TWI478979B - Conductive resin composition - Google Patents

Conductive resin composition Download PDF

Info

Publication number
TWI478979B
TWI478979B TW100125788A TW100125788A TWI478979B TW I478979 B TWI478979 B TW I478979B TW 100125788 A TW100125788 A TW 100125788A TW 100125788 A TW100125788 A TW 100125788A TW I478979 B TWI478979 B TW I478979B
Authority
TW
Taiwan
Prior art keywords
resin
conductive
resin composition
isocyanate compound
solid content
Prior art date
Application number
TW100125788A
Other languages
English (en)
Chinese (zh)
Other versions
TW201219483A (en
Inventor
Hidekazu Miyabe
Kentaro Obuchi
Seungjae Lee
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201219483A publication Critical patent/TW201219483A/zh
Application granted granted Critical
Publication of TWI478979B publication Critical patent/TWI478979B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/54—Polycondensates of aldehydes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/807—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34926—Triazines also containing heterocyclic groups other than triazine groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW100125788A 2010-07-23 2011-07-21 Conductive resin composition TWI478979B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010166493 2010-07-23
JP2010209267A JP5650477B2 (ja) 2010-07-23 2010-09-17 導電性樹脂組成物

Publications (2)

Publication Number Publication Date
TW201219483A TW201219483A (en) 2012-05-16
TWI478979B true TWI478979B (zh) 2015-04-01

Family

ID=45496825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100125788A TWI478979B (zh) 2010-07-23 2011-07-21 Conductive resin composition

Country Status (5)

Country Link
JP (1) JP5650477B2 (fr)
KR (1) KR101979034B1 (fr)
CN (1) CN103025782B (fr)
TW (1) TWI478979B (fr)
WO (1) WO2012011398A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5771042B2 (ja) * 2011-03-31 2015-08-26 太陽ホールディングス株式会社 導電性樹脂組成物
WO2014119463A1 (fr) * 2013-01-30 2014-08-07 Dic株式会社 Pâte conductrice, procédé permettant de former un motif conducteur et objet ayant un motif conducteur imprimé
WO2015122641A1 (fr) * 2014-02-13 2015-08-20 전자부품연구원 Composition de pâte de chauffage, élément chauffant de type en surface utilisant celle-ci, et dispositif chauffant de faible puissance portable
KR101689289B1 (ko) * 2015-05-14 2016-12-23 주식회사 대화알로이테크 발열 페이스트 조성물을 이용한 발열 코팅사 제조방법
KR101698908B1 (ko) * 2015-05-14 2017-02-01 주식회사 대화알로이테크 하이브리드 차량용 배터리 프리 히팅장치 및 그 제어 방법
JP6151742B2 (ja) * 2015-06-09 2017-06-21 タツタ電線株式会社 導電性ペースト
CN108495878B (zh) * 2016-01-20 2020-12-22 三菱瓦斯化学株式会社 树脂组合物、带支撑体的树脂片、多层印刷电路板及半导体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1280156A (zh) * 2000-07-11 2001-01-17 湖北省化学研究所 各向异性导电胶粘剂及其制备方法
US20030143404A1 (en) * 2001-11-01 2003-07-31 Welch Cletus N. Articles having a photochromic polymeric coating
US20090075201A1 (en) * 2007-09-19 2009-03-19 Konica Minolta Medical & Graphic, Inc. Planographic printing plate material, and cyclic ureide moiety-containing phenolic resin and its synthetic process

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953717B2 (ja) * 1981-07-27 1984-12-26 日本黒鉛工業株式会社 プリント回路基板上にヒ−トシ−ルコネクタとの接触端子部を製造する方法
JPS60254144A (ja) * 1984-05-31 1985-12-14 Canon Inc 電子写真感光体
JPS61235417A (ja) * 1985-04-11 1986-10-20 Bridgestone Corp 電磁波吸収材料
JPS61255925A (ja) * 1985-05-09 1986-11-13 Hitachi Chem Co Ltd 鋳物用ブロツク化イソシアネ−トおよびそれを用いた鋳物用樹脂被覆砂
JPH083066B2 (ja) * 1987-12-24 1996-01-17 東レ株式会社 透明導電性インキ組成物
JP2619289B2 (ja) * 1989-06-20 1997-06-11 三井金属鉱業株式会社 銅導電性組成物
JPH05194822A (ja) 1992-01-20 1993-08-03 Taiyo Ink Seizo Kk 導電性ペースト
JPH0644819A (ja) * 1992-07-24 1994-02-18 Kao Corp 導電性ペーストおよび導電性塗膜
JP3171700B2 (ja) * 1992-11-09 2001-05-28 住友ベークライト株式会社 フェノール樹脂成形材料
JPH08218006A (ja) * 1995-02-17 1996-08-27 Hitachi Chem Co Ltd 導電性ペースト
DE19736920A1 (de) * 1997-08-25 1999-03-04 Bayer Ag Wäßriges Beschichtungsmittel für Einbrennlackierung und Verfahren zu seiner Herstellung
JP2000094620A (ja) * 1998-09-22 2000-04-04 Asahi Chem Ind Co Ltd フェノール樹脂フォーム
JP2001064779A (ja) * 1999-08-25 2001-03-13 Kansai Paint Co Ltd 亜鉛系めっき鋼板用表面処理組成物
JP3969080B2 (ja) * 2001-01-31 2007-08-29 東海ゴム工業株式会社 無端ベルト
JP2003281935A (ja) * 2002-03-22 2003-10-03 Dainippon Printing Co Ltd ポリビニルアセタールを用いた感光性導電ペースト、電極の形成方法及び電極
AU2003276905A1 (en) * 2003-03-18 2004-10-11 Dow Corning Corporation A conductive composition and method of using the same
JP2006100081A (ja) 2004-09-29 2006-04-13 Toyobo Co Ltd 導電性ペースト
JP4547623B2 (ja) 2005-04-25 2010-09-22 東洋紡績株式会社 導電性ペースト
US8062558B2 (en) * 2006-12-26 2011-11-22 Sumitomo Bakelite Co., Ltd. Conductive paste

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1280156A (zh) * 2000-07-11 2001-01-17 湖北省化学研究所 各向异性导电胶粘剂及其制备方法
US20030143404A1 (en) * 2001-11-01 2003-07-31 Welch Cletus N. Articles having a photochromic polymeric coating
US20090075201A1 (en) * 2007-09-19 2009-03-19 Konica Minolta Medical & Graphic, Inc. Planographic printing plate material, and cyclic ureide moiety-containing phenolic resin and its synthetic process

Also Published As

Publication number Publication date
JP2012041517A (ja) 2012-03-01
CN103025782A (zh) 2013-04-03
WO2012011398A1 (fr) 2012-01-26
CN103025782B (zh) 2015-09-23
KR20140003370A (ko) 2014-01-09
KR101979034B1 (ko) 2019-05-15
TW201219483A (en) 2012-05-16
JP5650477B2 (ja) 2015-01-07

Similar Documents

Publication Publication Date Title
TWI478979B (zh) Conductive resin composition
JP4890063B2 (ja) 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
KR101173729B1 (ko) 수지 조성물, 프리프레그, 적층판, 다층 프린트 배선판 및 반도체 장치
US11312883B2 (en) Conductive paste composition and ceramic electronic component having external electrodes formed using the same
JP5771042B2 (ja) 導電性樹脂組成物
CN102803384A (zh) 薄膜用组合物以及用其制作的接着薄膜与覆盖薄膜
JP2017022033A (ja) 銀ペーストおよび銀ペーストの硬化体の製造方法
KR20220042110A (ko) 도전성 도료, 및 그것을 사용한 차폐 패키지의 제조 방법, 및 차폐층을 가지는 수지 성형품의 제조 방법
JP5816044B2 (ja) 導電性樹脂組成物、導電性樹脂硬化物および導体回路パターン
TWI556261B (zh) A conductive resin composition, a conductive resin cured product, and a pattern conductor circuit
JP2017130358A (ja) 導電性ペースト、および導電性ペーストの硬化体の製造方法
KR100699191B1 (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자
KR101266536B1 (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
KR100750331B1 (ko) 열 경화형 카본 저항 페이스트 조성물
KR101266534B1 (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
JP2017130357A (ja) 導電性ペースト、および導電性ペーストの硬化体の製造方法
JP3593782B2 (ja) 導電性ペースト
JP2017130356A (ja) 導電性ペーストの硬化体の製造方法
JP2005514488A (ja) 粉末エポキシ組成物
KR100306254B1 (ko) 도전성 은 페이스트 조성물
JPH01152149A (ja) 電気絶縁被覆用組成物
JPWO2016143802A1 (ja) 樹脂組成物、積層構造体及びその製造方法
JPH0931407A (ja) 電気絶縁被覆用組成物
KR20120034028A (ko) 접착제 수지 조성물, 그 경화물, 및 접착제 필름