TWI471074B - 用於形成具有透光部分之面板之方法及其相關產品 - Google Patents
用於形成具有透光部分之面板之方法及其相關產品 Download PDFInfo
- Publication number
- TWI471074B TWI471074B TW96119145A TW96119145A TWI471074B TW I471074 B TWI471074 B TW I471074B TW 96119145 A TW96119145 A TW 96119145A TW 96119145 A TW96119145 A TW 96119145A TW I471074 B TWI471074 B TW I471074B
- Authority
- TW
- Taiwan
- Prior art keywords
- panel
- holes
- light transmissive
- light
- filling
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 39
- 239000000463 material Substances 0.000 claims description 65
- 239000000945 filler Substances 0.000 claims description 47
- 238000005553 drilling Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 238000005286 illumination Methods 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 6
- 238000000879 optical micrograph Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000109 continuous material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V11/00—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00
- F21V11/08—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures
- F21V11/14—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures with many small apertures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/06—Signs, boards or panels, illuminated from behind the insignia using individual cut-out symbols or cut-out silhouettes, e.g. perforated signs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/04—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81038006P | 2006-06-02 | 2006-06-02 | |
| US11/742,862 US8394301B2 (en) | 2006-06-02 | 2007-05-01 | Process for forming panel with an optically transmissive portion and products related thereto |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200806150A TW200806150A (en) | 2008-01-16 |
| TWI471074B true TWI471074B (zh) | 2015-01-21 |
Family
ID=38801988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96119145A TWI471074B (zh) | 2006-06-02 | 2007-05-29 | 用於形成具有透光部分之面板之方法及其相關產品 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9568167B2 (enExample) |
| EP (1) | EP2024767A4 (enExample) |
| JP (1) | JP5124568B2 (enExample) |
| KR (1) | KR101435224B1 (enExample) |
| SG (1) | SG172615A1 (enExample) |
| TW (1) | TWI471074B (enExample) |
| WO (1) | WO2007142909A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7943862B2 (en) * | 2008-08-20 | 2011-05-17 | Electro Scientific Industries, Inc. | Method and apparatus for optically transparent via filling |
| US8524127B2 (en) | 2010-03-26 | 2013-09-03 | Electro Scientific Industries, Inc. | Method of manufacturing a panel with occluded microholes |
| US8642908B2 (en) | 2010-10-13 | 2014-02-04 | Sony Corporation | Electronic device having a hidden input key and method of manufacturing an electronic device |
| US9829614B2 (en) | 2015-02-02 | 2017-11-28 | Synaptics Incorporated | Optical sensor using collimator |
| US20190271445A1 (en) * | 2018-03-01 | 2019-09-05 | Dell Products L.P. | System and method for producing indicator light assembly with plastic housing |
| WO2020081593A1 (en) | 2018-10-19 | 2020-04-23 | Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd. | Vehicle interior component |
| US10821889B2 (en) | 2018-10-19 | 2020-11-03 | Shanghai Yanfeng Inqiao Automotive Trim Systems Co. Ltd. | Vehicle interior component |
| WO2020131141A1 (en) | 2018-12-21 | 2020-06-25 | Google Llc | Interactive object having light-transmissive pattern with controlled hole-shape |
| TWI842637B (zh) * | 2023-06-19 | 2024-05-11 | 台灣愛司帝科技股份有限公司 | 隱藏式顯示裝置及其製作方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07271309A (ja) * | 1994-04-01 | 1995-10-20 | Giichi Ishihara | 表示板 |
| US6211485B1 (en) * | 1996-06-05 | 2001-04-03 | Larry W. Burgess | Blind via laser drilling system |
| WO2004077388A1 (en) * | 2003-02-27 | 2004-09-10 | Bang & Olufsen A/S | Magic panel |
| TW200624238A (en) * | 2004-11-22 | 2006-07-16 | Sumitomo Electric Industries | The professing method for resin-made film with micro through hole in resin film and a device and the micro structure with the same |
| TWI277830B (en) * | 1999-01-28 | 2007-04-01 | Sumitomo Chemical Co | Resist composition |
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| US3440368A (en) * | 1966-02-10 | 1969-04-22 | Robertshaw Controls Co | Programmer means and parts therefor |
| US3440388A (en) | 1966-04-04 | 1969-04-22 | Monsanto Co | Method for machining with laser beam |
| US4155972A (en) | 1977-09-06 | 1979-05-22 | Keystone Consolidated Industries, Inc. | Multiple-shot method of molding plastic products |
| FR2547519B1 (fr) | 1983-06-15 | 1987-07-03 | Snecma | Procede et dispositif de percage par laser |
| US4791746A (en) | 1983-12-23 | 1988-12-20 | P.T.L. Equipment Co., Inc. | Vandal resistant display units |
| JPH0646025Y2 (ja) * | 1988-12-28 | 1994-11-24 | 宮本警報器株式会社 | 自動車スイッチのイルミネーション |
| US5744776A (en) | 1989-07-14 | 1998-04-28 | Tip Engineering Group, Inc. | Apparatus and for laser preweakening an automotive trim cover for an air bag deployment opening |
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| JPH11168281A (ja) | 1997-12-02 | 1999-06-22 | Hitachi Aic Inc | 薄物多層印刷配線板の製造方法 |
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| US8394301B2 (en) | 2006-06-02 | 2013-03-12 | Electro Scientific Industries, Inc. | Process for forming panel with an optically transmissive portion and products related thereto |
| US7968820B2 (en) | 2006-06-02 | 2011-06-28 | Electro Scientific Industries, Inc. | Method of producing a panel having an area with light transmissivity |
| US20100012506A1 (en) | 2006-07-13 | 2010-01-21 | Jan Phuklin Prichystal | Combined electrochemical and laser micromaching process for creating ultri-thin surfaces |
| US8237080B2 (en) | 2008-03-27 | 2012-08-07 | Electro Scientific Industries, Inc | Method and apparatus for laser drilling holes with Gaussian pulses |
| US7943862B2 (en) | 2008-08-20 | 2011-05-17 | Electro Scientific Industries, Inc. | Method and apparatus for optically transparent via filling |
-
2007
- 2007-05-24 WO PCT/US2007/012600 patent/WO2007142909A2/en not_active Ceased
- 2007-05-24 EP EP07795410A patent/EP2024767A4/en not_active Withdrawn
- 2007-05-24 JP JP2009513225A patent/JP5124568B2/ja not_active Expired - Fee Related
- 2007-05-24 KR KR1020087032264A patent/KR101435224B1/ko not_active Expired - Fee Related
- 2007-05-24 SG SG2011036860A patent/SG172615A1/en unknown
- 2007-05-29 TW TW96119145A patent/TWI471074B/zh not_active IP Right Cessation
-
2013
- 2013-03-12 US US13/797,891 patent/US9568167B2/en not_active Expired - Fee Related
-
2017
- 2017-01-04 US US15/398,171 patent/US20170114982A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07271309A (ja) * | 1994-04-01 | 1995-10-20 | Giichi Ishihara | 表示板 |
| US6211485B1 (en) * | 1996-06-05 | 2001-04-03 | Larry W. Burgess | Blind via laser drilling system |
| TWI277830B (en) * | 1999-01-28 | 2007-04-01 | Sumitomo Chemical Co | Resist composition |
| WO2004077388A1 (en) * | 2003-02-27 | 2004-09-10 | Bang & Olufsen A/S | Magic panel |
| TW200624238A (en) * | 2004-11-22 | 2006-07-16 | Sumitomo Electric Industries | The professing method for resin-made film with micro through hole in resin film and a device and the micro structure with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009539226A (ja) | 2009-11-12 |
| KR101435224B1 (ko) | 2014-08-28 |
| JP5124568B2 (ja) | 2013-01-23 |
| US9568167B2 (en) | 2017-02-14 |
| KR20090021299A (ko) | 2009-03-02 |
| TW200806150A (en) | 2008-01-16 |
| WO2007142909A3 (en) | 2008-10-23 |
| EP2024767A4 (en) | 2010-08-04 |
| SG172615A1 (en) | 2011-07-28 |
| WO2007142909A2 (en) | 2007-12-13 |
| US20170114982A1 (en) | 2017-04-27 |
| US20130223044A1 (en) | 2013-08-29 |
| EP2024767A2 (en) | 2009-02-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
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