TWI471074B - 用於形成具有透光部分之面板之方法及其相關產品 - Google Patents

用於形成具有透光部分之面板之方法及其相關產品 Download PDF

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Publication number
TWI471074B
TWI471074B TW96119145A TW96119145A TWI471074B TW I471074 B TWI471074 B TW I471074B TW 96119145 A TW96119145 A TW 96119145A TW 96119145 A TW96119145 A TW 96119145A TW I471074 B TWI471074 B TW I471074B
Authority
TW
Taiwan
Prior art keywords
panel
holes
light transmissive
light
filling
Prior art date
Application number
TW96119145A
Other languages
English (en)
Chinese (zh)
Other versions
TW200806150A (en
Inventor
Michael S Nashner
Jeffrey E Howerton
Weixiong Lu
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38801988&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI471074(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US11/742,862 external-priority patent/US8394301B2/en
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW200806150A publication Critical patent/TW200806150A/zh
Application granted granted Critical
Publication of TWI471074B publication Critical patent/TWI471074B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00Cleaning hollow articles by methods or apparatus specially adapted thereto
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V11/00Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00
    • F21V11/08Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures
    • F21V11/14Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures with many small apertures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/384Removing material by boring or cutting by boring of specially shaped holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/04Signs, boards or panels, illuminated from behind the insignia
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/04Signs, boards or panels, illuminated from behind the insignia
    • G09F13/06Signs, boards or panels, illuminated from behind the insignia using individual cut-out symbols or cut-out silhouettes, e.g. perforated signs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/04Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
TW96119145A 2006-06-02 2007-05-29 用於形成具有透光部分之面板之方法及其相關產品 TWI471074B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81038006P 2006-06-02 2006-06-02
US11/742,862 US8394301B2 (en) 2006-06-02 2007-05-01 Process for forming panel with an optically transmissive portion and products related thereto

Publications (2)

Publication Number Publication Date
TW200806150A TW200806150A (en) 2008-01-16
TWI471074B true TWI471074B (zh) 2015-01-21

Family

ID=38801988

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96119145A TWI471074B (zh) 2006-06-02 2007-05-29 用於形成具有透光部分之面板之方法及其相關產品

Country Status (7)

Country Link
US (2) US9568167B2 (enExample)
EP (1) EP2024767A4 (enExample)
JP (1) JP5124568B2 (enExample)
KR (1) KR101435224B1 (enExample)
SG (1) SG172615A1 (enExample)
TW (1) TWI471074B (enExample)
WO (1) WO2007142909A2 (enExample)

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US7943862B2 (en) * 2008-08-20 2011-05-17 Electro Scientific Industries, Inc. Method and apparatus for optically transparent via filling
US8524127B2 (en) 2010-03-26 2013-09-03 Electro Scientific Industries, Inc. Method of manufacturing a panel with occluded microholes
US8642908B2 (en) 2010-10-13 2014-02-04 Sony Corporation Electronic device having a hidden input key and method of manufacturing an electronic device
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20190271445A1 (en) * 2018-03-01 2019-09-05 Dell Products L.P. System and method for producing indicator light assembly with plastic housing
WO2020081593A1 (en) 2018-10-19 2020-04-23 Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd. Vehicle interior component
US10821889B2 (en) 2018-10-19 2020-11-03 Shanghai Yanfeng Inqiao Automotive Trim Systems Co. Ltd. Vehicle interior component
WO2020131141A1 (en) 2018-12-21 2020-06-25 Google Llc Interactive object having light-transmissive pattern with controlled hole-shape
TWI842637B (zh) * 2023-06-19 2024-05-11 台灣愛司帝科技股份有限公司 隱藏式顯示裝置及其製作方法

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US6211485B1 (en) * 1996-06-05 2001-04-03 Larry W. Burgess Blind via laser drilling system
WO2004077388A1 (en) * 2003-02-27 2004-09-10 Bang & Olufsen A/S Magic panel
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TWI277830B (en) * 1999-01-28 2007-04-01 Sumitomo Chemical Co Resist composition
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TW200624238A (en) * 2004-11-22 2006-07-16 Sumitomo Electric Industries The professing method for resin-made film with micro through hole in resin film and a device and the micro structure with the same

Also Published As

Publication number Publication date
JP2009539226A (ja) 2009-11-12
KR101435224B1 (ko) 2014-08-28
JP5124568B2 (ja) 2013-01-23
US9568167B2 (en) 2017-02-14
KR20090021299A (ko) 2009-03-02
TW200806150A (en) 2008-01-16
WO2007142909A3 (en) 2008-10-23
EP2024767A4 (en) 2010-08-04
SG172615A1 (en) 2011-07-28
WO2007142909A2 (en) 2007-12-13
US20170114982A1 (en) 2017-04-27
US20130223044A1 (en) 2013-08-29
EP2024767A2 (en) 2009-02-18

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