TW201134936A - Water-soluble cutting solution for fixed abrasive wire saw, method for cutting ingot using same, method for recycling the solution, and wafer produced by cutting - Google Patents

Water-soluble cutting solution for fixed abrasive wire saw, method for cutting ingot using same, method for recycling the solution, and wafer produced by cutting Download PDF

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Publication number
TW201134936A
TW201134936A TW099138425A TW99138425A TW201134936A TW 201134936 A TW201134936 A TW 201134936A TW 099138425 A TW099138425 A TW 099138425A TW 99138425 A TW99138425 A TW 99138425A TW 201134936 A TW201134936 A TW 201134936A
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Taiwan
Prior art keywords
cutting
water
soluble
wire saw
fixed abrasive
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TW099138425A
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Chinese (zh)
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TWI484029B (en
Inventor
Tenejiro Yoshida
Kiyofumi Suzuki
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Palace Chemical Co Ltd
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Publication of TWI484029B publication Critical patent/TWI484029B/en

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    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M169/00—Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
    • C10M169/06—Mixtures of thickeners and additives
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M175/00—Working-up used lubricants to recover useful products ; Cleaning
    • C10M175/0058—Working-up used lubricants to recover useful products ; Cleaning by filtration and centrifugation processes; apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M1/00—Liquid compositions essentially based on mineral lubricating oils or fatty oils; Their use as lubricants
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M101/00—Lubricating compositions characterised by the base-material being a mineral or fatty oil
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M103/00—Lubricating compositions characterised by the base-material being an inorganic material
    • C10M103/04—Metals; Alloys
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M103/00—Lubricating compositions characterised by the base-material being an inorganic material
    • C10M103/06—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/02—Well-defined hydrocarbons
    • C10M105/04—Well-defined hydrocarbons aliphatic
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/10—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/10—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M105/14—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms polyhydroxy
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/18—Ethers, e.g. epoxides
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/02—Hydroxy compounds
    • C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
    • C10M2207/046—Hydroxy ethers
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/109—Polyethers, i.e. containing di- or higher polyoxyalkylene groups esterified
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
    • C10N2020/01—Physico-chemical properties
    • C10N2020/04—Molecular weight; Molecular weight distribution
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    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/02—Pour-point; Viscosity index
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    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/18—Anti-foaming property
    • C—CHEMISTRY; METALLURGY
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    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/20—Metal working
    • C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling

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  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Lubricants (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Disclosed are: a water-soluble cutting solution for a fixed abrasive wire saw, which has high cutting performance and can prevent the generation of a hydrogen gas through the reaction between silicon and water; a method for cutting an ingot using the cutting solution; a method for recycling the cutting solution; and a wafer produced by cutting. The water-soluble cutting solution for a fixed abrasive wire saw is characterized by comprising (a) a polyether represented by formula (1), (b) at least one component selected from glycol and a low-molecular-weight glycol ether having a molecular weight of 100 to 300, and (c) water, wherein the content ratio of the component (a) to the component (b) is 1:99 to 50:50 and the content of the component (c) is 5 to 50 wt%. C4H9O(EO)m(AO)nR1 (1) (In the formula, R1 represents a hydrogen atom or an alkyl or alkenyl group having 1 to 8 carbon atoms; EO represents an oxyethylene group; AO represents an oxyalkylene group having 3 to 4 carbon atoms; and m and n are the molar addition numbers and independently represent 1 to 20.)

Description

201134936 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於使用固定研磨粒線鋸來切割矽 鑄鍵之固定研磨粒線鑛用水溶性切割液、使用其之鑄鍵之 切割方法、其回收方法及切割所得之晶圓。 【先前技術】 先別以來，矽鑄錠之切割係使用利用游離研磨粒之帶 鋸或線鋸之切割。使用游離研磨粒之帶鋸或線鋸之切割具 有以下問題：經切割之晶圓上附著有漿料，後步驟中之清 洗負荷較高，又，難以自矽鑄錠之切割使用液中分離出游 離研磨粒、油污、切割液，而回收性較差。 對於該等問題，業界開發出一種使用電沈積或樹脂黏 結劑（resin bond)將研磨粒固定於線上之固定線鋸，其具 有簡化清洗步驟及可自矽鑄錠之切割使用液中分離出切割 液與油污而提高回收性之優點。業界提出水或如專利文獻工 及2之水溶性切割液作為使用該固定線鋸切割矽時所使用 之切割液。 [專利文獻1]日本特開2003 - 82334號公報 [專利文獻2]日本特開2〇〇9__ 57423號公報 【發明内容】 然而，於使用該等水溶性切割液切割矽之情形時，存 在石夕與水反應而產生氫氣之缺駄 取虱t缺點，並且由於矽與水反應所201134936 VI. Description of the Invention: [Technical Field] The present invention relates to a method for cutting a fixed abrasive granule mineral water-soluble cutting liquid for cutting a sputum casting key using a fixed abrasive granulating saw, and a casting key using the same , its recycling method and wafers obtained by cutting. [Prior Art] Prior to this, the cutting of the bismuth ingot was performed using a band saw or a wire saw using free abrasive grains. Cutting with a band saw or a wire saw using free abrasive grains has the following problem: the slurry is adhered to the cut wafer, the cleaning load in the subsequent step is high, and it is difficult to separate from the cutting liquid used for the ingot casting. Free abrasive particles, oil stains, cutting fluid, and poor recovery. For these problems, the industry has developed a fixed wire saw that uses electrodeposition or resin bond to fix abrasive particles to the wire, which has a simplified cleaning step and can be used to separate the cutting from the cutting liquid used in the ingot casting. Liquid and oil stains enhance the recyclability. The industry has proposed water or a water-soluble cutting liquid such as Patent Document 2 as a cutting liquid used when cutting the crucible using the fixed wire saw. [Patent Document 1] JP-A-2003-82334 [Patent Document 2] Japanese Laid-Open Patent Publication No. Hei. No. Hei. In the evening, it reacts with water to produce hydrogen, which is short of 虱t, and because helium reacts with water.

產生之氫氣，而引起發泡肖石々尨取 ^ .± L 犬也次矽凝聚，而使切割液之黏度上 升’無法獲得目標之切割性能。又在力士 又存在由於矽與水反應所 201134936 產生之氫氣與切割液本身之發泡性，而其後使用離心分離 機之回收性較差之問題。 因此，本發明係提供一種切割性能較高，可抑制因矽 與κ反應而產生氫氣之固定研磨粒線鑛用水溶性切割液、 使用其之鑄錠之切割方法、其回收方法及切割所得之晶圓。 為解決上述之問題，本發明人等反覆潛心研究，結果 發現’藉由使用以特定比例含有（a)由特定通式所構成之 聚醚、（b)二醇（glyc〇i)及分子量為1〇〇〜3〇〇之低分子 量二醇_之至少—種、以及（〇水的水溶性切割液，即便 在用於固定研磨粒線鋸之情形時，切割性能亦高，並且可 抑制因矽與水反應而產生氫氣。即，本發明係一種固定研 磨粒線鋸用水溶性切割液，其特徵在於：含有（a)式（〇 所示之聚醚、（b)二醇及分子量為1〇〇〜3〇〇之低分子量 二醇醚之至少一種、以及⑴水，（a)與⑴之比為ι: 99〜50:50 ’ （c)之含量為5〜5〇重量％。 C4H9〇 ( EO) m ( AO) nR, ⑴ ，EO表 3〜4之 1〜20之 _ (Rl表示氮原子或碳數為1〜8之烷基或烯基 不氧伸乙基（。xyethylene group )，A〇表示碳數為 氧伸烷基（oxyalkyiene group) ，m及n分別表示 加成莫耳數。） w、因疋研磨粒線鋸 用水溶性㈣液之喊方法、及使用上料錠切割方法切 割所得之晶圓，上述鎮銳之切割方法之特徵在於：使用上 返固定研磨粒線鑛用水溶性切割& ’藉由固定研磨粒線鑛 201134936 來切割♦鑄錠，·上试同令m # 上达口疋研磨粒線鋸用水溶性切割液之回 收方法之特徵在於：藉 鑄割方法進行鑄錠之切割 後，使用離心分離機自矽中 離出固疋研磨粒線鋸用水溶 性切割液。 如上所述’根據本發 τ徒供一種切割性能較高， 並且可抑制因矽盥皮沒庙 " 生虱氣之固定研磨粒線鋸用 水洛性切割液、使用其之 +77 ^ 崎狄心切割方法、其回收方法及 切割所传之晶圓。 【實施方式】 本發明之固定研磨粒後链用士 & 5贗祖踝鋸用水溶性切割液所使用之（a) I鱗之式（1)中，卩故鈣 .F〇 ^ 1為11原子或碳數為1〜8之縣或烯 基，EO為氧伸乙基，A〇為 反数马3或4之氧伸烷基，m 及…·U示1〜2〇之加成莫耳數。又，4⑴所示之聚 料藉由無規聚合而聚合，亦可藉由嵌段聚合而聚合。式 (1)所不之聚轉之曹晉伞祕八工窃 重1 +均刀子罝較佳為200〜2,000。如 此將聚醚限定為式（丨）所示之聚 _ κ 1甲现一醇丁醚係因為：若 使用甲基或乙基等之醚，則於固定 心所磨粒線鋸中無法獲得 充分之切割性能。作為此種聚伸烧_ _ κ呷沉一醇丁醚，例如有Hydrogen is generated, which causes the foaming of the scutellite. The ±L dog also condenses, and the viscosity of the cutting fluid rises, and the cutting performance of the target cannot be obtained. In addition, in Lux, there is a problem of the foaming property of the hydrogen gas produced by the reaction of the water and the cutting liquid in 201134936, and the recycling of the centrifugal separator is poor. Therefore, the present invention provides a water-soluble cutting liquid for a fixed abrasive granule mine which has high cutting performance and can suppress hydrogen generation due to hydrazine and κ reaction, a cutting method using the same, a recovery method thereof, and a crystal obtained by cutting circle. In order to solve the above problems, the present inventors have repeatedly studied and found that by using a specific ratio of (a) a polyether composed of a specific formula, (b) a diol (glyc〇i), and a molecular weight of 1〇〇~3〇〇 of low molecular weight diol_ at least one species, and (water-soluble water-cutting cutting solution, even when used for fixing abrasive wire saws, cutting performance is high, and can suppress The hydrazine is reacted with water to produce hydrogen. That is, the present invention is a water-soluble cutting liquid for fixed abrasive granule saw, which comprises the formula (a) (the polyether shown in 〇, the (b) diol and the molecular weight of 1 At least one of the low molecular weight glycol ethers of 〇〇~3〇〇, and (1) water, the ratio of (a) to (1) is ι: 99~50:50 ' The content of (c) is 5 to 5 % by weight. C4H9 〇( EO ) m ( AO ) nR, (1) , EO Table 3 to 4 1 to 20 _ (Rl represents a nitrogen atom or an alkyl group having 1 to 8 carbon atoms or an alkenyl group of an oxygen group (.xyethylene group) ), A〇 indicates that the carbon number is an oxyalkyiene group, and m and n respectively represent the addition of a molar number.) w, because of the abrasive grain saw The water-soluble (four) liquid shouting method and the wafer obtained by cutting the upper ingot cutting method, the above-mentioned Zhenrui cutting method is characterized by: using the upper back fixed abrasive grain line for water-soluble cutting & 'by fixing abrasive grains Line mine 201134936 to cut ♦ ingot, · test with the same order m #上达口疋 abrasive grain saw for the water-soluble cutting liquid recovery method is characterized by: casting cutting method for ingot casting, using centrifugal separator The water-soluble cutting liquid for the solid-grain abrasive wire saw is separated from the crucible. As described above, 'there is a high-cutting performance according to the present invention, and the fixed abrasive grains can be suppressed because of the suede and the temple. The wire saw is a water-based cutting liquid, a +77 ^ sin-heart cutting method using the same, a recycling method thereof, and a wafer to be cut. [Embodiment] The fixed abrasive grain rear chain of the present invention is used In the formula (1) of the (a) I scale used for the water-soluble cutting liquid, the calcium.F〇^ 1 is a county or alkenyl group having 11 atoms or a carbon number of 1 to 8, and the EO is oxygen. A, A 〇 is an anti-horse 3 or 4 oxygen alkyl, m and U shows the addition mole number of 1 to 2 。. Further, the polymer shown by 4(1) is polymerized by random polymerization, and can also be polymerized by block polymerization. The formula (1) is not polymerized. Cao Jin Umbrella steals 1 + the average knife 罝 is preferably 200~2,000. Thus the polyether is limited to the poly _ κ 1 methyl butyl ether shown by formula (丨) because: if methyl Or an ether such as ethyl, which does not provide sufficient cutting performance in a fixed-hearted wire saw. As such a poly-extrusion _ _ κ 呷 一 醇 butyl ether, for example

Yukanol 50ΜΒ—5 (曰油公司製造）等。 又’⑴之二醇較佳為具有2個OH基，且分子量或 重量平均分子量為60〜3,500,例如有單乙二醇、二乙二醇、 三乙二醇、單丙二醇、二丙二醇、= ^ —内一_、己二醇及聚 乙二醇、聚丙二醇等聚伸烷二醇等。並H ^ . ^ 寸亚且，（b)之低分子 量二醇醚之分子量為1〇〇〜3〇〇即 I J ，例如有二乙二醇單曱 201134936 一乙二醇單丁醚及二乙二醇單己醚等。 〆（b)係包含（bl)式（2)所示之聚伸烷二醇、與 jb_2)除（M)以外之二醇及分子量為1〇〇〜3〇〇之低分子 β醇峻之至少一種，（b 1 )之含量較佳相對於水溶性切 割液總體為0·01〜5_〇重量％。式⑺中，X、y、z分別表 示1〜2〇之加成莫耳數。式（2)所示之聚醚之重量平均分 。子量較佳為uooy ooo。又，使（⑴為〇 〇1〜5 〇重量 %之原因在於，若未達〇 〇1重量％則無法改善發泡問題，回 收!·生會變差’若為5 0重量％以上則切割性能會變差。（bi ) 之3置更佳為0.1〜2·〇重量％。 H〇 ( C3H60) x ( c2H40) y ( C3H6〇) ZH ( 2) (χ、y、z分別表示丨〜20之加成莫耳數。） 本發明之固疋研磨粒線鋸用水溶性切割液可根據需要 而添加（d )分散劑。作為所使用之分散劑，有：於烯丙醇、 順丁烯二酸酐之共聚物中接枝聚合聚氧伸烷基單烷基醚之 聚叛8复或其鹽，於稀丙肖、順了烯：酸肝、苯乙烯之共聚 物中接枝聚合聚氧伸烷基單烷基醚之聚羧酸或其鹽，萘磺 酸縮合物或其鹽等’通常作為分散劑，可使用市售者。分 散劑之含量較佳為〇.1〜5·〇重量％β於〇1〜5 〇重量％時， 切割時切屑之分散性良好，可抑制由於發泡而引起之切割 性能及回收性之下降。（d )分散劑之含量更佳為〇丨〜丨重 量％ 0 於本發明之固定研磨粒線鋸用水溶性切割液中，若（a ) 與（b )之比為1 : 99〜50 : 50，則抑制因矽與水反應而產 β 6 201134936 生氫氣之效果較高，不易路斗士认# e 易發生由於虱氣之產生而引起之發 泡或矽凝聚，可使黏度變化變少。 對工作機械中所使 用之樹脂零件的影響亦較少，可姐古+ t ^ J平父乂，可k咼切割性能。（a)與 之比更佳為5: 95〜30: 於本發明之固定研磨物砼辦m I , W馆粒線鋸用水溶性切割液中，若 水為5〜50重量％，則不會有 ▼有切割時之引火性問題，將切割 時之發熱進行冷卻之能力鉍古 j. ^ 此力鈥尚，發熱所引起之水分蒸發量 較少，故可提高切割性能。又， J砰制切割中之晶圓表面 之乾燥’降低後步驟之清洗步趣夕奋# 月无步驟之負何。水分量更佳為5 〜40重量％。 本發月之固疋研磨粒線鑛用水溶性切割液視需要亦可 添加防銹劑、防腐劑、香料、染料等。 本發明之固定研磨粒線鑛用水溶性切割液於作為半導 體70件或太陽電池之材料之矽晶圓的切割時，可使用固定 研磨粒線锯作為切割卫具’使用多線鑛作為切割加工機。 本發明之固定研磨粒線鋸用水溶性切割液可於切割 後，使用離心分離機將矽與水溶性切割液分離並回收。。 使用本發明之铸錠之切割方法切割所得之晶圓與先前 的使用固定研磨粒線則水溶性切割液㈣所得之晶圓相 比’可獲得表面粗度、起伏度良好之晶圓，可㈣半導體 元件用或太陽電池用晶圓。 [實施例] 以下，對本發明之固定研磨粒線鋸用水溶性切割液之 實施例進行說明’但本發明並不限於實施例。首先，根據 201134936 表1至表4之調配量，使用通常之方法將該等混合，藉此 獲得實施例1至實施例12之固定研磨粒線鋸用水溶性切割 液、及比較例1至比較例10之固定研磨粒線鑛用水溶性切 割液。 [表1] 成分（重量％) 慨例 1 細列 2 倾例 3 獅例 4 實施例 5 倾例 6 二乙二醇 90 84.5 丙二醇 38 54 69 聚乙二醇木1 39.9 二乙二醇單曱醚 10 10 聚伸烷二醇單丁醚* 2 5 10 45 10 10 1 水 5 50 6.9 20 5 30 烯丙醇、順丁烯二酸酐、苯乙烯 之共聚物之鈉鹽木3 5 萘磺酸鹽之曱醛縮合物木4 0.3 聚伸烷二醇木5 0.1 0.1 1 0.2 * 1 :(聚乙二醇200、日油公司製造） * 2 : (Yukanol50MB-5、曰油公司製造） * 3 :(MalialimAKM —0531、曰油公司製造） * 4 : (LavelinFAN、第一工業製藥公司製造） * 5 : (AdekaPluronic 17R4、ADEKA 製造） [表2] 成分（重量％) 實施例 7 實施例 8 實施例 9 實施例 10 實施例 11 你包例 12 二乙二醇 28 29.9 58.9 丙二醇 65 29.9 聚乙二醇木6 2 二乙二醇單曱醚 50 二乙二醇單丁醚 5 20 15 聚伸烷二醇單丁醚* 2 30 20 10 30 25 10 水 20 10 40 25 44 30 烯丙醇、順丁烯二酸酐、苯乙烯之共 聚物之鈉鹽木3 1 1 聚伸烷二醇木5 0.1 0.1 0.1 * 6 :(聚乙二醇2000、日油公司製造） 201134936 [表 31 ___ .....1 . . 1 成分（重量％) tbfe例 1 tb較例 2 例 3 tbfe例 4 mm 5 似又 1夕,J 6 丙二醇 90 70 十二烷酸 0.1 二乙醇胺 0.1 水 9.8 51 100 9 69.9 .三乙醇胺之EOPO加成物木7 40 辛酸 5 二乙醇胺 4 0.1 烯丙醇、順丁烯二酸酐、笨乙烯之 共聚物之鈉鹽* 3 0.1 聚乙二醇* 1 99.8 三乙二醇單乙_ 20 檸檬酸 1 二乙二醇 20 _二乙二醇單曱醚 10 萘磺酸鹽之曱醛縮合物木5 0.1 * 7 :平均分子量為500 [表4] 成分（重量％) 比較例 7 比較例 8 比較例 9 比較例 10 丙二醇 80 80 80 79.8 水 10 10 10 15 聚丙一醇單甲驗* 7 10 _聚伸烷二醇輩甲_求g 10 單2乙基己峻G 10 烯丙醇、順丁烯二酸酐'笨乙烯之共聚物之 納鹽木3 0.2 聚伸烷二醇 - (EO : Ρ〇=50 ： 50) t 10 5 * 7 :平均分子量為500 ~~ * 8 :平均分子量為500 木9 :平诒公& snn * 1〇 : (Epan450、第一工業製藥製造） (切割試驗） 以下’使用實施例1至實施例12之固定研磨粒線鑛用 201134936 水溶性切割液 '及比較例1至比較例10之固定研磨粒線鑛 用水溶性切割液，進行切割試驗，測定切割距離。切割試 驗係於以下條件下進行：線鋸試驗機：3032 — 4 ( WELL製 造），線：芯線0· 1 2mm、金剛石直徑12 — 25 # m (旭金剛 石公司（Asahi Diamond Industrial )製造），線速度： 200m/min，加工負荷·· 30g，加工時間：30分鐘，加工工件： 20mmx3 0mmx3 0mm，試驗溫度：25 °C。將結果示於表5及 表6。由表5及表6可知，本實施例之固定研磨粒線鋸用水 溶性切割液之切割性能良好。 e [表5] 切割液 切割距離（mm) 實施例1 12.8 實施例2 13.3 實施例3 13.5 實施例4 14.3 實施例5 13.8 實施例6 11.9 實施例7 13.3 實施例8 12.8 實施例9 13.6 實施例10 13.3 實施例11 13.8 實施例12 14.0 10 201134936 [表6] 切割液 切割距離（mm、 比較例1 10.2 比較例2 6.7 比較例3 6.2 比較例4 8.2 比較例5 9.8 比較例6 10.5 比較例7 11.1 比較例8 10.0 比較例9 10.8 比較例10 11.5 (黏度及氣體產生試驗） 繼而，假定有使用固定研磨粒線鋸切割單晶矽鑄錠時 混入的活性矽屑，而於實施例丨至實施例12之固定研磨粒 線鑛用水溶性切割液、以及比較例i至比較例3及比較例$ 至比較例9之固定研磨粒線鋸用水溶性切割液中添加2〇 重量/〇之矽粕（粒役約為5 " m )，使用行星式球磨機進行 粗粉碎，使用BL型旋轉黏度計（轉子N〇1 6〇rpm)測定其 於25°C下之黏度（黏度D。其後，將其放入可密封之聚 乙烯衣（厚度為0 04mm)並進行抽氣，確認於501下保存 24小時後之矽反應氣體量，並且測定其於25。〇下之黏度（黏 度2)。粗粉碎係於以下條件下進行：杯：5〇〇mi氧化鍅罐， 介質：0 2mm氧化鍅珠，試樣量：2〇〇ml，介質量：2〇〇mi， 轉數.250rpm ’時間.30分鐘。反應氣體量之確認係於以 下條件下進行：聚乙稀袋：透明封口袋（日本高科技（股） (Nlh〇nHitech)製造）’厚度：〇〇4職，確認方法：目視 (聚乙烯袋之膨脹狀況）。將結果示於表7及表8。由表7 201134936 及表8可知，本發明之固定研磨粒線鋸用水溶注切割液係 矽與水之反應氣體量極少，黏度變化亦較小。 [表7] 切割液 黏度 1 (mPa-s) 反應氣體量 黏度 2 (mPa_s) 實施例1 60.0 N.D. 60.0 實施例2 15.0 N.D. 15.0 實施例3 40.0 N.D. 40.0 實施例4 25.0 N.D. 25.0 實施例5 25.0 N.D. 25.0 實施例6 20.0 產生（小） 40.0 實施例7 20.0 N.D. 20.0 實施例8 45.0 N.D. 50.0 實施例9 20.0 N.D. 20.0 實施例10 30.0 N.D. 40.0 實施例11 25.5 N.D. 26.0 實施例12 24.0 N.D. 25.0 [表8] 切割液 黏度 1 (mPa_s) 反應氣體量 黏度 2 (mPa-s) 比較例1 50.0 產生（大） 100< 比較例2 15.0 產生（大） 100< 比較例3 3.5 產生（大） 20.0 比較例5 21.0 產生（大） 100< 比較例6 9.5 產生（大） 100< 比較例7 30.0 產生（大） 60.0 比較例8 60.0 發生（大） 100< 比較例9 60.0 產生（大） 100< (清洗試驗） 繼而，假定有使用固定研磨粒線鋸切割單晶矽鑄錠時 混入的活性矽屑，而於實施例1至實施例12之水溶性切割 液、以及比較例3及比較例6之水溶性切割液中添加2 0重 量％之矽粉（粒徑約為5 β m )，令使用行星式球磨機於與 6 12 201134936 上述（黏度及氣體產生試驗）粗粉碎相同之冰μ i條件下進行粗 . 粉碎之液體，附著於3英吋矽晶圓之所有面上，一直垂直 地維持晶圓，並於室溫下靜置24小時。其後，用流水清洗， 確認清洗性。將結果示於表9。由表9可知，本發明之固定 研磨粒線鋸用水溶性切割液於後步驟中之清洗良好。Yukanol 50ΜΒ-5 (manufactured by Oyster Sauce). Further, the diol of '1) preferably has 2 OH groups and has a molecular weight or a weight average molecular weight of 60 to 3,500, and examples thereof include monoethylene glycol, diethylene glycol, triethylene glycol, monopropylene glycol, dipropylene glycol, and = ^—Intra-1, hexanediol, and polyalkylene glycol such as polyethylene glycol and polypropylene glycol. And H ^ . ^ inch y, and (b) the molecular weight of the low molecular weight glycol ether is 1 〇〇 ~ 3 〇〇 IJ, for example, diethylene glycol monoterpene 201134936 monoethylene glycol monobutyl ether and two Glycol monohexyl ether and the like. 〆(b) is a mixture of (b) a polyalkylene glycol represented by the formula (2), a diol other than (b) of jb_2), and a low molecular weight beta alcohol having a molecular weight of 1 〇〇 3 〇〇. At least one, the content of (b 1 ) is preferably from 0. 01 to 5 mm by weight based on the total amount of the water-soluble cutting liquid. In the formula (7), X, y, and z respectively represent the addition molar number of 1 to 2 Å. The weight average of the polyether represented by the formula (2). The sub-quantity is preferably uooy ooo. In addition, the reason why (1) is 〇〇1 to 5 〇% by weight is that if the amount is less than 1% by weight, the problem of foaming cannot be improved, and the recovery is caused by the deterioration of the raw material. If it is 50% by weight or more, the cutting is performed. The performance will be worse. The (bi) 3 is more preferably 0.1 to 2·〇% by weight. H〇( C3H60) x ( c2H40) y ( C3H6〇) ZH ( 2) (χ, y, z respectively represent 丨~ 20 addition mole number.) The water-soluble cutting liquid for the solid abrasive wire saw of the present invention may be added with (d) a dispersant as needed. As the dispersant used, it is: allyl alcohol, butene A copolymer of dianhydride in a copolymer of poly(oxyalkylene monoalkyl ether) or a salt thereof, grafted polyoxyethylene in a copolymer of dilute propylene, cis-ene: acid liver and styrene The polycarboxylic acid or a salt thereof, a naphthalenesulfonic acid condensate or a salt thereof, etc. of the alkylene monoalkyl ether are generally used as a dispersing agent, and a commercially available one is used. The content of the dispersing agent is preferably 〇.1 to 5·〇 When the weight % β is in the range of 1 to 5 % by weight, the dispersibility of the chips during cutting is good, and the cutting performance and the recovery property due to foaming can be suppressed. (d) Dispersant More preferably, the content is 〇丨~丨% by weight. 0 In the water-soluble cutting liquid for fixed abrasive wire saw of the present invention, if the ratio of (a) to (b) is 1:99 to 50:50, the inhibition is caused. Water reaction produces β 6 201134936 The effect of hydrogen generation is high, and it is difficult for the road warrior to recognize that # e is prone to foaming or enthalpy condensation caused by the generation of helium, which can reduce the viscosity change. The influence of the resin parts is also less, but the old-fashioned + t ^ J flat father 乂 can be k 咼 cutting performance. (a) better than the ratio of 5: 95~30: in the fixed abrasive of the present invention In the water-soluble cutting liquid for the grain saw of I and W, if the water is 5 to 50% by weight, there will be no igniting problem when cutting, and the ability to cool the heat during cutting will be high. The quality of the water caused by the heat is less, so the cutting performance can be improved. Moreover, the drying of the surface of the wafer in the J-cutting process is reduced by the step of cleaning. The water content is more preferably 5 to 40% by weight. It is also possible to add a rust preventive, a preservative, a fragrance, a dye, etc. The fixed abrasive granule mineral water-soluble cutting liquid of the present invention can be used for the cutting of a silicon wafer which is a material of 70 semiconductors or solar cells, and can be fixedly polished. The wire saw is used as a cutting aid to use a multi-line ore as a cutting machine. The water-soluble cutting liquid for a fixed abrasive wire saw of the present invention can be separated and recovered from a water-soluble cutting liquid by using a centrifugal separator after cutting. The wafer obtained by the cutting method of the ingot of the present invention can be used to obtain a wafer having a good surface roughness and a good undulation compared with the wafer obtained by using the water-soluble cutting liquid (4) of the fixed abrasive granule. Wafer for semiconductor components or solar cells. [Examples] Hereinafter, examples of the water-soluble cutting liquid for fixed abrasive granule saw of the present invention will be described. However, the present invention is not limited to the examples. First, according to the blending amounts of Tables 1 to 4 of 201134936, these were mixed by a usual method, thereby obtaining the water-soluble cutting liquid for fixed abrasive wire saws of Examples 1 to 12, and Comparative Examples 1 to Comparative Examples. 10 fixed abrasive grain line mineral water-soluble cutting fluid. [Table 1] Ingredient (% by weight) Example 1 List 2 Pour Example 3 Lion Case 4 Example 5 Pour Example 6 Diethylene glycol 90 84.5 Propylene glycol 38 54 69 Polyethylene glycol wood 1 39.9 Diethylene glycol monoterpene Ether 10 10 polyalkylene glycol monobutyl ether * 2 5 10 45 10 10 1 water 5 50 6.9 20 5 30 allyl alcohol, maleic anhydride, copolymer of styrene, sodium salt wood 3 5 naphthalenesulfonic acid Salt furfural condensate wood 4 0.3 polyalkylene glycol wood 5 0.1 0.1 1 0.2 * 1 : (polyethylene glycol 200, manufactured by Nippon Oil Co., Ltd.) * 2 : (Yukanol 50MB-5, manufactured by Oyster Company) * 3 (Malialim AKM - 0531, manufactured by Oyster Oil Co., Ltd.) * 4 : (Lavelin FAN, manufactured by Daiichi Kogyo Co., Ltd.) * 5 : (Manufactured by Adeka Pluronic 17R4, ADEKA) [Table 2] Component (% by weight) Example 7 Example 8 Implementation EXAMPLE 9 EXAMPLE 10 EXAMPLE 11 Your package 12 diethylene glycol 28 29.9 58.9 propylene glycol 65 29.9 polyethylene glycol wood 6 2 diethylene glycol monoterpene ether 50 diethylene glycol monobutyl ether 5 20 15 polyalkylene oxide Glycol monobutyl ether* 2 30 20 10 30 25 10 water 20 10 40 25 44 30 allyl alcohol, maleic acid Sodium salt of copolymer of anhydride and styrene 3 1 1 polyalkylene glycol wood 5 0.1 0.1 0.1 * 6 : (polyethylene glycol 2000, manufactured by Nippon Oil Co., Ltd.) 201134936 [Table 31 ___ .....1 . . 1 component (% by weight) tbfe Example 1 tb compared to Example 2 Example 3 tbfe Example 4 mm 5 Like yet, J 6 propylene glycol 90 70 Dodecanoic acid 0.1 Diethanolamine 0.1 Water 9.8 51 100 9 69.9 . Triethanolamine EOPO adduct wood 7 40 octanoic acid 5 diethanolamine 4 0.1 allyl alcohol, maleic anhydride, stupid ethylene copolymer sodium salt * 3 0.1 polyethylene glycol * 1 99.8 triethylene glycol monoethyl _ 20 lemon Acid 1 Diethylene glycol 20 _ diethylene glycol monodecyl ether 10 Naphthalene sulfonate furfural condensate wood 5 0.1 * 7 : Average molecular weight is 500 [Table 4] Ingredient (% by weight) Comparative Example 7 Comparative Example 8 Comparative Example 9 Comparative Example 10 Propylene glycol 80 80 80 79.8 Water 10 10 10 15 Polypropanol monomethyl assay * 7 10 _ Polyalkylene glycol generation A _ seeking g 10 Mono 2 ethylhexan G 10 Allyl alcohol, cis Butadiene anhydride's stupid ethylene copolymer nano salt wood 3 0.2 polyalkylene Alcohol - (EO : Ρ〇 = 50 : 50) t 10 5 * 7 : average molecular weight is 500 ~ ~ * 8 : average molecular weight is 500 wood 9 : 诒公公 & snn * 1〇: (Epan450, first industry Pharmaceutical manufacturing) (Cutting test) The following 'Use of the fixed abrasive granules of Examples 1 to 12 for 201134936 water-soluble cutting liquid' and the water-soluble cutting liquids of the fixed abrasive granules of Comparative Examples 1 to 10 were carried out. Cutting test to determine the cutting distance. The cutting test was carried out under the following conditions: wire saw tester: 3032 - 4 (manufactured by WELL), wire: core wire 0·1 2 mm, diamond diameter 12 - 25 # m (made by Asahi Diamond Industrial), line Speed: 200m/min, processing load · · 30g, processing time: 30 minutes, machining workpiece: 20mmx3 0mmx3 0mm, test temperature: 25 °C. The results are shown in Tables 5 and 6. As is apparent from Tables 5 and 6, the cutting performance of the water-soluble cutting liquid of the fixed abrasive grain saw of the present example was good. e [Table 5] Cutting liquid cutting distance (mm) Example 1 12.8 Example 2 13.3 Example 3 13.5 Example 4 14.3 Example 5 13.8 Example 6 11.9 Example 7 13.3 Example 8 12.8 Example 9 13.6 Example 10 13.3 Example 11 13.8 Example 12 14.0 10 201134936 [Table 6] Cutting liquid cutting distance (mm, Comparative Example 1 10.2 Comparative Example 2 6.7 Comparative Example 3 6.2 Comparative Example 4 8.2 Comparative Example 5 9.8 Comparative Example 6 10.5 Comparative Example 7 11.1 Comparative Example 8 10.0 Comparative Example 9 10.8 Comparative Example 10 11.5 (Viscosity and Gas Generation Test) Next, it is assumed that the active swarf which is mixed when the single crystal bismuth ingot is cut using a fixed abrasive granule saw is used in the embodiment to The water-soluble cutting liquid for the fixed abrasive granules of Example 12 and the water-soluble cutting liquid for the fixed abrasive granule saw of Comparative Example i to Comparative Example 3 and Comparative Example 9 to Comparative Example 9 were added with 2 〇 weight/〇 The granulation is about 5 " m ), coarsely pulverized using a planetary ball mill, and its viscosity at 25 ° C (viscosity D) is measured using a BL type rotary viscometer (rotor N 〇 16 rpm). Put it in a sealable A polyethylene garment (thickness of 0 04 mm) was evacuated, and the amount of the ruthenium reaction gas after storage for 24 hours at 501 was confirmed, and the viscosity was measured at 25 〇 under the underarm (viscosity 2). The coarse pulverization was under the following conditions. Carry out: Cup: 5〇〇mi oxidized enamel tank, medium: 0 2mm yttrium oxide beads, sample amount: 2〇〇ml, medium amount: 2〇〇mi, number of revolutions. 250rpm 'time. 30 minutes. The confirmation was carried out under the following conditions: Polythene bag: Transparent sealed bag (made by Nith Hynhetech Co., Ltd.) 'Thickness: 〇〇 4 positions, confirmation method: Visual inspection (expansion status of polyethylene bag) The results are shown in Tables 7 and 8. From Table 7 201134936 and Table 8, it can be seen that the fixed abrasive granule saw of the present invention has a very small amount of reaction gas and a small change in viscosity with water-soluble cutting liquid. [Table 7] Cutting Fluid Viscosity 1 (mPa-s) Reaction Gas Volume Viscosity 2 (mPa_s) Example 1 60.0 ND 60.0 Example 2 15.0 ND 15.0 Example 3 40.0 ND 40.0 Example 4 25.0 ND 25.0 Example 5 25.0 ND 25.0 Example 6 20.0 Generation (small) 40.0 Example 7 20. 0 ND 20.0 Example 8 45.0 ND 50.0 Example 9 20.0 ND 20.0 Example 10 30.0 ND 40.0 Example 11 25.5 ND 26.0 Example 12 24.0 ND 25.0 [Table 8] Cutting Fluid Viscosity 1 (mPa_s) Reaction Gas Volume Viscosity 2 ( mPa-s) Comparative Example 1 50.0 Production (large) 100 < Comparative Example 2 15.0 Production (large) 100 < Comparative Example 3 3.5 Production (large) 20.0 Comparative Example 5 21.0 Production (large) 100 < Comparative Example 6 9.5 Generation (large 100<Comparative Example 7 30.0 Production (large) 60.0 Comparative Example 8 60.0 occurrence (large) 100<Comparative Example 9 60.0 Production (large) 100<(cleaning test) Next, it is assumed that the single crystal crucible is cut using a fixed abrasive grain saw The active crumb mixed in the ingot was added to the water-soluble cutting liquid of Examples 1 to 12 and the water-soluble cutting liquid of Comparative Example 3 and Comparative Example 6 to add 20% by weight of niobium powder (particle size about 5 β m ), using a planetary ball mill to carry out the coarse. pulverized liquid under the same conditions as the above-mentioned (viscosity and gas generation test) coarse pulverization of 6 12 201134936, attached to all of the 3 inch wafers. surface , Has maintained a wafer vertically, and allowed to stand at room temperature for 24 hours. Thereafter, it was washed with running water to confirm the cleanability. The results are shown in Table 9. As is apparent from Table 9, the water-soluble cutting liquid for a fixed abrasive grain saw of the present invention was cleaned in the subsequent step.

.表91 切割液 清洗性_ _實施例1 〇 實施例2 〇 實施例3 〇 實施例4 〇 實施例5 〇 _貢施例6 〇 _實施例7 〇 _實施例8 〇 9 〇 實施例10 〇 _實施例11 〇 施例12 〇 」^例3 X 比較例6 X <評價方法> 〇：可全部清洗 △:有部分清洗不均 X :所有面清洗不良 (發泡試驗） 繼而，假定於切割中發泡或回收中發泡，而將實施例i 至12之固定研磨粒線鋸用水溶性切割液，以及比較例i、 比k例2、及比較例6之固定研磨粒線鋸用水溶性切割液於 13 201134936 有塞式1 00 ·量筒中加入至50 ·，於塞緊後激烈震盪。確認 其後之發泡量及直至能看見液表面為止的消泡時間。將結 果示於表10。由表10可知，本發明之水溶性切割液之發泡 較少而良好。 [表 10] 切割液 發泡量（·） 消泡時間 實施例1 2 10秒 實施例2 3 20秒 實施例3 0 0 實施例4 0 0 實施例5 0 0 實施例6 4 55秒 實施例7 4 40秒 實施例8 3 20秒 實施例9 4 10秒 實施例10 4 20秒 實施例11 6 20秒 實施例12 1 10秒 比較例1 15 1分鐘以上 比較例2 15 1分鐘以上 比較例6 10 1分鐘以上 【圖式簡單說明】 無 【主要元件符號說明】 無Table 91 Cutting Fluid Cleaning _ Example 1 〇 Example 2 〇 Example 3 〇 Example 4 〇 Example 5 〇 贡 贡 Example 6 〇 _ Example 7 〇 _ Example 8 〇 9 〇 Example 10 〇_Example 11 Example 12 〇"^ Example 3 X Comparative Example 6 X < Evaluation Method > 〇: All cleaning can be performed △: Partial cleaning unevenness X: All surface cleaning failure (foaming test) Then, It is assumed that foaming in the cutting or foaming in the recovery, and the water-soluble cutting liquid for the fixed abrasive wire saw of Examples i to 12, and the fixed abrasive wire saw of Comparative Example i, Comparative Example k, and Comparative Example 6 Add the water-soluble cutting solution to the 50 349 · 00 · measuring cylinder in 13 201134936, and violently oscillate after plugging. The amount of foaming afterwards was confirmed and the defoaming time until the surface of the liquid was visible. The results are shown in Table 10. As is apparent from Table 10, the water-soluble cutting liquid of the present invention has less foaming and is good. [Table 10] Cutting liquid foaming amount (·) Defoaming time Example 1 2 10 seconds Example 2 3 20 seconds Example 3 0 0 Example 4 0 0 Example 5 0 0 Example 6 4 55 seconds Example 7 4 40 seconds Example 8 3 20 seconds Example 9 4 10 seconds Example 10 4 20 seconds Example 11 6 20 seconds Example 12 1 10 seconds Comparative Example 1 15 1 minute or more Comparative Example 2 15 1 minute or more Comparative example 6 10 1 minute or more [Simple description of the drawing] No [Main component symbol description] None

S 14S 14

Claims (1)

201134936 七、申請專利範圍： 1 · 一種固定研磨粒線鋸用水溶性切割液，其特徵在於： 含有（a)式（1)所示之聚醚、（b)二醇（glyc〇1)及分 子量為100〜3 00之低分子量二醇_之至少一種、以及（〇) 水； (a)與（b)之比為1: 99〜50: 50，（c)之含量為5 〜5 0重量％ ; C4H90 ( EO) m ( AO) nR, ( 1 ) (R!表示氫原子或碳數為！〜8之烷基或烯基，£〇表 不氧伸乙基（oxyethyiene gr〇up)，A〇表示碳數為3〜4之 氧伸烷基（〇Xyalkylenegroup)，爪及n分別表示1〜2〇之 加成莫耳數）。 2.如申吻專利範圍第丨項之固定研磨粒線鋸用水溶性 切割液，其中’該（b)係包含：⑴）式⑺所示之聚 伸烷二醇、與（b2)除“1)以外之二醇及分子量為100 〜300之低分子量二醇醚之至少一種；（Μ)之含量相對於 水溶性切割液總體為〇.〇1〜5·〇重量％; HO ( C3H6〇) χ ( 〇2Η4〇) ^ ( 〇3Η6〇) zH ( 2) (X、Υ、Z分別表示1〜20之加成莫耳數）。 申°月專利範圍第1項或第2項之固定研磨粒線鋸用 生切割液’其進-步含有〇‘1〜5.0重量。/。之（d)分散 劑。 4.一種鑄錠切割方法 使用申睛專利範圍第 其特徵在於： 1項至第3項中任一項之固定研 15 201134936 磨粒線鋸用水溶性切割液，藉由固令m ^ 刀。』欣精田回夂研磨粒線鋸來切割矽 鑄鍵。 5 · —種固疋研磨粒線鋸用水溶性切割液之回收方法，其 特徵在於： 使用申請專利範圍第4項之鑄錠切割方法進行鑄銳之 t刀割後’使用離心分離機自矽中分離出固定研磨粒線鋸用 水溶性切割液。 6. —種晶圓，其係使用申請專利範圍第4項之鑄錠切割 方法切割而得。 八、圖式： 無 e 16201134936 VII. Patent application scope: 1 · A water-soluble cutting liquid for fixed abrasive wire saw, characterized by: (a) polyether represented by formula (1), (b) diol (glyc〇1) and molecular weight It is at least one of 100~300 00 low molecular weight diols, and (〇) water; the ratio of (a) to (b) is 1:99~50: 50, and the content of (c) is 5 ～5 0 weight %; C4H90 ( EO) m ( AO) nR, ( 1 ) (R! represents a hydrogen atom or an alkyl or alkenyl group having a carbon number of ~8, oxyethyiene gr〇up, A 〇 represents an oxygen alkyl group having a carbon number of 3 to 4, and a claw and n respectively represent an addition molar number of 1 to 2 Å. 2. The water-soluble cutting liquid for fixed abrasive granule saw according to the ninth aspect of the patent application, wherein the (b) system comprises: (1) a polyalkylene glycol represented by the formula (7), and (b2) except "1" At least one of a diol other than a diol having a molecular weight of from 100 to 300; the content of (Μ) is generally 〇1 to 5·〇% by weight relative to the water-soluble cutting liquid; HO (C3H6〇) χ ( 〇2Η4〇) ^ ( 〇3Η6〇) zH ( 2) (X, Υ, Z represent the addition of 1 to 20, respectively.) Fixed grinding of the first or second item of the patent range The raw material for cutting the wire saw is 'in the step of containing '1~5.0% by weight. (d) Dispersing agent. 4. An ingot cutting method using the scope of the patent claim is characterized by: 1 to Fixed research 15 of any of the 3 items 201134936 A water-soluble cutting liquid for abrasive wire saws, by means of a solid m ^ knife. 』欣精田回夂 abrasive grain saw to cut the 矽 casting key. 5 · — 固固疋A method for recovering a water-soluble cutting liquid for an abrasive wire saw, characterized in that: the ingot cutting method of the ingot casting method of the fourth application of the patent application is carried out After cutting, the water-soluble cutting liquid for fixed abrasive wire saw is separated from the crucible by using a centrifugal separator. 6. Wafer is obtained by cutting the ingot cutting method of the fourth application of the patent application. Type: no e 16
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