TWI471277B - 刻劃痕線裝置 - Google Patents
刻劃痕線裝置 Download PDFInfo
- Publication number
- TWI471277B TWI471277B TW101120881A TW101120881A TWI471277B TW I471277 B TWI471277 B TW I471277B TW 101120881 A TW101120881 A TW 101120881A TW 101120881 A TW101120881 A TW 101120881A TW I471277 B TWI471277 B TW I471277B
- Authority
- TW
- Taiwan
- Prior art keywords
- scribe line
- scribing
- scribe
- substrate
- jig
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 101
- 239000000463 material Substances 0.000 claims description 20
- 239000011521 glass Substances 0.000 description 11
- 238000005452 bending Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011159141A JP5349550B2 (ja) | 2011-07-20 | 2011-07-20 | スクライブ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201305075A TW201305075A (zh) | 2013-02-01 |
TWI471277B true TWI471277B (zh) | 2015-02-01 |
Family
ID=47531340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101120881A TWI471277B (zh) | 2011-07-20 | 2012-06-11 | 刻劃痕線裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5349550B2 (ko) |
KR (1) | KR101331006B1 (ko) |
CN (1) | CN102887635B (ko) |
TW (1) | TWI471277B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6254876B2 (ja) | 2014-03-14 | 2017-12-27 | 三星ダイヤモンド工業株式会社 | スクライブヘッドおよびスクライブ装置 |
CN107922239A (zh) * | 2015-08-28 | 2018-04-17 | 康宁股份有限公司 | 包含刻划装置的刻划设备和刻划玻璃带的方法 |
JP2021079583A (ja) | 2019-11-18 | 2021-05-27 | 三星ダイヤモンド工業株式会社 | スクライブヘッド及びスクライブ装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001139337A (ja) * | 1999-11-11 | 2001-05-22 | Toshiba Corp | 加工装置、ガラススクライブ装置及びガラス切断方法 |
TW200938498A (en) * | 2008-03-05 | 2009-09-16 | Semes Co Ltd | Scribing apparatus and method for cutting substrate using the scribing apparatus |
JP2010076957A (ja) * | 2008-09-24 | 2010-04-08 | Mitsuboshi Diamond Industrial Co Ltd | スクライブ装置および基板分断システム |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05229840A (ja) * | 1992-02-19 | 1993-09-07 | Bandou Kiko Kk | ガラス板の加工装置 |
JP3227801B2 (ja) * | 1992-06-30 | 2001-11-12 | 富士ゼロックス株式会社 | 脆性板切断方法およびその装置 |
CN1486285B (zh) | 2001-01-17 | 2013-01-16 | 三星宝石工业株式会社 | 划线分断设备及其系统 |
JP4149750B2 (ja) * | 2002-06-25 | 2008-09-17 | 中村留精密工業株式会社 | ガラス板の加工装置 |
KR20050019815A (ko) * | 2002-07-02 | 2005-03-03 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 접합기판의 기판절단 시스템 및 기판절단방법 |
JP2005213116A (ja) | 2004-01-30 | 2005-08-11 | Sony Corp | スクライブ装置 |
EP1747867A1 (en) * | 2004-05-20 | 2007-01-31 | Mitsuboshi Diamond Industrial Co., Ltd. | Motherboard cutting method, motherboard scribing apparatus, program and recording medium |
JP2009160678A (ja) | 2007-12-28 | 2009-07-23 | Sharp Corp | 切断装置および表示パネルの製造方法 |
TWI435850B (zh) * | 2008-01-23 | 2014-05-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing device and scribing method |
KR101696718B1 (ko) * | 2009-12-15 | 2017-01-16 | 주식회사 탑 엔지니어링 | 스크라이빙 조립체 및 스크라이빙 방법 |
-
2011
- 2011-07-20 JP JP2011159141A patent/JP5349550B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-04 KR KR1020120059632A patent/KR101331006B1/ko active IP Right Grant
- 2012-06-11 TW TW101120881A patent/TWI471277B/zh not_active IP Right Cessation
- 2012-06-18 CN CN201210206270.9A patent/CN102887635B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001139337A (ja) * | 1999-11-11 | 2001-05-22 | Toshiba Corp | 加工装置、ガラススクライブ装置及びガラス切断方法 |
TW200938498A (en) * | 2008-03-05 | 2009-09-16 | Semes Co Ltd | Scribing apparatus and method for cutting substrate using the scribing apparatus |
JP2010076957A (ja) * | 2008-09-24 | 2010-04-08 | Mitsuboshi Diamond Industrial Co Ltd | スクライブ装置および基板分断システム |
Also Published As
Publication number | Publication date |
---|---|
CN102887635B (zh) | 2015-02-11 |
KR20130011908A (ko) | 2013-01-30 |
JP5349550B2 (ja) | 2013-11-20 |
JP2013023404A (ja) | 2013-02-04 |
CN102887635A (zh) | 2013-01-23 |
TW201305075A (zh) | 2013-02-01 |
KR101331006B1 (ko) | 2013-11-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |