TWI478803B - 分類與供給模造錠片之裝置 - Google Patents
分類與供給模造錠片之裝置 Download PDFInfo
- Publication number
- TWI478803B TWI478803B TW098142809A TW98142809A TWI478803B TW I478803 B TWI478803 B TW I478803B TW 098142809 A TW098142809 A TW 098142809A TW 98142809 A TW98142809 A TW 98142809A TW I478803 B TWI478803 B TW I478803B
- Authority
- TW
- Taiwan
- Prior art keywords
- molded
- block
- ingot
- rotating block
- defective
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title claims description 23
- 230000002950 deficient Effects 0.000 claims description 57
- 230000007246 mechanism Effects 0.000 claims description 43
- 239000007932 molded tablet Substances 0.000 claims description 28
- 239000003826 tablet Substances 0.000 claims description 12
- 230000007547 defect Effects 0.000 claims description 8
- 230000002265 prevention Effects 0.000 claims description 5
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/88—Separating or stopping elements, e.g. fingers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/16—Sorting according to weight
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9508—Capsules; Tablets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/027—Tablets, capsules, pills or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0208—Control or detection relating to the transported articles
- B65G2203/0258—Weight of the article
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Specific Conveyance Elements (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080132262A KR101511667B1 (ko) | 2008-12-23 | 2008-12-23 | 몰딩용 타블렛 선별 및 공급 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201024190A TW201024190A (en) | 2010-07-01 |
TWI478803B true TWI478803B (zh) | 2015-04-01 |
Family
ID=42288230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098142809A TWI478803B (zh) | 2008-12-23 | 2009-12-15 | 分類與供給模造錠片之裝置 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5291805B2 (ko) |
KR (1) | KR101511667B1 (ko) |
CN (1) | CN102264616B (ko) |
MY (1) | MY154102A (ko) |
TW (1) | TWI478803B (ko) |
WO (1) | WO2010074416A2 (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101029974B1 (ko) * | 2010-12-22 | 2011-04-20 | 금성산기 주식회사 | 반도체 소자용 로터리식 수지 태블릿 성형장치 |
TWI494631B (zh) * | 2011-01-26 | 2015-08-01 | Hon Hai Prec Ind Co Ltd | 間隔環自動供給裝置 |
JP5808135B2 (ja) * | 2011-04-21 | 2015-11-10 | エムテックスマツムラ株式会社 | 自動モールド装置におけるサブポットブロックのサブポット |
KR101362667B1 (ko) * | 2012-10-31 | 2014-02-13 | 세메스 주식회사 | 수지 공급 유닛 및 이를 갖는 기판 성형 장치 |
KR101436056B1 (ko) * | 2012-11-19 | 2014-09-02 | 한미반도체 주식회사 | 몰딩용 타블렛 공급장치 |
WO2014087491A1 (ja) * | 2012-12-04 | 2014-06-12 | 上野精機株式会社 | 移載装置 |
CN103921548B (zh) * | 2013-01-15 | 2016-10-26 | 神讯电脑(昆山)有限公司 | 自动检测双片装置 |
EP2801790B1 (en) * | 2013-01-30 | 2016-10-05 | Nittan Valve Co., Ltd. | Workpiece inspection equipment |
CN104972379B (zh) * | 2015-07-24 | 2017-04-12 | 烟台大学 | 一种盘类工件自动线任意角度自动转位机构 |
FR3043077A1 (fr) * | 2015-10-29 | 2017-05-05 | C E R M E X Constructions Etudes Et Rech De Materiels Pour L'emballage D'expedition | Dispositif et methode de superposition |
CN105329657A (zh) * | 2015-11-02 | 2016-02-17 | 天奇自动化工程股份有限公司 | 全封闭式旋转台 |
KR101868615B1 (ko) * | 2016-01-29 | 2018-06-18 | 이석정 | 이형 제품 중량별 분류장치 |
CN106697908A (zh) * | 2017-03-01 | 2017-05-24 | 广州明森科技股份有限公司 | 一种智能卡转移装置 |
KR102007721B1 (ko) * | 2017-10-27 | 2019-08-07 | 서한산업(주) | 휠지지체 반출장치 |
KR101923095B1 (ko) * | 2018-03-19 | 2019-02-27 | 박민홍 | 캡 조립장치 및 이를 이용한 캡 조립공정 |
JP6569921B1 (ja) * | 2018-05-22 | 2019-09-04 | 第一精工株式会社 | 樹脂材料供給機構及び樹脂材料供給方法 |
CN109205263B (zh) * | 2018-10-23 | 2020-05-12 | 黄娜 | 一种工件传送机构 |
CN109287548B (zh) * | 2018-10-30 | 2023-10-03 | 苏州市阳澄湖现代农业发展有限公司 | 河蟹体重自动分级装置及其控制方法 |
KR102132562B1 (ko) * | 2019-07-26 | 2020-07-09 | 한미반도체 주식회사 | 몰딩용 타블렛 공급장치 |
CN110587893B (zh) * | 2019-09-11 | 2024-07-23 | 河南盈科达新材料有限责任公司 | 半导体塑封料上料装置及其工作方法 |
CN110523954B (zh) * | 2019-09-28 | 2021-12-24 | 杭州永腾橡塑实业有限公司 | 一种上料机构及其压铸机 |
CN114131830B (zh) * | 2021-11-26 | 2023-10-31 | 乐清昌德成电子有限公司 | 插头半自动加工设备 |
JP2024025255A (ja) * | 2022-08-11 | 2024-02-26 | Towa株式会社 | 樹脂材料供給機構、樹脂成形装置および樹脂成形品の製造方法 |
JP2024044401A (ja) * | 2022-09-21 | 2024-04-02 | Towa株式会社 | 樹脂供給装置、樹脂成形装置、及び樹脂成形品の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4660713A (en) * | 1984-01-30 | 1987-04-28 | Erweka Apparatebau Gmbh | Transpot unit for tablets |
JPH062688U (ja) * | 1992-06-10 | 1994-01-14 | 日本電気株式会社 | 半導体装置の封止用樹脂供給ユニット |
JPH0745648A (ja) * | 1993-07-29 | 1995-02-14 | Matsushita Electric Ind Co Ltd | タブレットの供給装置 |
JPH1092851A (ja) * | 1996-09-12 | 1998-04-10 | Sumitomo Heavy Ind Ltd | Ic用タブレットのシャトル収納装置 |
US20070023208A1 (en) * | 2005-07-27 | 2007-02-01 | Ok-Sun Jung | Molding resin tablet feeding apparatus having weighing unit |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1285463B1 (it) * | 1996-02-21 | 1998-06-08 | Ima Spa | Apparato per la pesatura automatica, continua, rapida e precisa di prodotti di piccole dimensioni, particolarmente di capsule di gelatina |
JP2001233445A (ja) * | 2000-02-24 | 2001-08-28 | Ishii Ind Co Ltd | 物品整列供給装置 |
CN2832744Y (zh) * | 2005-06-20 | 2006-11-01 | 欣端机电股份有限公司 | 送料装置的改进结构 |
-
2008
- 2008-12-23 KR KR1020080132262A patent/KR101511667B1/ko active IP Right Grant
-
2009
- 2009-12-02 MY MYPI2011002624A patent/MY154102A/en unknown
- 2009-12-02 CN CN2009801522538A patent/CN102264616B/zh not_active Expired - Fee Related
- 2009-12-02 WO PCT/KR2009/007152 patent/WO2010074416A2/ko active Application Filing
- 2009-12-02 JP JP2011543410A patent/JP5291805B2/ja not_active Expired - Fee Related
- 2009-12-15 TW TW098142809A patent/TWI478803B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4660713A (en) * | 1984-01-30 | 1987-04-28 | Erweka Apparatebau Gmbh | Transpot unit for tablets |
JPH062688U (ja) * | 1992-06-10 | 1994-01-14 | 日本電気株式会社 | 半導体装置の封止用樹脂供給ユニット |
JPH0745648A (ja) * | 1993-07-29 | 1995-02-14 | Matsushita Electric Ind Co Ltd | タブレットの供給装置 |
JPH1092851A (ja) * | 1996-09-12 | 1998-04-10 | Sumitomo Heavy Ind Ltd | Ic用タブレットのシャトル収納装置 |
US20070023208A1 (en) * | 2005-07-27 | 2007-02-01 | Ok-Sun Jung | Molding resin tablet feeding apparatus having weighing unit |
Also Published As
Publication number | Publication date |
---|---|
WO2010074416A3 (ko) | 2010-08-26 |
KR101511667B1 (ko) | 2015-04-16 |
TW201024190A (en) | 2010-07-01 |
JP2012513324A (ja) | 2012-06-14 |
KR20100073552A (ko) | 2010-07-01 |
CN102264616A (zh) | 2011-11-30 |
JP5291805B2 (ja) | 2013-09-18 |
MY154102A (en) | 2015-04-30 |
WO2010074416A2 (ko) | 2010-07-01 |
CN102264616B (zh) | 2013-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |