TWI491675B - Polyoxometallic compositions containing free crosslinking groups - Google Patents

Polyoxometallic compositions containing free crosslinking groups Download PDF

Info

Publication number
TWI491675B
TWI491675B TW102114070A TW102114070A TWI491675B TW I491675 B TWI491675 B TW I491675B TW 102114070 A TW102114070 A TW 102114070A TW 102114070 A TW102114070 A TW 102114070A TW I491675 B TWI491675 B TW I491675B
Authority
TW
Taiwan
Prior art keywords
group
mass
polyoxyalkylene
parts
composition
Prior art date
Application number
TW102114070A
Other languages
English (en)
Chinese (zh)
Other versions
TW201402700A (zh
Inventor
Yuka Sasaki
Toru Katsumata
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201402700A publication Critical patent/TW201402700A/zh
Application granted granted Critical
Publication of TWI491675B publication Critical patent/TWI491675B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/32—Compounds containing nitrogen bound to oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Silicon Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
  • Materials For Photolithography (AREA)
TW102114070A 2012-04-20 2013-04-19 Polyoxometallic compositions containing free crosslinking groups TWI491675B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012097034 2012-04-20
JP2012186228 2012-08-27

Publications (2)

Publication Number Publication Date
TW201402700A TW201402700A (zh) 2014-01-16
TWI491675B true TWI491675B (zh) 2015-07-11

Family

ID=49383591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102114070A TWI491675B (zh) 2012-04-20 2013-04-19 Polyoxometallic compositions containing free crosslinking groups

Country Status (5)

Country Link
JP (1) JP5886420B2 (ko)
KR (1) KR101566138B1 (ko)
CN (1) CN104245846B (ko)
TW (1) TWI491675B (ko)
WO (1) WO2013157643A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013539072A (ja) * 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
TWI500703B (zh) * 2013-12-26 2015-09-21 Chi Mei Corp 光硬化性塗佈組成物、光硬化塗佈膜及觸控面板
JP5805348B1 (ja) * 2014-02-07 2015-11-04 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加硬化型シリコーン組成物
CN106164115A (zh) * 2014-03-31 2016-11-23 日产化学工业株式会社 包含反应性含氟有机硅化合物的聚合性组合物
EP3318606B1 (en) * 2015-07-09 2020-03-18 Tokyo Ohka Kogyo Co., Ltd. Silicon-containing resin composition
WO2017154286A1 (ja) * 2016-03-07 2017-09-14 株式会社リコー 素子、セル及び発電装置
CN109071742B (zh) * 2016-04-25 2021-07-09 东丽株式会社 树脂组合物、其固化膜及其制造方法以及固体摄像器件
JP6999408B2 (ja) 2016-12-28 2022-02-04 東京応化工業株式会社 樹脂組成物、樹脂組成物の製造方法、膜形成方法及び硬化物
JP6916619B2 (ja) * 2016-12-28 2021-08-11 東京応化工業株式会社 ポリシラン化合物、組成物、硬化物及び基板の製造方法、並びにアニオン重合選択的促進剤
KR101975149B1 (ko) * 2017-09-14 2019-05-03 스미또모 가가꾸 가부시키가이샤 비수 전해액 이차 전지용 세퍼레이터
CN116478406A (zh) * 2023-04-04 2023-07-25 浙江精一新材料科技有限公司 一种用于光阀的聚硅氧烷及光阀

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011136170A1 (ja) * 2010-04-26 2011-11-03 株式会社スリーボンド 光硬化性シリコーンゲル組成物及びその用途

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1271131B (it) * 1994-11-30 1997-05-26 Ciba Geigy Spa Composti piperidinici contenenti gruppi silanici come stabilizzanti per materiali organici
US5814695A (en) * 1995-09-08 1998-09-29 General Electric Company Silicone molding compositions having extended useful life
FR2819517B1 (fr) * 2000-10-03 2003-03-21 Atofina Composition comprenant un nitroxyde, un promoteur et eventuellement un initiateur de radicaux libres
US7465769B2 (en) * 2006-10-09 2008-12-16 Dow Global Technologies Inc. Nitroxide compounds for minimizing scorch in crosslinkable compositions
JP2010521557A (ja) * 2007-03-15 2010-06-24 ダウ グローバル テクノロジーズ インコーポレイティド スコーチを最小限に抑制するためのイソシアナート、ジイソシアナート、および（メタ）アクリラート化合物、ならびに架橋性組成物において硬化を促進するためのジイソシアナート化合物
EP2155816A1 (en) * 2007-06-08 2010-02-24 Union Carbide Chemicals & Plastics Technology LLC Crosslinkable compositions having reduced scorch inhibitor migration, method of reducing such migration, and articles made therefrom
JP5413710B2 (ja) * 2008-06-11 2014-02-12 日本電気株式会社 電極活物質と、その製造方法及びそれを用いた電池
JP2010153649A (ja) * 2008-12-25 2010-07-08 Tosoh Corp 環状シロキサン組成物および薄膜
JP5526399B2 (ja) * 2009-01-16 2014-06-18 日本電気株式会社 電極活物質、その製造方法及び二次電池
DE102010013196B4 (de) 2010-03-29 2015-10-29 Hilti Aktiengesellschaft Chemische Zweikomponenten-Mörtelmasse mit verbesserter Haftung an der Oberfläche von halbgereinigten und/oder feuchten Bohrlöchern in mineralischem Untergrund und ihre Verwendung
JP2012219109A (ja) * 2011-04-04 2012-11-12 Nec Corp ラジカル化合物、その製造方法及び二次電池
JP2012221574A (ja) * 2011-04-04 2012-11-12 Nec Corp ラジカル化合物及びその製造方法、電極活物質、並びに二次電池

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011136170A1 (ja) * 2010-04-26 2011-11-03 株式会社スリーボンド 光硬化性シリコーンゲル組成物及びその用途

Also Published As

Publication number Publication date
KR101566138B1 (ko) 2015-11-04
TW201402700A (zh) 2014-01-16
JPWO2013157643A1 (ja) 2015-12-21
CN104245846B (zh) 2016-08-24
KR20140128404A (ko) 2014-11-05
JP5886420B2 (ja) 2016-03-16
WO2013157643A1 (ja) 2013-10-24
CN104245846A (zh) 2014-12-24

Similar Documents

Publication Publication Date Title
TWI491675B (zh) Polyoxometallic compositions containing free crosslinking groups
JP5826341B2 (ja) 硬化物の製造方法
KR101807641B1 (ko) 네거티브형 감광성 수지 조성물, 그것을 사용한 보호막 및 터치 패널 부재
TWI597265B (zh) A photosensitive resin composition, a protective film or an insulating film, a touch panel, and a method of manufacturing the same
JP5504689B2 (ja) ネガ型感光性樹脂組成物およびそれを用いたタッチパネル用材料
TWI612384B (zh) 感光性樹脂組成物、導電性配線保護膜及觸控板構件
TW201404781A (zh) 矽烷偶合劑、感光性樹脂組成物、硬化膜及觸控面板構件
JP2010160300A (ja) ネガ型感光性樹脂組成物およびそれを用いたタッチパネル用材料
TWI611267B (zh) 可低溫硬化之負型感光性組成物、硬化膜及其製造方法
TW201807490A (zh) 樹脂組成物、硬化膜與其製造方法、以及固體攝像元件
JP2012013906A (ja) 感光性樹脂組成物
JP2024027180A (ja) 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法
JP6022870B2 (ja) 感光性樹脂組成物
TWI765978B (zh) 感光性矽氧烷樹脂組成物、硬化膜及觸控面板用構件、積層體及其製造方法
JP7484710B2 (ja) ポジ型感光性樹脂組成物、その硬化膜およびそれを具備する光学デバイス
JP2015068930A (ja) 感光性樹脂組成物

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees