TWI471277B - Scribe device - Google Patents
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- TWI471277B TWI471277B TW101120881A TW101120881A TWI471277B TW I471277 B TWI471277 B TW I471277B TW 101120881 A TW101120881 A TW 101120881A TW 101120881 A TW101120881 A TW 101120881A TW I471277 B TWI471277 B TW I471277B
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- scribe line
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- 239000000758 substrate Substances 0.000 claims description 101
- 239000000463 material Substances 0.000 claims description 20
- 239000011521 glass Substances 0.000 description 11
- 238000005452 bending Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本發明是關於刻劃痕線裝置,尤其是關於一種用以在作為工件的脆性材料基板形成複數條刻劃線(scribe line)的刻劃痕線裝置。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a scoring line device, and more particularly to a scoring line device for forming a plurality of scribe lines on a substrate of a brittle material as a workpiece.
例如在分割玻璃基板的情況,是將刀輪(cutter wheel)等工具的刀鋒壓接在玻璃基板,並且使該刀鋒沿著刻劃預定線移動,藉此形成刻劃線。接下來,沿著刻劃線對玻璃基板施加預定的力量,玻璃基板就會被分割。For example, in the case of dividing a glass substrate, a blade of a tool such as a cutter wheel is pressure-bonded to the glass substrate, and the blade is moved along a line to be scored, thereby forming a score line. Next, a predetermined force is applied to the glass substrate along the score line, and the glass substrate is divided.
在進行如上所述的玻璃基板之分割時,係使用例如專利文獻1所示的刻劃痕線裝置。該專利文獻1所示的裝置是例如為用以將貼合有兩片玻璃基板的LCD基板予以分割的裝置,該裝置具備兩個劃線頭(scribe head)、以及保持搬送手段。兩個劃線頭是為了分別刻劃基板的表面及背面而上下相對向地設置。又,保持搬送手段是在兩個劃線頭之間輸送基板。For the division of the glass substrate as described above, for example, the scribe line device shown in Patent Document 1 is used. The device disclosed in Patent Document 1 is, for example, a device for dividing an LCD substrate to which two glass substrates are bonded, and the device includes two scribe heads and a holding and transporting means. The two scribing heads are provided to face each other up and down in order to respectively scribe the surface and the back surface of the substrate. Further, the transport means is to transport the substrate between the two scribing heads.
在專利文獻1所示的裝置中會有在上下的玻璃基板的相同位置形成刻劃線的情況、以及在上下的玻璃基板的不同位置形成刻劃線的情況。In the apparatus described in Patent Document 1, there are cases where a scribe line is formed at the same position of the upper and lower glass substrates, and a scribe line is formed at different positions of the upper and lower glass substrates.
在對上下的玻璃基板的相同位置形成刻劃線的情況,係以從上下夾住兩玻璃基板的方式將安裝有刀輪的劃線頭按壓至各者,並形成刻劃線。In the case where the scribe line is formed at the same position on the upper and lower glass substrates, the scribing head to which the cutter wheel is attached is pressed to each of the two glass substrates from above and below, and a scribe line is formed.
另一方面,在對上下的玻璃基板的不同位置形成刻劃 線的情況,係使一方安裝有劃線頭的架橋(bridge)移動,並藉由上下的劃線頭,在基板表面及背面的不同位置形成刻劃線。On the other hand, scribes at different positions on the upper and lower glass substrates In the case of a wire, a bridge having a scribing head attached thereto is moved, and a scribe line is formed at different positions on the surface and the back surface of the substrate by the upper and lower scribing heads.
又,專利文獻2揭示了以縮短加工時間為目的的基板分割方法。在此,在從母基板切割出複數個單位基板時,為了不使刀輪對於基板的按壓中斷,是使劃線頭一筆劃地移動來加工。Further, Patent Document 2 discloses a substrate dividing method for the purpose of shortening the processing time. Here, when a plurality of unit substrates are cut out from the mother substrate, the scribing head is moved in a stroke so as not to interrupt the pressing of the cutter wheel to the substrate.
專利文獻1:WO 02/057192 A1Patent Document 1: WO 02/057192 A1
專利文獻2:WO 2005/113212 A1Patent Document 2: WO 2005/113212 A1
在專利文獻1及2所示的習知刻劃痕線裝置中,當劃線頭的移動方向改變時,必須使刀輪平穩地遵循所改變的移動方向。因此,安裝有刀輪的夾具相對於夾具保持構件是支持成繞著與基板表面垂直的軸旋轉自如。In the conventional scribe line device shown in Patent Documents 1 and 2, when the moving direction of the scribe head is changed, it is necessary to smoothly follow the changed moving direction of the cutter wheel. Therefore, the jig to which the cutter wheel is mounted is supported to be rotatable about an axis perpendicular to the surface of the substrate with respect to the jig holding member.
另一方面,尤其在藉由刻劃線而分割的剖面會就此成為製品之剖面而露出的情況,必須避免所加工的刻劃線彎曲。為了避免刻劃線的彎曲,較佳為安裝有刀輪的夾具之旋動受到限制。On the other hand, especially in the case where the cross section divided by the scribe line is exposed as a cross section of the product, it is necessary to avoid the bending of the processed scribe line. In order to avoid bending of the score line, it is preferable that the rotation of the jig to which the cutter wheel is mounted is restricted.
本發明之課題在於提供一種可依刻劃線的種類使用適當的劃線頭來形成刻劃線的刻劃痕線裝置。An object of the present invention is to provide a scoring line device which can form a score line using an appropriate scribing head according to the type of scribing.
第1發明之刻劃痕線裝置是用以在作為工件的脆性材料基板形成複數條刻劃線的裝置,係具備:具有第1劃線頭,並且在脆性材料基板形成第1刻劃線的第1劃線單元;以及具有第2劃線頭,並且在脆性材料基板形成第2刻劃線的第2劃線單元。第1劃線頭具有:第1夾具保持構件、以及在前端可安裝切刀(cutter),並且相對於第1夾具保持構件支持成繞著與工件表面垂直的軸旋轉自如的第1夾具。第2劃線頭具有:第2夾具保持構件、以及在前端可安裝切刀,並且相對於第2夾具保持構件繞著與工件表面垂直的軸之旋轉受到限制的第2夾具。The scribe line device according to the first aspect of the invention is a device for forming a plurality of scribe lines on a brittle material substrate as a workpiece, and includes a first scribe line and a first scribe line formed on a brittle material substrate. a first scribe line unit; and a second scribe line unit having a second scribe line and forming a second scribe line on the brittle material substrate. The first scribing head has a first jig holding member and a first jig that can be attached to a cutter at the tip end and that is rotatable about an axis perpendicular to the surface of the workpiece with respect to the first jig holding member. The second scribing head has a second jig holding member and a second jig that can be attached to the tip end and that is restricted in rotation about the axis perpendicular to the surface of the workpiece with respect to the second jig holding member.
在此,在改變劃線頭的移動方向而形成刻劃線的情況,係藉由使用第1劃線單元,安裝有切刀的第1夾具可平穩地遵循第1劃線頭的動作而形成刻劃線。又,在形成直線的刻劃線的情況,藉由使用第2劃線單元,安裝有切刀的第2夾具的旋轉會受到限制,可形成彎曲受到抑制的刻劃線。Here, when the scribe line is formed by changing the moving direction of the scribe head, the first jig to which the cutter is attached can be smoothly formed following the operation of the first scribe head by using the first scribe line unit. Scribing. Further, in the case of forming a straight scribe line, by using the second scribe line, the rotation of the second jig to which the cutter is attached is restricted, and the scribe line in which the bending is suppressed can be formed.
第2發明之刻劃痕線裝置係在第1發明的裝置中,在第1劃線單元與第2劃線單元之間還具備:用來改變脆性材料基板之姿勢的姿勢變更手段。In the device according to the first aspect of the invention, the first scribe line unit and the second scribe line unit further include a posture changing means for changing the posture of the brittle material substrate.
例如,在脆性材料基板形成彼此正交之x方向及y方向的刻劃線的情況,係在利用第1劃線單元形成x方向的刻劃線之後,在姿勢變更手段中使脆性材料基板在工作台(table)面上旋轉90度。接下來在第2劃線單元中形成y方向的刻劃線。因此,可有效地進行加工。For example, in the case where the brittle material substrate forms the scribe lines in the x direction and the y direction orthogonal to each other, after the scribe line in the x direction is formed by the first scribe line unit, the brittle material substrate is placed in the posture changing means. Rotate 90 degrees on the table surface. Next, a scribe line in the y direction is formed in the second scribe line unit. Therefore, the processing can be performed efficiently.
第3發明之刻劃痕線裝置係在第1或第2發明的裝置中,第1劃線單元還具有:隔著所加工的脆性材料基板而與第1劃線頭相對向配置的第3劃線頭。而且,第3劃線頭具有:第3夾具保持構件、以及在前端可安裝切刀,並且相對於第3夾具保持構件繞著與工件表面垂直的軸之旋轉受到限制的第3夾具;並且在脆性材料基板形成第3刻劃線。In the apparatus according to the first or second aspect of the invention, the first scribing unit further includes a third surface that is disposed opposite to the first scribing head via the processed brittle material substrate. Dash head. Further, the third scribing head has a third jig holding member and a third jig that can be attached to the tip end and that is restricted in rotation about the axis perpendicular to the surface of the workpiece with respect to the third jig holding member; The brittle material substrate forms a third scribe line.
在此,在第1劃線單元中,可在基板的兩面形成刻劃線。此時,在基板的一面可平穩地形成劃線頭之移動方向改變過的刻劃線,在基板的另一面可形成彎曲受到抑制的直線的刻劃線。Here, in the first scribe line unit, scribe lines can be formed on both surfaces of the substrate. At this time, the scribe line whose direction of movement of the scribe head is changed can be smoothly formed on one surface of the substrate, and a straight scribe line whose curvature is suppressed can be formed on the other surface of the substrate.
第4發明之刻劃痕線裝置係在第1發明的裝置中,第2劃線單元還具有:隔著所加工的脆性材料基板,而與第2劃線頭相對向配置的第4劃線頭。而且,第4劃線頭具有:第4夾具保持構件、以及在前端可安裝切刀,並且相對於第4夾具保持構件繞著與工件表面垂直的軸之旋轉受到限制的第4夾具;並且在脆性材料基板形成第4刻劃線。According to a fourth aspect of the invention, in the apparatus of the first aspect of the invention, the second scribe line unit further includes: a fourth scribe line disposed opposite to the second scribe line via the processed brittle material substrate; head. Further, the fourth scribing head has a fourth jig holding member and a fourth jig that can be attached to the tip end and that is restricted in rotation about the axis perpendicular to the surface of the workpiece with respect to the fourth jig holding member; The brittle material substrate forms a fourth scribe line.
在此,可在基板的表裏形成彎曲受到抑制的直線的刻劃線,且可有效地形成品質穩定的刻劃線。Here, it is possible to form a scribe line of a straight line whose curvature is suppressed in the front and back of the substrate, and it is possible to effectively form a scribe line of stable quality.
如以上所述,本發明可依刻劃線的種類使用適當的劃線頭來形成刻劃線。As described above, the present invention can form a score line using a suitable scribing head according to the type of underline.
以下,以分割液晶顯示面板製造用之母基板時的刻劃 痕線裝置為例進行說明。Hereinafter, scribing when dividing the mother substrate for manufacturing a liquid crystal display panel The trace device is described as an example.
首先,就作為加工對象的工件進行說明。如第1圖所示,液晶顯示面板製造用的母基板MG是使形成有複數個單位顯示面板(單位基板)之圖案(pattern)P的兩個基板G1、G2(參照第2圖)相貼合而構成。具體而言,如第2圖所示,形成有複數個彩色濾光片(color filter)的第1基板(亦稱為CF側基板)G1、與形成有複數個TFT及端子區域的第2基板(亦稱為TFT基板)G2係包夾封入液晶的密封材而相貼合。在此,第2基板G2的端子區域T(在第1圖的放大圖中,以假想線顯示出端子的一部分)係為在內部的TFT與外部機器之間連接信號線的區域,因此必須在分割的最後階段露出在外部。First, the workpiece to be processed will be described. As shown in FIG. 1, the mother substrate MG for manufacturing a liquid crystal display panel is attached to two substrates G1 and G2 (see FIG. 2) in which a pattern P of a plurality of unit display panels (unit substrates) is formed. Combined to form. Specifically, as shown in FIG. 2, a first substrate (also referred to as a CF side substrate) G1 in which a plurality of color filters are formed, and a second substrate on which a plurality of TFTs and terminal regions are formed are formed. (also referred to as a TFT substrate) The G2 is sandwiched and sealed with a liquid crystal sealing material. Here, the terminal region T of the second substrate G2 (in the enlarged view of FIG. 1 , a part of the terminal is shown by a virtual line) is a region where the signal line is connected between the internal TFT and the external device, and therefore it is necessary to The final stage of the segmentation is exposed to the outside.
另一方面,有別於在兩個基板G1、G2間封入液晶的密封材,在母基板MG的外周緣部還設有外部密封件1。該外部密封件1係為為了不使在分割母基板MG時所產生的碎片飛散而用以將兩片基板G1、G2接著的密封件。On the other hand, unlike the sealing material in which the liquid crystal is sealed between the two substrates G1 and G2, the outer sealing member 1 is further provided on the outer peripheral edge portion of the mother substrate MG. The outer seal 1 is a seal for adhering the two substrates G1 and G2 so as not to scatter the debris generated when the mother substrate MG is divided.
在對此種母基板MG朝x方向刻劃痕線時,如第1圖所示,必須使形成在下面之TFT基板G2上的電極端子2露出。此外,第1圖中,實線S1是利用上方的切刀所形成的刻劃線,虛線S2是利用下方的切刀所形成的刻劃線。因此,需要一種使CF基板G1之刻劃線S1與TFT基板G2之刻劃線S2的位置稍微不同達端子大小的刻劃線。然而,即使在使刻劃線錯開的情況,在從母基板MG的端部到外部密 封件1的內端,仍必須使上下之刻劃線S1、S2對準來劃線。如第2圖(a)、(b)所示,假設,在從母基板MG的端部到外部密封件1並未使上下之刻劃線S1、S2對準的情況,外部密封件1就會殘留在兩個基板G1、G2間。如此一來,在殘留有外部密封件1的部分中,CF基板G1與TFT基板G2就會仍然相貼合而無法使端子部分露出。因此,如前所述,在從母基板MG的端部到外部密封件1的內端,必須使上下的刻劃線S1、S2對準來劃線,然後再使上下的刻劃線S1、S2錯開。此外,第2圖(b)是該圖(a)的A向視圖。When the mother substrate MG is scored in the x direction, as shown in Fig. 1, the electrode terminal 2 formed on the lower TFT substrate G2 must be exposed. In addition, in the first figure, the solid line S1 is a score line formed by the upper cutter, and the broken line S2 is a score line formed by the lower cutter. Therefore, there is a need for a score line which makes the position of the scribe line S1 of the CF substrate G1 and the scribe line S2 of the TFT substrate G2 slightly different from the terminal size. However, even in the case where the scribe lines are staggered, from the end of the mother substrate MG to the outside At the inner end of the seal 1, the upper and lower scribe lines S1, S2 must still be aligned to scribe. As shown in Fig. 2 (a) and (b), it is assumed that the outer sealing member 1 is not aligned with the upper and lower scribe lines S1, S2 from the end portion of the mother substrate MG to the outer seal member 1. It will remain between the two substrates G1 and G2. As a result, in the portion where the external seal 1 remains, the CF substrate G1 and the TFT substrate G2 are still in contact with each other, and the terminal portion cannot be exposed. Therefore, as described above, at the inner end from the end of the mother substrate MG to the outer seal 1, the upper and lower scribe lines S1, S2 must be aligned to scribe, and then the upper and lower scribe lines S1. S2 staggered. Further, Fig. 2(b) is an A-direction view of the figure (a).
又,如第3圖所示,在朝y方向劃線時的上下刻劃線S3、S4,係從刻劃線的起點開始即成為單位基板P之完成品的剖面,因此為了控制分割面的品質劣化,必須避免在刻劃線產生彎曲。Further, as shown in FIG. 3, the upper and lower scribe lines S3 and S4 when the scribe line is scribed in the y direction are the cross-sections of the finished product of the unit substrate P from the starting point of the scribe line. Therefore, in order to control the division surface, Deterioration of quality must avoid bending at the score line.
本實施形態的刻劃痕線裝置係為用以在如上的工件形成刻劃線S1至S4,並分割成複數個單位基板P的裝置,且將全體構成顯示於第4圖及第5圖。第4圖係為顯示裝置全體的概略之平面圖,第5圖係為示意性顯示裝置的一部分之前視圖。The scribe line device of the present embodiment is a device for forming the scribe lines S1 to S4 on the workpiece as described above, and dividing into a plurality of unit substrates P, and the overall configuration is shown in FIGS. 4 and 5. Fig. 4 is a schematic plan view showing the entire display device, and Fig. 5 is a front view showing a part of the schematic display device.
如第4圖所示,刻劃痕線裝置10主要具有:第1劃線單元11、兩個第2劃線單元12、以及基板姿勢變更裝置13。並且設有用以在該等裝置間搬送基板的搬送機構(未圖示)。在第1劃線單元11的搬送方向上游側設有待機工作台15。又,在基板姿勢變更裝置13的搬送方向上游側及 下游側分別設有姿勢變更用的工作台16、17。此外,在該實施形態中,雖然,在基板姿勢變更裝置13的搬送方向下游側配置有兩行加工線,但是亦可配置一行加工生產線。在一行加工生產線的情況,係設置一個第2劃線單元12。As shown in FIG. 4, the scribe line device 10 mainly includes a first scribe line unit 11, two second scribe line units 12, and a substrate posture changing device 13. Further, a transport mechanism (not shown) for transporting the substrate between the devices is provided. The standby table 15 is provided on the upstream side in the transport direction of the first scribing unit 11. Moreover, the upstream side of the conveyance direction of the substrate posture changing device 13 and The stages 16 and 17 for posture change are provided on the downstream side. Further, in this embodiment, two rows of processing lines are disposed on the downstream side in the transport direction of the substrate posture changing device 13, but one line of processing lines may be disposed. In the case of processing a production line in one line, a second scribing unit 12 is provided.
第1劃線單元11是對所搬入而來的母基板MG形成x方向的刻劃線。而且,第2劃線單元12是對執行過x方向之劃線及分割處理的基板形成y方向的刻劃線。The first scribe line unit 11 is a scribe line in the x direction with respect to the mother substrate MG that has been carried in. Further, the second scribe line unit 12 is a scribe line in the y direction for the substrate on which the scribe line and the division process in the x direction are performed.
如第5圖所示,在各劃線單元11、12設有隔著基板相對向的一對劃線頭SH(在第5圖中僅顯示出構成劃線頭的刀輪)。此外,關於劃線頭SH的詳細內容容後敘述。在本裝置中,係藉由利用上下的劃線頭SH,在上下的基板同時形成刻劃線,因此不需要執行斷開(break)步驟作為另外的步驟而可分割基板。第5圖(a)係為示意性顯示劃線處理的圖,同圖(b)係顯示分割後的基板。藉由此種裝置構成,就不需要用以在基板之表裏形成刻劃線的反轉步驟、以及形成刻劃線之後的斷開步驟。As shown in Fig. 5, each of the scribing units 11 and 12 is provided with a pair of scribing heads SH facing each other with the substrate interposed therebetween (only the scissor wheel constituting the scribing head is shown in Fig. 5). In addition, the details of the scribing head SH will be described later. In the present apparatus, by using the upper and lower scribing heads SH, the scribe lines are simultaneously formed on the upper and lower substrates, so that it is not necessary to perform a break step as a separate step to divide the substrate. Fig. 5(a) is a view schematically showing a scribing process, and Fig. 5(b) is a view showing a divided substrate. With such a device configuration, there is no need for an inversion step for forming a score line in the surface of the substrate, and a step of breaking after forming the score line.
在本裝置中,兩個劃線頭係分別設在第1及第2劃線單元11、12之各者。各劃線頭的構成是如後所述,雖然有安裝有刀輪的夾具會自由旋轉,或是夾具之旋轉受到限制的差異,但是其他構成皆相同。以下,根據第6圖至第8圖來說明劃線頭的基本構成。In the present device, two scribing heads are provided in each of the first and second scribing units 11 and 12. The configuration of each scribing head is as described later, and although the jig to which the cutter wheel is attached is free to rotate or the rotation of the jig is restricted, the other configurations are the same. Hereinafter, the basic configuration of the scribing head will be described based on Figs. 6 to 8 .
劃線頭20是為了在母基板MG形成刻劃線S1至S4所使用,可沿著設在刻劃痕線裝置10的導桿11a、12a(參照 第4圖)朝水平方向移動。劃線頭20具備:在內部配置有旋動電動機(motor)組裝體或滾珠螺桿等之機構(未圖示)的基座構件21、裝設在基座構件21之上部的推壓用電動機22、夾具保持構件23;以及具有夾具24的中心銷(king pin)組裝體25。The scribing head 20 is used to form the scribe lines S1 to S4 on the mother substrate MG, and can be guided along the guide bars 11a and 12a provided in the scribing line device 10 (refer to Figure 4) Moving in the horizontal direction. The scribing head 20 includes a base member 21 in which a mechanism (not shown) such as a motor assembly or a ball screw is disposed, and a pressing motor 22 mounted on the upper portion of the base member 21 a clamp holding member 23; and a king pin assembly 25 having a clamp 24.
如第7圖所示,夾具保持構件23係具有圓筒構件28、插入在圓筒構件28之內面的套管(collar)29、及頂蓋(head cover)30。圓筒構件28係被支持在基座構件21的下方。頂蓋30在中央部具有貫穿孔,並且固定在圓筒構件28的下端。As shown in FIG. 7, the jig holding member 23 has a cylindrical member 28, a collar 29 inserted into the inner surface of the cylindrical member 28, and a head cover 30. The cylindrical member 28 is supported below the base member 21. The top cover 30 has a through hole at a central portion and is fixed to a lower end of the cylindrical member 28.
如第7圖及第8圖所示,夾具24係設置作為中心銷組裝體25的構成構件之一。亦即,中心銷組裝體25具有夾具24、上下的軸承32、33、間隔件(spacer)34、軸承蓋35、及支持構件36。As shown in FIGS. 7 and 8, the jig 24 is provided as one of the constituent members of the center pin assembly 25. That is, the center pin assembly 25 has the jig 24, the upper and lower bearings 32, 33, the spacer 34, the bearing cap 35, and the support member 36.
夾具24具有:朝上下方向延伸的桿部24a、以及設在桿部24a之前端的切刀保持部24b。在桿部24a的上端透過螺栓41而安裝有聯接器(coupling)40。聯接器40可與設在基座構件21之內部的旋動用電動機組裝體連結,且可使夾具24在預定的角度範圍轉動。如第7圖所示,切刀保持部24b係在一方的側視中,前端部分係形成為三角形狀。又,如第8圖所示,在切刀保持部24b的前端部從下方形成有預定長度的切縫24c。在該切縫24c的下端部安 裝有刀輪42。The jig 24 has a rod portion 24a extending in the vertical direction and a cutter holding portion 24b provided at the front end of the rod portion 24a. A coupling 40 is attached to the upper end of the rod portion 24a through the bolt 41. The coupler 40 is connectable to a motor assembly for rotation provided inside the base member 21, and the clamp 24 can be rotated within a predetermined angular range. As shown in Fig. 7, the cutter holding portion 24b is formed in a side view, and the front end portion is formed in a triangular shape. Further, as shown in Fig. 8, a slit 24c having a predetermined length is formed from the lower end portion of the cutter holding portion 24b. At the lower end of the slit 24c A cutter wheel 42 is mounted.
如第7圖所示,從與劃線頭之移動方向正交的方向觀察,刀輪42的安裝中心C1與夾具24之桿部24a的中心C2係偏移(offset)達距離δ。藉由該偏移δ,當劃線頭20的移動方向改變時,夾具24就會跟著旋轉。此外,如第8圖所示,在從沿著劃線頭20之移動方向的方向觀察的情況,刀輪42的中心與夾具24之桿部24a的中心是一致的。As shown in Fig. 7, the mounting center C1 of the cutter wheel 42 is offset from the center C2 of the rod portion 24a of the jig 24 by a distance δ as viewed in a direction orthogonal to the moving direction of the scribing head. With this offset δ, when the moving direction of the scribing head 20 is changed, the jig 24 is rotated. Further, as shown in Fig. 8, the center of the cutter wheel 42 coincides with the center of the rod portion 24a of the jig 24 as viewed in the direction along the moving direction of the scribing head 20.
上下的軸承32、33是相對於夾具支持構件23旋轉自如地支持著夾具24。間隔件34是設在上下軸承32、33之間,上端是抵接於上軸承32的內環,下端是抵接於下軸承33的內環。The upper and lower bearings 32 and 33 are rotatably supported by the clamp 24 with respect to the clamp support member 23. The spacer 34 is disposed between the upper and lower bearings 32, 33, the upper end abuts against the inner ring of the upper bearing 32, and the lower end abuts against the inner ring of the lower bearing 33.
軸承蓋35係為大致圓筒狀的構件,並具有固定部35a及防塵密封(dust seal)部35b。固定部35a是在桿部24a的下端部固定成無法相對旋轉。又,在固定部35a之上下方向的大致中間部形成有朝半徑方向貫穿的轉動限制用孔35c。防塵密封部35b具有從固定部35a的下端部朝徑向外方延伸,且朝上方突出的環狀之端緣(lip)部。The bearing cap 35 is a substantially cylindrical member and has a fixing portion 35a and a dust seal portion 35b. The fixing portion 35a is fixed to the lower end portion of the rod portion 24a so as not to be relatively rotatable. Further, a rotation restricting hole 35c penetrating in the radial direction is formed in a substantially intermediate portion in the lower direction of the fixing portion 35a. The dust seal portion 35b has an annular lip portion that extends outward in the radial direction from the lower end portion of the fixing portion 35a and protrudes upward.
支持構件36係為配置在軸承蓋35之外周部的圓筒狀構件。支持構件36的外周面是被壓入在夾具保持構件23之頂蓋30的內周面。又,在支持構件36的內周面與軸承蓋35的外周面之間設有間隙。此外,在頂蓋30設有朝頂蓋30之半徑方向貫穿的插銷(pin)43。該插銷43的前端是藉由螺絲構件44推壓在形成於支持構件36之外周面的環狀溝36a。藉此,可防止支持構件36從頂蓋30落下。又, 在支持構件36的內周面與軸承蓋35的外周面之間設有間隙。The support member 36 is a cylindrical member disposed on the outer peripheral portion of the bearing cap 35. The outer peripheral surface of the support member 36 is pressed into the inner peripheral surface of the top cover 30 of the jig holding member 23. Further, a gap is provided between the inner circumferential surface of the support member 36 and the outer circumferential surface of the bearing cap 35. Further, the top cover 30 is provided with a pin 43 penetrating in the radial direction of the top cover 30. The front end of the plug 43 is pressed against the circumferential groove 36a formed on the outer peripheral surface of the support member 36 by the screw member 44. Thereby, the support member 36 can be prevented from falling from the top cover 30. also, A gap is provided between the inner circumferential surface of the support member 36 and the outer circumferential surface of the bearing cap 35.
在支持構件36之上下方向的大致中間部,在對應於軸承蓋35之孔35c的位置,形成有朝半徑方向貫穿的螺絲孔。在該螺絲孔安裝有螺絲構件45。螺絲構件45的前端是延伸至軸承蓋35的孔35c內。此外,孔35c的內徑比螺絲構件45的外徑更大,且軸承蓋35及夾具24係相對於支持構件36而可旋轉達相當於該等直徑之差異的角度。At a substantially intermediate portion in the lower direction of the support member 36, a screw hole penetrating in the radial direction is formed at a position corresponding to the hole 35c of the bearing cap 35. A screw member 45 is attached to the screw hole. The front end of the screw member 45 is extended into the hole 35c of the bearing cap 35. Further, the inner diameter of the hole 35c is larger than the outer diameter of the screw member 45, and the bearing cap 35 and the jig 24 are rotatable relative to the support member 36 by an angle corresponding to the difference in the diameters.
在支持構件36的下端面形成有環狀的溝。在該環狀溝插入有軸承蓋35的端緣部。藉由這種構成,可防止因為加工所產生的加工片進入軸承32、33。An annular groove is formed in the lower end surface of the support member 36. An end portion of the bearing cap 35 is inserted into the annular groove. With this configuration, it is possible to prevent the processed piece due to the processing from entering the bearings 32, 33.
從以上的說明可以明瞭,藉由將螺絲構件45裝設在支持構件36,並將螺絲構件45的前端插入軸承蓋35的轉動限制用孔35c,可限制軸承蓋35之相對於支持構件36的旋轉。亦即,可限制夾具24相對於夾具保持構件23之繞著與工件表面垂直之軸的旋轉。此外,如前所述,孔35c的內徑係形成為比螺絲構件45的外徑大,而在兩者之間形成有間隙,因此夾具24可相對於支持構件36旋轉達相當於該間隙大小的角度(較佳為5°以下)。以下,將以此方式裝置(set)的劃線頭稱為「固定頭」。As apparent from the above description, by attaching the screw member 45 to the support member 36 and inserting the front end of the screw member 45 into the rotation restricting hole 35c of the bearing cover 35, the bearing cover 35 with respect to the support member 36 can be restricted. Rotate. That is, the rotation of the jig 24 relative to the axis of the jig holding member 23 about the axis perpendicular to the surface of the workpiece can be restricted. Further, as described above, the inner diameter of the hole 35c is formed to be larger than the outer diameter of the screw member 45 with a gap formed therebetween, so that the jig 24 is rotatable relative to the support member 36 up to the gap size. Angle (preferably below 5°). Hereinafter, the scribe head of the set in this manner is referred to as a "fixed head".
另一方面,藉由從支持構件36卸下螺絲構件45,軸承蓋35便可相對於支持構件36自由旋轉。亦即,相對於夾具保持構件23,夾具24可繞著與工件表面垂直的軸自 由旋轉。以下,將以此方式裝置的劃線頭稱為「旋轉頭」。On the other hand, by removing the screw member 45 from the support member 36, the bearing cap 35 can freely rotate relative to the support member 36. That is, with respect to the clamp holding member 23, the clamp 24 can be rotated about an axis perpendicular to the surface of the workpiece. By rotation. Hereinafter, the scribing head of the apparatus in this manner is referred to as a "rotating head".
在此就第1圖至第3圖所示的將液晶顯示面板製造用的母基板分割時的加工動作進行說明。在該情況,係裝置固定頭作為第1劃線單元11之上方的劃線頭,並裝置旋轉頭作為下方的劃線頭。又,以第2劃線單元12之上下的劃線頭而言,皆設置固定頭。Here, the processing operation when the mother substrate for manufacturing a liquid crystal display panel is divided as shown in FIGS. 1 to 3 will be described. In this case, the device fixing head is used as a scribing head above the first scribing unit 11, and the rotating head is set as the lower scribing head. Further, a fixed head is provided for each of the scribing heads above and below the second scribing unit 12.
首先,母基板MG會由搬送機構搬入待機工作台15。所搬入的母基板MG會被搬送至設有第1劃線單元11的工作台。在此,母基板MG係朝x方向被劃線。具體而言,如第1圖所示,利用上方的固定頭形成刻劃線S1,利用下方的旋轉頭形成刻劃線S2。藉此,形成在下面之TFT基板G2上的電極端子2會露出。又,在此,因藉由上下的劃線頭同時形成刻劃線S1、S2,因此不需要特別進行斷開步驟,母基板MG會沿著x方向的刻劃線S1、S2而被分割。First, the mother substrate MG is carried into the standby table 15 by the transport mechanism. The carried-in mother substrate MG is transported to a table on which the first scribing unit 11 is provided. Here, the mother substrate MG is scribed in the x direction. Specifically, as shown in Fig. 1, the score line S1 is formed by the upper fixed head, and the score line S2 is formed by the lower rotary head. Thereby, the electrode terminal 2 formed on the lower TFT substrate G2 is exposed. Here, since the scribe lines S1 and S2 are simultaneously formed by the upper and lower scribe lines, it is not necessary to perform the breaking step in particular, and the mother substrate MG is divided along the scribe lines S1 and S2 in the x direction.
在以上的加工中,如第1圖的虛線S2所示,下方的旋轉頭雖在移動中會改變方向,但是因夾具24會相對於夾具保持構件23自由旋轉,因此夾具24會平穩地一面旋轉並一面仿照跟從刻劃線S2。又,上方的固定頭是因為夾具24相對於夾具保持構件23的旋轉受到限制,因此可抑制所形成的刻劃線1之彎曲。因此,可抑制製品之切斷品質的劣化。In the above processing, as shown by the broken line S2 in Fig. 1, the lower rotary head changes direction while moving, but since the clamp 24 is freely rotated with respect to the clamp holding member 23, the clamp 24 is smoothly rotated. And on the one hand, follow the scoring line S2. Further, since the upper fixing head is restricted by the rotation of the jig 24 with respect to the jig holding member 23, the bending of the formed score line 1 can be suppressed. Therefore, deterioration of the cutting quality of the product can be suppressed.
藉由第1劃線單元11完成x方向之分割的基板會被搬送至基板姿勢變更裝置13。基板姿勢變更裝置13是使基 板的姿勢在水平面內旋轉90度,並且搬送至設有第2劃線單元12的工作台。The substrate that has been divided in the x direction by the first scribing unit 11 is transported to the substrate posture changing device 13 . The substrate posture changing device 13 is a base The posture of the plate is rotated by 90 degrees in the horizontal plane, and is transported to a table on which the second scribing unit 12 is provided.
接下來,第2劃線單元12會執行y方向的劃線。藉此,母基板MG會被分割成各單位基板P。在此,與前述同樣地,可利用上下的劃線頭同時形成刻劃線S3、S4,而且不需要設置斷開步驟而分割成單位基板P。Next, the second scribing unit 12 performs scribing in the y direction. Thereby, the mother substrate MG is divided into the unit substrates P. Here, in the same manner as described above, the scribe lines S3 and S4 can be simultaneously formed by the upper and lower scribe lines, and the unit substrate P can be divided without providing the breaking step.
在該第2劃線單元12中,上下的刻劃線S3、S4是分別藉由上下的固定頭形成。在此,從刻劃線S3、S4的起點開始即成為單位基板P之完成品的剖面,但因為刻劃線S3、S4是藉由固定頭形成,因此可抑制在刻劃線S3、S4產生彎曲。In the second scribing unit 12, the upper and lower scribe lines S3 and S4 are formed by upper and lower fixed heads, respectively. Here, the cross section of the finished product of the unit substrate P is obtained from the starting point of the scribe lines S3 and S4. However, since the scribe lines S3 and S4 are formed by the fixed head, generation of the scribe lines S3 and S4 can be suppressed. bending.
(1)在必須改變劃線頭之移動方向的加工步驟當中,是裝置夾具可自由旋轉的旋轉頭。而在不需要改變劃線頭之移動方向,尤其是在刻劃線會就此成為製品之剖面的情況,是裝置夾具之旋轉受到限制的固定頭。因此可依刻劃線的種類使用適當的劃線頭來加工。(1) Among the processing steps in which the moving direction of the scribing head must be changed, it is a rotating head in which the device holder is freely rotatable. In the case where it is not necessary to change the moving direction of the scribing head, especially in the case where the scribing line becomes a cross section of the product, it is a fixing head in which the rotation of the device jig is restricted. Therefore, it can be processed by using an appropriate scribing head according to the type of the scribing line.
(2)藉由裝設或卸下螺絲構件,可將劃線頭替換成固定式及旋轉式,且可低成本地構成兩種劃線頭。(2) By attaching or detaching the screw member, the scribing head can be replaced with a fixed type and a rotary type, and the two types of scribing heads can be constructed at low cost.
本發明並不限定於如以上所述的實施形態,而可不脫離本發明之範圍地進行各種變形或修正。The present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the scope of the invention.
前述實施形態是將本發明是用在分割液晶顯示面板用之母基板的情況,但同樣亦可適用於要在其他脆性材料基 板形成刻劃線的情況。In the above embodiment, the present invention is applied to a mother substrate for dividing a liquid crystal display panel, but the same can be applied to other brittle materials. The plate is formed with a score line.
前述實施形態是針對在各劃線單元設有上下的劃線頭的情況加以說明,但是亦可將本發明同樣適用在僅於上或下之一方設有劃線頭的裝置。In the above embodiment, the case where the upper and lower scribing heads are provided in each scribing unit has been described. However, the present invention is also applicable to a device in which the scribing head is provided only in one of the upper and lower sides.
用來限制夾具相對於夾具保持構件之旋轉的構成並不限定於前述實施形態。前述實施形態是將螺絲構件插入貫穿孔,但亦可使用插銷取代螺絲構件。The configuration for restricting the rotation of the jig with respect to the jig holding member is not limited to the above embodiment. In the above embodiment, the screw member is inserted into the through hole, but a bolt may be used instead of the screw member.
1‧‧‧外部密封件1‧‧‧External seals
10‧‧‧刻劃痕線裝置10‧‧‧Scratch line device
11‧‧‧第1劃線單元11‧‧‧1st line unit
11a、12a‧‧‧導桿11a, 12a‧‧‧ Guide
12‧‧‧第2劃線單元12‧‧‧2nd line unit
13‧‧‧基板姿勢變更裝置13‧‧‧Substrate posture changing device
15‧‧‧待機工作台15‧‧‧Standing workbench
16、17‧‧‧工作台16, 17‧‧‧ Workbench
20、SH‧‧‧劃線頭20, SH‧‧‧ scribing head
21‧‧‧基座構件21‧‧‧Base member
22‧‧‧推壓用電動機22‧‧‧Pushing motor
23‧‧‧夾具保持構件23‧‧‧Clamp holding member
24‧‧‧夾具24‧‧‧Clamp
24a‧‧‧桿部24a‧‧‧ pole
24b‧‧‧切刀保持部24b‧‧‧Cutter Maintenance Department
24c‧‧‧切縫24c‧‧‧ slitting
25‧‧‧中心銷組裝體25‧‧‧Center pin assembly
28‧‧‧圓筒構件28‧‧‧Cylinder components
29‧‧‧套筒29‧‧‧Sleeve
30‧‧‧頂蓋30‧‧‧Top cover
32‧‧‧上軸承32‧‧‧Upper bearing
33‧‧‧下軸承33‧‧‧ Lower bearing
34‧‧‧間隔件34‧‧‧ spacers
35‧‧‧軸承蓋35‧‧‧ bearing cap
35a‧‧‧固定部35a‧‧‧Fixed Department
35b‧‧‧防塵密封部35b‧‧‧Dust seal
35c‧‧‧旋轉限制用孔35c‧‧‧Rotation restriction hole
36‧‧‧支持構件36‧‧‧Support components
40‧‧‧聯接器40‧‧‧Connector
41‧‧‧螺栓41‧‧‧ bolt
42‧‧‧刀輪42‧‧‧Cutter wheel
43‧‧‧插銷43‧‧‧Latch
45‧‧‧螺絲構件45‧‧‧screw components
G1‧‧‧第1基板G1‧‧‧1st substrate
G2‧‧‧第2基板G2‧‧‧2nd substrate
MG‧‧‧母基板MG‧‧ mother substrate
P‧‧‧單位基板P‧‧‧unit substrate
S1、S2、S3、S4‧‧‧刻劃線S1, S2, S3, S4‧‧
T‧‧‧端子區域T‧‧‧Terminal area
δ‧‧‧偏移δ‧‧‧Offset
第1圖係為顯示利用本發明之一實施形態的刻劃痕線裝置來加工的基板之一例的圖。Fig. 1 is a view showing an example of a substrate processed by a scribe line device according to an embodiment of the present invention.
第2圖係說明前述刻劃痕線裝置之刻劃線的圖。Fig. 2 is a view showing the scribe line of the scribe line device.
第3圖係為顯示利用本發明之一實施形態的刻劃痕線裝置來加工的基板之一例的圖。Fig. 3 is a view showing an example of a substrate processed by the scribe line device according to an embodiment of the present invention.
第4圖係前述刻劃痕線裝置的概略俯視圖。Fig. 4 is a schematic plan view of the scribe line device.
第5圖係前述刻劃痕線裝置的概略前視圖。Fig. 5 is a schematic front view of the above-described scoring device.
第6圖係劃線頭的外觀斜視圖。Fig. 6 is a perspective view showing the appearance of the scribing head.
第7圖係劃線頭的部分剖面圖。Figure 7 is a partial cross-sectional view of the scribing head.
第8圖係中心銷組裝體的部分剖面圖。Figure 8 is a partial cross-sectional view of the center pin assembly.
24‧‧‧夾具24‧‧‧Clamp
24a‧‧‧桿部24a‧‧‧ pole
24b‧‧‧切刀保持部24b‧‧‧Cutter Maintenance Department
24c‧‧‧切縫24c‧‧‧ slitting
25‧‧‧中心銷組裝體25‧‧‧Center pin assembly
32‧‧‧上軸承32‧‧‧Upper bearing
33‧‧‧下軸承33‧‧‧ Lower bearing
34‧‧‧間隔件34‧‧‧ spacers
35‧‧‧軸承蓋35‧‧‧ bearing cap
35a‧‧‧固定部35a‧‧‧Fixed Department
35b‧‧‧防塵密封部35b‧‧‧Dust seal
35c‧‧‧旋轉限制用孔35c‧‧‧Rotation restriction hole
36‧‧‧支持構件36‧‧‧Support components
40‧‧‧聯接器40‧‧‧Connector
41‧‧‧螺栓41‧‧‧ bolt
42‧‧‧刀輪42‧‧‧Cutter wheel
45‧‧‧螺絲構件45‧‧‧screw components
Claims (4)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011159141A JP5349550B2 (en) | 2011-07-20 | 2011-07-20 | Scribing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201305075A TW201305075A (en) | 2013-02-01 |
TWI471277B true TWI471277B (en) | 2015-02-01 |
Family
ID=47531340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101120881A TWI471277B (en) | 2011-07-20 | 2012-06-11 | Scribe device |
Country Status (4)
Country | Link |
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JP (1) | JP5349550B2 (en) |
KR (1) | KR101331006B1 (en) |
CN (1) | CN102887635B (en) |
TW (1) | TWI471277B (en) |
Families Citing this family (3)
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---|---|---|---|---|
JP6254876B2 (en) | 2014-03-14 | 2017-12-27 | 三星ダイヤモンド工業株式会社 | Scribe head and scribing device |
CN107922239A (en) * | 2015-08-28 | 2018-04-17 | 康宁股份有限公司 | The method of scoring apparatus comprising scoring device and delineation glass tape |
JP2021079583A (en) | 2019-11-18 | 2021-05-27 | 三星ダイヤモンド工業株式会社 | Scribe head and scribe device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001139337A (en) * | 1999-11-11 | 2001-05-22 | Toshiba Corp | Working device, glass scribing device and glass cutting method |
TW200938498A (en) * | 2008-03-05 | 2009-09-16 | Semes Co Ltd | Scribing apparatus and method for cutting substrate using the scribing apparatus |
JP2010076957A (en) * | 2008-09-24 | 2010-04-08 | Mitsuboshi Diamond Industrial Co Ltd | Scribing device and substrate splitting system |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05229840A (en) * | 1992-02-19 | 1993-09-07 | Bandou Kiko Kk | Device for processing glass sheet |
JP3227801B2 (en) * | 1992-06-30 | 2001-11-12 | 富士ゼロックス株式会社 | Brittle plate cutting method and apparatus |
CN1486285B (en) | 2001-01-17 | 2013-01-16 | 三星宝石工业株式会社 | Scribing and breaking apparatus, system therefor |
JP4149750B2 (en) * | 2002-06-25 | 2008-09-17 | 中村留精密工業株式会社 | Glass plate processing equipment |
KR20050019815A (en) * | 2002-07-02 | 2005-03-03 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Pasted base board cutting system and base board cutting method |
JP2005213116A (en) | 2004-01-30 | 2005-08-11 | Sony Corp | Scribing device |
WO2005113212A1 (en) * | 2004-05-20 | 2005-12-01 | Mitsuboshi Diamond Industrial Co., Ltd. | Motherboard cutting method, motherboard scribing apparatus, program and recording medium |
JP2009160678A (en) | 2007-12-28 | 2009-07-23 | Sharp Corp | Cutter and manufacturing method of display panel |
TWI435850B (en) * | 2008-01-23 | 2014-05-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing device and scribing method |
KR101696718B1 (en) * | 2009-12-15 | 2017-01-16 | 주식회사 탑 엔지니어링 | Scribing assembly and scribing method |
-
2011
- 2011-07-20 JP JP2011159141A patent/JP5349550B2/en not_active Expired - Fee Related
-
2012
- 2012-06-04 KR KR1020120059632A patent/KR101331006B1/en active IP Right Grant
- 2012-06-11 TW TW101120881A patent/TWI471277B/en not_active IP Right Cessation
- 2012-06-18 CN CN201210206270.9A patent/CN102887635B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001139337A (en) * | 1999-11-11 | 2001-05-22 | Toshiba Corp | Working device, glass scribing device and glass cutting method |
TW200938498A (en) * | 2008-03-05 | 2009-09-16 | Semes Co Ltd | Scribing apparatus and method for cutting substrate using the scribing apparatus |
JP2010076957A (en) * | 2008-09-24 | 2010-04-08 | Mitsuboshi Diamond Industrial Co Ltd | Scribing device and substrate splitting system |
Also Published As
Publication number | Publication date |
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KR101331006B1 (en) | 2013-11-19 |
CN102887635B (en) | 2015-02-11 |
KR20130011908A (en) | 2013-01-30 |
CN102887635A (en) | 2013-01-23 |
TW201305075A (en) | 2013-02-01 |
JP2013023404A (en) | 2013-02-04 |
JP5349550B2 (en) | 2013-11-20 |
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