TWI471277B - 刻劃痕線裝置 - Google Patents

刻劃痕線裝置 Download PDF

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Publication number
TWI471277B
TWI471277B TW101120881A TW101120881A TWI471277B TW I471277 B TWI471277 B TW I471277B TW 101120881 A TW101120881 A TW 101120881A TW 101120881 A TW101120881 A TW 101120881A TW I471277 B TWI471277 B TW I471277B
Authority
TW
Taiwan
Prior art keywords
scribe line
scribing
scribe
substrate
jig
Prior art date
Application number
TW101120881A
Other languages
English (en)
Chinese (zh)
Other versions
TW201305075A (zh
Inventor
Toru Naruo
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201305075A publication Critical patent/TW201305075A/zh
Application granted granted Critical
Publication of TWI471277B publication Critical patent/TWI471277B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW101120881A 2011-07-20 2012-06-11 刻劃痕線裝置 TWI471277B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011159141A JP5349550B2 (ja) 2011-07-20 2011-07-20 スクライブ装置

Publications (2)

Publication Number Publication Date
TW201305075A TW201305075A (zh) 2013-02-01
TWI471277B true TWI471277B (zh) 2015-02-01

Family

ID=47531340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101120881A TWI471277B (zh) 2011-07-20 2012-06-11 刻劃痕線裝置

Country Status (4)

Country Link
JP (1) JP5349550B2 (ko)
KR (1) KR101331006B1 (ko)
CN (1) CN102887635B (ko)
TW (1) TWI471277B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6254876B2 (ja) 2014-03-14 2017-12-27 三星ダイヤモンド工業株式会社 スクライブヘッドおよびスクライブ装置
CN107922239A (zh) * 2015-08-28 2018-04-17 康宁股份有限公司 包含刻划装置的刻划设备和刻划玻璃带的方法
JP2021079583A (ja) 2019-11-18 2021-05-27 三星ダイヤモンド工業株式会社 スクライブヘッド及びスクライブ装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139337A (ja) * 1999-11-11 2001-05-22 Toshiba Corp 加工装置、ガラススクライブ装置及びガラス切断方法
TW200938498A (en) * 2008-03-05 2009-09-16 Semes Co Ltd Scribing apparatus and method for cutting substrate using the scribing apparatus
JP2010076957A (ja) * 2008-09-24 2010-04-08 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置および基板分断システム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05229840A (ja) * 1992-02-19 1993-09-07 Bandou Kiko Kk ガラス板の加工装置
JP3227801B2 (ja) * 1992-06-30 2001-11-12 富士ゼロックス株式会社 脆性板切断方法およびその装置
CN1486285B (zh) 2001-01-17 2013-01-16 三星宝石工业株式会社 划线分断设备及其系统
JP4149750B2 (ja) * 2002-06-25 2008-09-17 中村留精密工業株式会社 ガラス板の加工装置
KR20050019815A (ko) * 2002-07-02 2005-03-03 미쓰보시 다이야몬도 고교 가부시키가이샤 접합기판의 기판절단 시스템 및 기판절단방법
JP2005213116A (ja) 2004-01-30 2005-08-11 Sony Corp スクライブ装置
WO2005113212A1 (ja) * 2004-05-20 2005-12-01 Mitsuboshi Diamond Industrial Co., Ltd. マザー基板分断方法、マザー基板スクライブ装置、プログラムおよび記録媒体
JP2009160678A (ja) 2007-12-28 2009-07-23 Sharp Corp 切断装置および表示パネルの製造方法
TWI435850B (zh) * 2008-01-23 2014-05-01 Mitsuboshi Diamond Ind Co Ltd Scribing device and scribing method
KR101696718B1 (ko) * 2009-12-15 2017-01-16 주식회사 탑 엔지니어링 스크라이빙 조립체 및 스크라이빙 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139337A (ja) * 1999-11-11 2001-05-22 Toshiba Corp 加工装置、ガラススクライブ装置及びガラス切断方法
TW200938498A (en) * 2008-03-05 2009-09-16 Semes Co Ltd Scribing apparatus and method for cutting substrate using the scribing apparatus
JP2010076957A (ja) * 2008-09-24 2010-04-08 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置および基板分断システム

Also Published As

Publication number Publication date
JP2013023404A (ja) 2013-02-04
CN102887635A (zh) 2013-01-23
KR20130011908A (ko) 2013-01-30
KR101331006B1 (ko) 2013-11-19
TW201305075A (zh) 2013-02-01
JP5349550B2 (ja) 2013-11-20
CN102887635B (zh) 2015-02-11

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MM4A Annulment or lapse of patent due to non-payment of fees