TWI481746B - Metal foil - Google Patents

Metal foil Download PDF

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Publication number
TWI481746B
TWI481746B TW102107462A TW102107462A TWI481746B TW I481746 B TWI481746 B TW I481746B TW 102107462 A TW102107462 A TW 102107462A TW 102107462 A TW102107462 A TW 102107462A TW I481746 B TWI481746 B TW I481746B
Authority
TW
Taiwan
Prior art keywords
coating layer
foil
alloy
metal foil
copper
Prior art date
Application number
TW102107462A
Other languages
English (en)
Chinese (zh)
Other versions
TW201343976A (zh
Inventor
森山晃正
Original Assignee
Ｊｘ日鑛日石金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ日鑛日石金屬股份有限公司 filed Critical Ｊｘ日鑛日石金屬股份有限公司
Publication of TW201343976A publication Critical patent/TW201343976A/zh
Application granted granted Critical
Publication of TWI481746B publication Critical patent/TWI481746B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW102107462A 2012-03-30 2013-03-04 Metal foil TWI481746B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012083265A JP5858849B2 (ja) 2012-03-30 2012-03-30 金属箔

Publications (2)

Publication Number Publication Date
TW201343976A TW201343976A (zh) 2013-11-01
TWI481746B true TWI481746B (zh) 2015-04-21

Family

ID=49259363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102107462A TWI481746B (zh) 2012-03-30 2013-03-04 Metal foil

Country Status (5)

Country Link
JP (1) JP5858849B2 (https=)
KR (2) KR20140141704A (https=)
CN (1) CN104271812B (https=)
TW (1) TWI481746B (https=)
WO (1) WO2013146088A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY183238A (en) * 2015-03-24 2021-02-18 Mitsui Mining & Smelting Co Ltd Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6683507B2 (ja) * 2015-07-22 2020-04-22 サトーホールディングス株式会社 ラベルを用いた加工物の生産を管理する方法
JP6594108B2 (ja) * 2015-08-25 2019-10-23 サトーホールディングス株式会社 ラベル、および、当該ラベルを用いた加工物の生産を管理する方法
JP6605271B2 (ja) * 2015-09-24 2019-11-13 Ｊｘ金属株式会社 離型層付き電解銅箔、積層体、半導体パッケージの製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6204430B2 (ja) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP6945523B2 (ja) * 2016-04-14 2021-10-06 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
JP6782116B2 (ja) * 2016-08-02 2020-11-11 古河電気工業株式会社 銀被覆材料
JP7251928B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP7251927B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR102098475B1 (ko) 2018-07-06 2020-04-07 주식회사 포스코 내식성, 도장성이 우수한 표면처리된 Zn-Ni 합금 전기도금강판의 제조방법
WO2023028983A1 (zh) * 2021-09-03 2023-03-09 宁德时代新能源科技股份有限公司 金属箔及制备方法、集流体、电极、电池及用电装置
WO2023117127A1 (en) * 2021-12-24 2023-06-29 Circuit Foil Luxembourg Electrolytic copper foil and secondary battery comprising the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1053818A (zh) * 1989-09-13 1991-08-14 古尔德有限公司 用于印刷电路板且其性质得到控制的箔片以及生产该箔片的工艺方法和电解液
TW201021639A (en) * 2008-11-25 2010-06-01 Nippon Mining Co Copper foil for printed circuit

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR9105776A (pt) * 1990-05-30 1992-08-04 Gould Inc Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
JPH1036992A (ja) * 1996-07-19 1998-02-10 Japan Energy Corp 電解銅箔及びその製造方法
JP4419161B2 (ja) * 1999-10-27 2010-02-24 Ｄｏｗａホールディングス株式会社 電解銅箔の製造方法
JP4445616B2 (ja) * 1999-10-27 2010-04-07 Ｄｏｗａホールディングス株式会社 電解銅箔
JP2004226615A (ja) * 2003-01-22 2004-08-12 Ricoh Co Ltd 現像装置およびこれを使用する画像形成装置
TW200500199A (en) * 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
JP4172704B2 (ja) 2003-07-31 2008-10-29 日鉱金属株式会社 表面処理銅箔およびそれを使用した基板
EP1895024A4 (en) * 2005-06-23 2009-12-23 Nippon Mining Co COPPER FOIL FOR PCB
JP2009170771A (ja) 2008-01-18 2009-07-30 Toppan Printing Co Ltd 太陽電池バックシート及び太陽電池モジュール
JP2011061151A (ja) 2009-09-14 2011-03-24 Toppan Printing Co Ltd 太陽電池用裏面保護シートおよびその製造方法、太陽電池モジュール
JP5493797B2 (ja) * 2009-12-10 2014-05-14 富士ゼロックス株式会社 画像形成装置および定着装置
KR20120091304A (ko) * 2009-12-24 2012-08-17 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 표면 처리 동박
JP2011216598A (ja) * 2010-03-31 2011-10-27 Kuraray Co Ltd 高周波回路基板
JP5885054B2 (ja) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5634103B2 (ja) 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5128695B2 (ja) * 2010-06-28 2013-01-23 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1053818A (zh) * 1989-09-13 1991-08-14 古尔德有限公司 用于印刷电路板且其性质得到控制的箔片以及生产该箔片的工艺方法和电解液
TW201021639A (en) * 2008-11-25 2010-06-01 Nippon Mining Co Copper foil for printed circuit

Also Published As

Publication number Publication date
JP2013213250A (ja) 2013-10-17
JP5858849B2 (ja) 2016-02-10
KR102095619B1 (ko) 2020-03-31
CN104271812A (zh) 2015-01-07
CN104271812B (zh) 2016-10-05
WO2013146088A1 (ja) 2013-10-03
TW201343976A (zh) 2013-11-01
KR20140141704A (ko) 2014-12-10
KR20160137678A (ko) 2016-11-30

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