TWI484029B - Fixed abrasive grain wire saw with water-soluble cutting fluid, cutting method using its ingot, its recovery method and cutting the resulting wafer - Google Patents

Fixed abrasive grain wire saw with water-soluble cutting fluid, cutting method using its ingot, its recovery method and cutting the resulting wafer Download PDF

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TWI484029B
TWI484029B TW099138425A TW99138425A TWI484029B TW I484029 B TWI484029 B TW I484029B TW 099138425 A TW099138425 A TW 099138425A TW 99138425 A TW99138425 A TW 99138425A TW I484029 B TWI484029 B TW I484029B
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cutting
water
fixed abrasive
wire saw
ingot
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TW201134936A (en
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Tenejiro Yoshida
Kiyofumi Suzuki
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Palace Chemical Co Ltd
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    • B24—GRINDING; POLISHING
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    • B24B27/06—Grinders for cutting-off
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    • B24—GRINDING; POLISHING
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Description

固定研磨粒線鋸用水溶性切割液、使用其之鑄錠之切割方法、其回收方法及切割所得之晶圓
本發明係關於一種用於使用固定研磨粒線鋸來切割矽鑄錠之固定研磨粒線鋸用水溶性切割液、使用其之鑄錠之切割方法、其回收方法及切割所得之晶圓。
先前以來，矽鑄錠之切割係使用利用游離研磨粒之帶鋸或線鋸之切割。使用游離研磨粒之帶鋸或線鋸之切割具有以下問題：經切割之晶圓上附著有漿料，後步驟中之清洗負荷較高，又，難以自矽鑄錠之切割使用液中分離出游離研磨粒、油污、切割液，而回收性較差。
對於該等問題，業界開發出一種使用電沈積或樹脂黏結劑(resin bond)將研磨粒固定於線上之固定線鋸，其具有簡化清洗步驟及可自矽鑄錠之切割使用液中分離出切割液與油污而提高回收性之優點。業界提出水或如專利文獻1及2之水溶性切割液作為使用該固定線鋸切割矽時所使用之切割液。
[專利文獻1]日本特開2003-82334號公報
[專利文獻2]日本特開2009-57423號公報
然而，於使用該等水溶性切割液切割矽之情形時，存在矽與水反應而產生氫氣之缺點，並且由於矽與水反應所產生之氫氣，而引起發泡或矽凝聚，而使切割液之黏度上升，無法獲得目標之切割性能。又存在由於矽與水反應所產生之氫氣與切割液本身之發泡性，而其後使用離心分離機之回收性較差之問題。
因此，本發明係提供一種切割性能較高，可抑制因矽與水反應而產生氫氣之固定研磨粒線鋸用水溶性切割液、使用其之鑄錠之切割方法、其回收方法及切割所得之晶圓。
為解決上述之問題，本發明人等反覆潛心研究，結果發現，藉由使用以特定比例含有(a)由特定通式所構成之聚醚、(b)二醇(glycol)及分子量為100～300之低分子量二醇醚之至少一種、以及(c)水的水溶性切割液，即便在用於固定研磨粒線鋸之情形時，切割性能亦高，並且可抑制因矽與水反應而產生氫氣。即，本發明係一種固定研磨粒線鋸用水溶性切割液，其特徵在於：含有(a)式(1)所示之聚醚、(b)二醇及分子量為100～300之低分子量二醇醚之至少一種、以及(c)水，(a)與(b)之比為1：99～50：50，(c)之含量為5～50重量%。
C4 H9 O(EO)m (AO)n R1 　(1)
(R1 表示氫原子或碳數為1～8之烷基或烯基，EO表示氧伸乙基(oxyethylene group)，AO表示碳數為3～4之氧伸烷基(oxyalkylene group)，m及n分別表示1～20之加成莫耳數。)
又，本發明係一種鑄錠之切割方法、固定研磨粒線鋸用水溶性切割液之回收方法、及使用上述鑄錠切割方法切割所得之晶圓，上述鑄錠之切割方法之特徵在於：使用上述固定研磨粒線鋸用水溶性切割液，藉由固定研磨粒線鋸來切割矽鑄錠；上述固定研磨粒線鋸用水溶性切割液之回收方法之特徵在於：藉由該鑄錠切割方法進行鑄錠之切割後，使用離心分離機自矽中分離出固定研磨粒線鋸用水溶性切割液。
如上所述，根據本發明，可提供一種切割性能較高，並且可抑制因矽與水反應而產生氫氣之固定研磨粒線鋸用水溶性切割液、使用其之鑄錠之切割方法、其回收方法及切割所得之晶圓。
本發明之固定研磨粒線鋸用水溶性切割液所使用之(a)聚醚之式(1)中，R1 為氫原子或碳數為1～8之烷基或烯基，EO為氧伸乙基，AO為碳數為3或4之氧伸烷基，m及n分別表示1～20之加成莫耳數。又，式(1)所示之聚醚可藉由無規聚合而聚合，亦可藉由嵌段聚合而聚合。式(1)所示之聚醚之重量平均分子量較佳為200～2,000。如此將聚醚限定為式(1)所示之聚伸烷二醇丁醚係因為：若使用甲基或乙基等之醚，則於固定研磨粒線鋸中無法獲得充分之切割性能。作為此種聚伸烷二醇丁醚，例如有Yukanol 50MB-5(日油公司製造)等。
又，(b)之二醇較佳為具有2個OH基，且分子量或重量平均分子量為60～3,500，例如有單乙二醇、二乙二醇、三乙二醇、單丙二醇、二丙二醇、三丙二醇、己二醇及聚乙二醇、聚丙二醇等聚伸烷二醇等。並且，(b)之低分子量二醇醚之分子量為100～300即可，例如有二乙二醇單甲醚、二乙二醇單丁醚及二乙二醇單己醚等。
該(b)係包含(b1)式(2)所示之聚伸烷二醇、與(b2)除(b1)以外之二醇及分子量為100～300之低分子量二醇醚之至少一種，(b1)之含量較佳相對於水溶性切割液總體為0.01～5.0重量%。式(2)中，x、y、z分別表示1～20之加成莫耳數。式(2)所示之聚醚之重量平均分子量較佳為1,000～3,000。又，使(b1)為0.01～5.0重量%之原因在於，若未達0.01重量%則無法改善發泡問題，回收性會變差，若為5.0重量%以上則切割性能會變差。(b1)之含量更佳為0.1～2.0重量%。
HO(C3 H6 O)x (C2 H4 O)y (C3 H6 O)z H　(2)
(x、y、z分別表示1～20之加成莫耳數。)
本發明之固定研磨粒線鋸用水溶性切割液可根據需要而添加(d)分散劑。作為所使用之分散劑，有：於烯丙醇、順丁烯二酸酐之共聚物中接枝聚合聚氧伸烷基單烷基醚之聚羧酸或其鹽，於烯丙醇、順丁烯二酸酐、苯乙烯之共聚物中接枝聚合聚氧伸烷基單烷基醚之聚羧酸或其鹽，萘磺酸縮合物或其鹽等，通常作為分散劑，可使用市售者。分散劑之含量較佳為0.1～5.0重量%。於0.1～5.0重量%時，切割時切屑之分散性良好，可抑制由於發泡而引起之切割性能及回收性之下降。(d)分散劑之含量更佳為0.1～1重量%。
於本發明之固定研磨粒線鋸用水溶性切割液中，若(a)與(b)之比為1：99～50：50，則抑制因矽與水反應而產生氫氣之效果較高，不易發生由於氫氣之產生而引起之發泡或矽凝聚，可使黏度變化變少。又，對工作機械中所使用之樹脂零件的影響亦較少，可提高切割性能。(a)與(b)之比更佳為5：95～30：70。
於本發明之固定研磨粒線鋸用水溶性切割液中，若(c)水為5～50重量%，則不會有切割時之引火性問題，將切割時之發熱進行冷卻之能力較高，發熱所引起之水分蒸發量較少，故可提高切割性能。又，可抑制切割中之晶圓表面之乾燥，降低後步驟之清洗步驟之負荷。水分量更佳為5～40重量%。
本發明之固定研磨粒線鋸用水溶性切割液視需要亦可添加防銹劑、防腐劑、香料、染料等。
本發明之固定研磨粒線鋸用水溶性切割液於作為半導體元件或太陽電池之材料之矽晶圓的切割時，可使用固定研磨粒線鋸作為切割工具，使用多線鋸作為切割加工機。
本發明之固定研磨粒線鋸用水溶性切割液可於切割後，使用離心分離機將矽與水溶性切割液分離並回收。
使用本發明之鑄錠之切割方法切割所得之晶圓與先前的使用固定研磨粒線鋸用水溶性切割液切割所得之晶圓相比，可獲得表面粗度、起伏度良好之晶圓，可用作半導體元件用或太陽電池用晶圓。
[實施例]
以下，對本發明之固定研磨粒線鋸用水溶性切割液之實施例進行說明，但本發明並不限於實施例。首先，根據表1至表4之調配量，使用通常之方法將該等混合，藉此獲得實施例1至實施例12之固定研磨粒線鋸用水溶性切割液、及比較例1至比較例10之固定研磨粒線鋸用水溶性切割液。
(切割試驗)
以下，使用實施例1至實施例12之固定研磨粒線鋸用水溶性切割液、及比較例1至比較例10之固定研磨粒線鋸用水溶性切割液，進行切割試驗，測定切割距離。切割試驗係於以下條件下進行：線鋸試驗機：3032-4(WELL製造)，線：芯線0.12mm、金剛石直徑12-25μm(旭金剛石公司(Asahi Diamond Industrial)製造)，線速度：200m/min，加工負荷：30g，加工時間：30分鐘，加工工件：20mm×30mm×30mm，試驗溫度：25℃。將結果示於表5及表6。由表5及表6可知，本實施例之固定研磨粒線鋸用水溶性切割液之切割性能良好。
(黏度及氣體產生試驗)
繼而，假定有使用固定研磨粒線鋸切割單晶矽鑄錠時混入的活性矽屑，而於實施例1至實施例12之固定研磨粒線鋸用水溶性切割液、以及比較例1至比較例3及比較例5至比較例9之固定研磨粒線鋸用水溶性切割液中，添加20重量%之矽粉(粒徑約為5μm)，使用行星式球磨機進行粗粉碎，使用BL型旋轉黏度計(轉子No.1 60rpm)測定其於25℃下之黏度(黏度1)。其後，將其放入可密封之聚乙烯袋(厚度為0.04mm)並進行抽氣，確認於50℃下保存24小時後之矽反應氣體量，並且測定其於25℃下之黏度(黏度2)。粗粉碎係於以下條件下進行：杯：500ml氧化鋯罐，介質：ψ2mm氧化鋯珠，試樣量：200ml，介質量：200ml，轉數：250rpm，時間：30分鐘。反應氣體量之確認係於以下條件下進行：聚乙烯袋：透明封口袋(日本高科技(股)(Nihon Hitech)製造)，厚度：0.04mm，確認方法：目視(聚乙烯袋之膨脹狀況)。將結果示於表7及表8。由表7及表8可知，本發明之固定研磨粒線鋸用水溶注切割液係矽與水之反應氣體量極少，黏度變化亦較小。
(清洗試驗)
繼而，假定有使用固定研磨粒線鋸切割單晶矽鑄錠時混入的活性矽屑，而於實施例1至實施例12之水溶性切割液、以及比較例3及比較例6之水溶性切割液中添加20重量%之矽粉(粒徑約為5μm)，令使用行星式球磨機於與上述(黏度及氣體產生試驗)粗粉碎相同之條件下進行粗粉碎之液體，附著於3英吋矽晶圓之所有面上，一直垂直地維持晶圓，並於室溫下靜置24小時。其後，用流水清洗，確認清洗性。將結果示於表9。由表9可知，本發明之固定研磨粒線鋸用水溶性切割液於後步驟中之清洗良好。
<評價方法>
○：可全部清洗
△：有部分清洗不均
×：所有面清洗不良
(發泡試驗)
繼而，假定於切割中發泡或回收中發泡，而將實施例1至12之固定研磨粒線鋸用水溶性切割液，以及比較例1、比較例2、及比較例6之固定研磨粒線鋸用水溶性切割液於有塞式100‧量筒中加入至50‧，於塞緊後激烈震盪。確認其後之發泡量及直至能看見液表面為止的消泡時間。將結果示於表10。由表10可知，本發明之水溶性切割液之發泡較少而良好。

Claims (5)

  1. 一種固定研磨粒線鋸用水溶性切割液，含有：(a)式(1)所示之聚醚；(b)(b1)式(2)所示之聚伸烷二醇，與(b2)除(b1)以外之二醇(glycol)及分子量為100~300之低分子量二醇醚之至少一種；以及(c)水，(a)與(b)之比為1：99~50：50，(c)之含量為5~50重量%，(b1)之含量相對於水溶性切割液總體為0.01~5.0重量%；C4 H9 O(EO)m (AO)n R1 (1)(R1 表示氫原子或碳數為1~8之烷基或烯基，EO表示氧伸乙基(oxyethylene group)，AO表示碳數為3~4之氧伸烷基(oxyalkylene group)，m及n分別表示1~20之加成莫耳數)，HO(C3 H6 O)x (C2 H4 O)y (C3 H6 O)z H (2)(x、y、z分別表示1~20之加成莫耳數)。
  2. 如申請專利範圍第1項之固定研磨粒線鋸用水溶性切割液，其進一步含有0.1~5.0重量%之(d)分散劑。
  3. 一種鑄錠切割方法，使用申請專利範圍第1項或第2項之固定研磨粒線鋸用水溶性切割液，藉由固定研磨粒線鋸來切割矽鑄錠。
  4. 一種固定研磨粒線鋸用水溶性切割液之回收方法，使用申請專利範圍第3項之鑄錠切割方法進行鑄錠之切割 後，使用離心分離機自矽中分離出固定研磨粒線鋸用水溶性切割液。
  5. 一種晶圓，其係使用申請專利範圍第3項之鑄錠切割方法切割而得。
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