liquid crystal polymer, and the like. Among these, polyimide is preferable. Thereby, heat resistance and flexibility can be improved.
  • the thickness of the second insulating coating layer 6 is not particularly limited, but is preferably 5 to 50 ⁇ m, and particularly preferably 10 to 30 ⁇ m. This makes it easy to maintain the strength of the resin layer within a practical range by setting the thickness of the insulating coating layer 6 to be equal to or greater than the lower limit, and maximizing slidability and flexibility by reducing the thickness to the upper limit or less. It is easy to make it to the limit.
  • the material constituting the adhesive layer (not shown) interposed between the ground layer 5 and the second insulating coating layer 6 is interposed between the base substrate 2 and the insulating coating layer 4.
  • an acrylic resin, an epoxy resin, a polyimide resin, or the like can be used in the same manner as the material constituting the adhesive layer (not shown).
  • an epoxy resin is preferable, and thereby heat resistance and flexibility can be improved.
  • the shield layer 7 made of a conductive material formed on the insulating coating layer 4 is formed by printing with a conductive paste (silver paste) or by sticking a conductive shield film, and the characteristic impedance can be controlled.
  • the portion facing the required signal wiring 3A is formed in the opening 7a of the shield layer where the shield layer 7 is not laid as described above.
  • FIG. 2 is a partially enlarged view of one preferred configuration of the ground layer 5 described above.
  • a state in which the signal wiring 3A that requires control of characteristic impedance is superimposed on the ground layer 5 is shown as seen through from a direction perpendicular to the surface.
  • the ground layer 5 is made of a conductor made of a copper material, and the position of the conductor facing the signal wiring 3A constitutes a mesh-like conductor portion 5B in which a large number of holes are formed. .
  • the hole in this embodiment is formed as a parallelogram (rhombus) opening by intersecting a plurality of lines in two directions.
  • Each of the plurality of lines in the two directions is preferably inclined with respect to the signal wiring 3A within a range of 5 to 40 degrees.
  • the longer diagonal line of the rhomboid opening has a mesh pattern that matches the wiring direction of the signal wiring 3A.
  • each above-mentioned opening may have a mutually different magnitude
  • it is made into the opening area of the same magnitude
  • the characteristic impedance of the signal wiring 3A can be controlled with high accuracy.
  • the outside of the mesh-like conductor portion 5B is a solid electrode region 5A made of a copper material in which no hole is formed.
  • the signal wiring 3B that does not require the characteristic impedance control is arranged opposite to the solid electrode region 5A.
  • the mesh-like conductor portion 5B is configured only in the portion where the characteristic impedance needs to be controlled, and the rest is the solid electrode region 5A, thereby avoiding an increase in the overall impedance of the ground layer 6. be able to.
  • the boundary between the mesh-like conductor portion 5B and the solid electrode region 5A is configured to substantially coincide with an opening edge 7b in the opening 7a of the shield layer described later in a direction orthogonal to the substrate surface.
  • the characteristic impedance of the signal wiring In order to control the characteristic impedance of the signal wiring, it is effective to provide the mesh conductor portion 5B in the ground layer 5 as described above.
  • the characteristic impedance of the signal wiring is determined by the line width and the insulating layer. It is also possible to control the thickness and further by selecting the dielectric constant of the insulating layer. In the present invention, it is not essential to provide the mesh-like conductor portion 5B.
  • the thickness t1 of the base substrate 2 and the thickness t2 of the insulating coating layer 4 are both 100 ⁇ m or less, and the entire laminated structure is applied to a very thin circuit board. Therefore, the distance U between the signal wiring 3A that needs to control the characteristic impedance and the opening edge 7b of the opening 7a formed in the shield layer dominates the degree of capacitive coupling between them.
  • the signal wiring 3A whose characteristic impedance is controlled has the function of single-end transmission as described above, and when the thickness of the insulator layer 2 is t1, It is desirable that the distance U from the opening edge of the shield layer is set in the range of 3t1 ⁇ U ⁇ 20t1, more preferably 3t1 ⁇ U ⁇ 10t1.
  • FIG. 3 shows the ratio between the outer side of the signal wiring 3A and the opening edge 7b of the shield layer 7 as U, and the ratio of both when the thickness of the insulator layer 2 is t1, that is, U / t1.
  • the characteristic example shown in FIG. 3 is obtained when the line width L of the signal wiring 3A is 100 ⁇ m, the interlayer thickness t1 of the insulator layer 2 is 25 ⁇ m, and the copper (conductor) residual ratio of the mesh-like conductor portion 5B is 30%. Is. In addition, this is because the boundary between the mesh-like conductor portion 5B and the solid electrode region 5A is configured to coincide with the opening edge 7b of the opening 7a of the shield layer in a direction perpendicular to the substrate surface. .
  • the thickness (interlayer thickness) t1 of the insulator layer 2 separating the signal wiring 3A and the ground layer 5 dominates the degree of capacitive coupling between them. Therefore, it is desirable to manage the control of the characteristic impedance using the thickness t1 of the insulator layer 2 as a parameter.
  • the value of U is desirably set to 20 t1 or less, preferably 10 t1 or less.
  • the relationship between the distance U between the outer sides of the signal wiring 3A having the function of single-end transmission and the opening edge 7b of the shield layer and the thickness t1 of the insulator layer 2 is set within the above range.
  • FIG. 4A shows a laminated structure of a circuit board according to the second embodiment of the present invention in which single-ended transmission is performed
  • FIG. 4B shows signal wiring portions on the insulator layer shown in FIG. 4A at substantially the same scale. It is the top view shown by.
  • FIG. 4A and FIG. 4B parts that perform the same functions as the parts shown in FIG. 1A and FIG. 1B already described are denoted by the same reference numerals, and thus detailed description thereof is omitted.
  • the relationship between the distance U between the outer sides of the signal wiring 3A and the opening edge 7b of the shield layer and the thickness t1 of the insulator layer 2 is also the same as described above based on FIG. 1A. Yes.
  • linear guard patterns 8 having the same potential as that of the ground layer 5 are arranged on the base substrate 2 along both outer sides of the signal wiring 3A whose characteristic impedance is controlled. It is installed. And the center part of the width direction of the linear guard pattern 8 is comprised so that it may be located in the opening edge 7b of the said shield layer 7.
  • the upper surface of the signal wiring 3A requiring control of the characteristic impedance is opened by the opening 7a of the shield layer, but below the signal wiring 3A as viewed in cross section as shown in FIG. 4A. Since both sides and the upper sides are surrounded by a sufficiently close ground, attenuation of the EMI shield characteristic can be minimized.
  • FIG. 5A shows a laminated structure of the circuit board according to the third embodiment of the present invention in which single-ended transmission is performed
  • FIG. 5B shows almost the same signal wiring portion on the insulator layer shown in FIG. 5A. It is the top view shown on a reduced scale.
  • the configuration shown in FIGS. 5A and 5B is obtained by further adding the configuration requirements to the above-described second embodiment shown in FIGS. 4A and 4B.
  • the ground layer 5 and the guard pattern 8 include: The guard pattern 8 and the shield layer 7 are connected through an opening 4 a formed in the insulating coating layer 4. The guard pattern 8 and the shield layer 7 are connected through a via hole 2 a formed in the insulating base 2.
  • Via holes 2a connecting the ground layer 5 and the guard pattern 8 are formed at a plurality of locations along the longitudinal direction of the guard pattern 8 as shown in FIG. 5B, and both are connected via the via holes 2a.
  • the openings 4a formed in the insulating coating layer 4 are also formed at a plurality of locations along the longitudinal direction of the guard pattern 8, and the guard pattern 8 and the shield layer 7 are formed through the openings 4a. And are connected.
  • the above-described configuration can be suitably employed in a portion where the circuit board is not bent. According to this configuration, the gap between the grounds on both outer sides of the signal wiring 3A is filled, and the ground layer 5 functions as a ground potential. Further, the mechanical coupling of the guard pattern 8 and the shield layer 7 is strengthened, and it can contribute to further improving the EMI shield characteristics.
  • FIG. 6A shows the laminated structure of the first embodiment of the circuit board provided with the pair signal wiring for differential transmission as described above
  • FIG. 6B shows the signal wiring on the insulator layer shown in FIG. 6A. It is the top view which showed the part at the substantially same scale.
  • a signal wiring is disposed via a ground layer and an insulator layer with respect to the ground layer, and the signal wiring that requires control of characteristic impedance (see FIG. 6B).
  • a microstrip structure is formed for the part (pair wiring indicated by symbol A), and a shield layer is added to the part of the signal wiring (pair wiring indicated by symbol B in FIG. 6B) that does not require control of the characteristic impedance. is doing.
  • a film-like base substrate is employed as the insulator layer 2, and signal wiring that is differentially transmitted is provided on one surface (the upper side in FIG. 6A) of the base substrate 2.
  • 3a and 3b are formed, and an insulating coating layer 4 is laminated on the upper surface (the upper side in FIG. 6A) of the signal wirings 3a and 3b via an adhesive layer (not shown).
  • a ground layer 5 is formed on the other surface of the base substrate 2 (lower side in FIG. 6A), and a second insulating coating layer is formed on the lower surface of the ground layer 6 via an adhesive layer (not shown). 6 is formed.
  • a shield layer 7 made of a conductive material is formed on the insulating coating layer 4 that covers the signal wiring on the opposite side of the ground layer 5 through the base substrate 2, and the characteristic impedance needs to be controlled.
  • the circuit board 1 provided with the differential signal transmission pair signal wiring is the same as the circuit board provided with the signal wiring shown in FIG. 1A and FIG.
  • Each layer having the same structure as that of the laminated structure and performing the same function is indicated by the same reference numeral. Therefore, the details of each layer and an adhesive layer (not shown) will not be described.
  • FIG. 7 is an enlarged view of a part of one preferred configuration of the ground layer 5 shown in FIG. 6A.
  • FIG. 7 shows a state in which the signal wirings 3a and 3b that need to control the characteristic impedance described above are superimposed on the ground layer 5 as seen through from a direction orthogonal to the surface.
  • the ground layer 5 shown in FIG. 7 has the same configuration as that of the ground layer 5 shown in FIG. 2, and portions that perform the same function are indicated by the same reference numerals. Therefore, the detailed description of the ground layer 5 is also omitted.
  • the thickness t1 of the base substrate 2 and the thickness t2 of the insulating coating layer 4 are both 100 ⁇ m or less, and the entire laminated structure is extremely thin. Therefore, the distance U between the signal wirings 3a and 3b that need to be controlled in the characteristic impedance and the opening edge 7b of the opening 7a formed in the shield layer is a capacitive coupling between them. Will dominate the degree.
  • the signal wiring for which the characteristic impedance is controlled is a pair wiring that is differentially transmitted.
  • the signal wiring The distance U between the outer sides of the pair wiring and the opening edge 7b of the shield layer at the position of the line distance S may be set in the range of 3S ⁇ U ⁇ 20S, more preferably 3S ⁇ U ⁇ 10S. desirable.
  • FIG. 8 shows a characteristic example in which the ratio of the distance U to the line-to-line distance S, that is, the value of U / S is shown on the horizontal axis, and the characteristic impedance Zo of the signal wirings 3a and 3b is shown on the vertical axis. is there.
  • the value of U is desirably set to 20S or less, preferably 10S or less.
  • the characteristic impedance of the signal wiring can be reduced by setting the relationship between the line spacing S of the paired signal wirings and the distance U between the outer sides of the pair wirings and the opening edge 7b of the shield layer within the above range. It is possible to provide a circuit board capable of achieving both adjustment and EMI countermeasures.
  • the distance U between the outer sides of the pair wiring and the opening edge 7b of the shield layer is set using the line spacing S of the pair wiring as a parameter. It is appropriate to set and manage the above-mentioned range.
  • the distance between the pair wirings affects the characteristic impedance of the signal wiring next to the shield layer. Therefore, the distance from the signal wiring to the opening edge of the shield layer with respect to the distance between the lines is reduced to the characteristic impedance. This is because the magnitude of the impact is determined.
  • FIG. 9A shows the laminated structure of the second embodiment of the circuit board provided with the differential signal transmission pair signal wiring
  • FIG. 9B shows almost the same signal wiring portion on the insulator layer shown in FIG. 9A. It is the top view shown on a reduced scale.
  • the configuration shown in FIGS. 9A and 9B shows an example in which the signal wiring that needs to control the characteristic impedance is a pair wiring that is differentially transmitted, similarly to the example shown in FIGS. 6A and 6B. .
  • FIGS. 9A and 9B parts that perform the same functions as those shown in FIGS. 6A and 6B described above are denoted by the same reference numerals, and therefore detailed description thereof is omitted.
  • the distance U between the outer sides of the pair wiring and the opening edge 7b of the shield layer has the above-described relationship using the line spacing S of the pair wiring as a parameter.
  • a linear guard pattern 8 having the same potential as the ground layer 5 is formed along the outer sides of the signal wirings 3a and 3b whose characteristic impedance is controlled. It is arranged on the top. And the center part of the width direction of the linear guard pattern 8 is comprised so that it may be located in the opening edge 7b of the said shield layer 7.
  • the upper surfaces of the signal wirings 3a and 3b that require control of the characteristic impedance are opened by the opening 7a of the shield layer, but the signal wiring 3a viewed in a cross section as shown in FIG. 9A. , 3b, and the upper and lower sides are surrounded by a sufficiently close ground, so that the attenuation of the EMI shield characteristic can be minimized.
  • FIG. 10A shows a laminated structure according to the third embodiment of a circuit board having a pair signal wiring for differential transmission
  • FIG. 10B shows a signal wiring portion on the insulator layer shown in FIG. 10A. It is the top view shown on substantially the same scale.
  • the configuration shown in FIGS. 10A and 10B is obtained by further adding the configuration requirements to the second embodiment shown in FIGS. 9A and 9B.
  • the ground layer 5 and the guard pattern 8 are
  • the guard pattern 8 and the shield layer 7 are connected through an opening 4 a formed in the insulating coating layer 4.
  • the guard pattern 8 and the shield layer 7 are connected through a via hole 2 a formed in the insulating base 2.
  • the via holes 2a connecting the ground layer 5 and the guard pattern 8 are formed at a plurality of locations along the longitudinal direction of the guard pattern 8 as shown in FIG. 10B, and both are connected via the via holes 2a.
  • the openings 4a formed in the insulating coating layer 4 are also formed at a plurality of locations along the longitudinal direction of the guard pattern 8, and the guard pattern 8 and the shield layer 7 are formed through the openings 4a. And are connected.
  • the above-described configuration can be suitably employed in a portion where the circuit board is not bent or the like. According to this configuration, a gap between the grounds on both outer sides of the signal wiring is filled, and the ground layer 5 functions as a ground potential. The mechanical coupling between the guard pattern 8 and the shield layer 7 is strengthened, and it can contribute to further improving the EMI shield characteristics.
  • the ground layer in the circuit board provided with the signal wiring that performs single-ended transmission and the pair signal wiring that is differentially transmitted as described above is configured to be applied with a reference potential of the circuit. In some cases, the operating power supply of each device may be superimposed. Therefore, the potential applied to the ground layer is not particularly limited.
  • the circuit board according to the present invention can be used for a printed wiring board, a flexible printed wiring board, a multilayer flexible printed wiring board, and the like, and can be suitably used particularly for a circuit board on which a device operating in a high frequency band is mounted.
  • Circuit board 2 Insulator layer (base material) 2a Via hole 3A, 3B Signal wiring 3a, 3b Signal wiring (pair wiring) DESCRIPTION OF SYMBOLS 4 Insulation coating layer 4a Insulation coating layer opening 5 Ground layer 5A Solid electrode area 5B Mesh-like conductor part 6 Insulation coating layer 7 Shield layer 7a Shield layer opening part 7b Opening edge 8 Guard pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne un circuit imprimé (1) possédant une couche de masse (5) et un câblage de signal (3A, 3B) disposé sur ladite couche de masse, une couche isolante (2) étant intercalée entre les deux. Une couche de protection (7) constituée d'un matériau conducteur est formée sur une couche de revêtement isolant (4) recouvrant le câblage de signal sur le côté opposé à la couche de masse (5). La partie qui est située au-dessus de la couche isolante et en regard du câblage de signal (3A) nécessitant un réglage d'une impédance caractéristique est conçue comme une ouverture (7a) dans la couche de protection à l'emplacement où aucune couche de protection n'est disposée. Lorsque le câblage de signal remplit la fonction d'une transmission de fin unique, la distance U entre les extérieurs opposés du câblage de signal (3A) et le bord d'ouverture (7b) de la couche de protection est fixée dans la plage 3t1 ≤ U ≤ 20t1, l'épaisseur de la couche isolante (2) étant t1. Avec une telle structure, un circuit imprimé capable de régler l'impédance caractéristique du câblage de signal (3A) et de montrer l'effet également en contre-mesure de perturbation électromagnétique est procuré.
PCT/JP2010/000659 2009-03-10 2010-02-04 Circuit imprimé WO2010103722A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009-056697 2009-03-10
JP2009056697A JP2010212439A (ja) 2009-03-10 2009-03-10 回路基板
JP2009211526A JP2011061126A (ja) 2009-09-14 2009-09-14 回路基板
JP2009-211526 2009-09-14

Publications (1)

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WO2010103722A1 true WO2010103722A1 (fr) 2010-09-16

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WO2012119530A1 (fr) 2011-03-10 2012-09-13 Mediatek Inc. Modèle de carte à circuit imprimé pour application à grande vitesse
JP5310949B2 (ja) * 2010-12-03 2013-10-09 株式会社村田製作所 高周波信号線路
WO2016052225A1 (fr) * 2014-10-03 2016-04-07 Dic株式会社 Film de protection, carte de circuit imprimé avec protection, et procédés de fabrication de film de protection et de carte de circuit imprimé avec protection
WO2017169546A1 (fr) * 2016-03-31 2017-10-05 株式会社村田製作所 Circuit frontal et module à haute fréquence
CN107360663A (zh) * 2016-05-09 2017-11-17 易鼎股份有限公司 可选择对应接地层的电路板结构
JP2019197785A (ja) * 2018-05-08 2019-11-14 三菱電機株式会社 プリント配線板
CN115023026A (zh) * 2021-10-27 2022-09-06 荣耀终端有限公司 电路板和电子设备

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US11696390B2 (en) 2020-06-24 2023-07-04 Qualcomm Incorporated Systems for shielding bent signal lines

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JP5310949B2 (ja) * 2010-12-03 2013-10-09 株式会社村田製作所 高周波信号線路
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WO2016052225A1 (fr) * 2014-10-03 2016-04-07 Dic株式会社 Film de protection, carte de circuit imprimé avec protection, et procédés de fabrication de film de protection et de carte de circuit imprimé avec protection
WO2017169546A1 (fr) * 2016-03-31 2017-10-05 株式会社村田製作所 Circuit frontal et module à haute fréquence
CN108886378A (zh) * 2016-03-31 2018-11-23 株式会社村田制作所 前置电路和高频模块
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CN108886378B (zh) * 2016-03-31 2020-10-09 株式会社村田制作所 前置电路和高频模块
CN107360663A (zh) * 2016-05-09 2017-11-17 易鼎股份有限公司 可选择对应接地层的电路板结构
CN107360663B (zh) * 2016-05-09 2020-01-31 易鼎股份有限公司 可选择对应接地层的电路板结构
JP2019197785A (ja) * 2018-05-08 2019-11-14 三菱電機株式会社 プリント配線板
CN115023026A (zh) * 2021-10-27 2022-09-06 荣耀终端有限公司 电路板和电子设备

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Publication number Publication date
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TWI492674B (zh) 2015-07-11

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