JP5124568B2 - 光透過性部分を有するパネルの製造方法及びその方法を用いて製造されたパネル - Google Patents

光透過性部分を有するパネルの製造方法及びその方法を用いて製造されたパネル Download PDF

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Publication number
JP5124568B2
JP5124568B2 JP2009513225A JP2009513225A JP5124568B2 JP 5124568 B2 JP5124568 B2 JP 5124568B2 JP 2009513225 A JP2009513225 A JP 2009513225A JP 2009513225 A JP2009513225 A JP 2009513225A JP 5124568 B2 JP5124568 B2 JP 5124568B2
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Japan
Prior art keywords
panel
holes
light transmissive
diameter
light
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2009513225A
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English (en)
Japanese (ja)
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JP2009539226A (ja
JP2009539226A5 (enExample
Inventor
ナッシュナー,マイケル,エス.
ハウワートン,ジェフリィ
リュー,ウェイション
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Priority claimed from US11/742,862 external-priority patent/US8394301B2/en
Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2009539226A publication Critical patent/JP2009539226A/ja
Publication of JP2009539226A5 publication Critical patent/JP2009539226A5/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00Cleaning hollow articles by methods or apparatus specially adapted thereto
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V11/00Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00
    • F21V11/08Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures
    • F21V11/14Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures with many small apertures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/384Removing material by boring or cutting by boring of specially shaped holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/04Signs, boards or panels, illuminated from behind the insignia
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/04Signs, boards or panels, illuminated from behind the insignia
    • G09F13/06Signs, boards or panels, illuminated from behind the insignia using individual cut-out symbols or cut-out silhouettes, e.g. perforated signs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/04Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP2009513225A 2006-06-02 2007-05-24 光透過性部分を有するパネルの製造方法及びその方法を用いて製造されたパネル Expired - Fee Related JP5124568B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US81038006P 2006-06-02 2006-06-02
US60/810,380 2006-06-02
US11/742,862 US8394301B2 (en) 2006-06-02 2007-05-01 Process for forming panel with an optically transmissive portion and products related thereto
US11/742,862 2007-05-01
PCT/US2007/012600 WO2007142909A2 (en) 2006-06-02 2007-05-24 Process for optically transparent via filling

Publications (3)

Publication Number Publication Date
JP2009539226A JP2009539226A (ja) 2009-11-12
JP2009539226A5 JP2009539226A5 (enExample) 2010-07-08
JP5124568B2 true JP5124568B2 (ja) 2013-01-23

Family

ID=38801988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009513225A Expired - Fee Related JP5124568B2 (ja) 2006-06-02 2007-05-24 光透過性部分を有するパネルの製造方法及びその方法を用いて製造されたパネル

Country Status (7)

Country Link
US (2) US9568167B2 (enExample)
EP (1) EP2024767A4 (enExample)
JP (1) JP5124568B2 (enExample)
KR (1) KR101435224B1 (enExample)
SG (1) SG172615A1 (enExample)
TW (1) TWI471074B (enExample)
WO (1) WO2007142909A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7943862B2 (en) * 2008-08-20 2011-05-17 Electro Scientific Industries, Inc. Method and apparatus for optically transparent via filling
US8524127B2 (en) 2010-03-26 2013-09-03 Electro Scientific Industries, Inc. Method of manufacturing a panel with occluded microholes
US8642908B2 (en) 2010-10-13 2014-02-04 Sony Corporation Electronic device having a hidden input key and method of manufacturing an electronic device
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20190271445A1 (en) * 2018-03-01 2019-09-05 Dell Products L.P. System and method for producing indicator light assembly with plastic housing
WO2020081593A1 (en) 2018-10-19 2020-04-23 Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd. Vehicle interior component
US10821889B2 (en) 2018-10-19 2020-11-03 Shanghai Yanfeng Inqiao Automotive Trim Systems Co. Ltd. Vehicle interior component
WO2020131141A1 (en) 2018-12-21 2020-06-25 Google Llc Interactive object having light-transmissive pattern with controlled hole-shape
TWI842637B (zh) * 2023-06-19 2024-05-11 台灣愛司帝科技股份有限公司 隱藏式顯示裝置及其製作方法

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440368A (en) * 1966-02-10 1969-04-22 Robertshaw Controls Co Programmer means and parts therefor
US3440388A (en) 1966-04-04 1969-04-22 Monsanto Co Method for machining with laser beam
US4155972A (en) 1977-09-06 1979-05-22 Keystone Consolidated Industries, Inc. Multiple-shot method of molding plastic products
FR2547519B1 (fr) 1983-06-15 1987-07-03 Snecma Procede et dispositif de percage par laser
US4791746A (en) 1983-12-23 1988-12-20 P.T.L. Equipment Co., Inc. Vandal resistant display units
JPH0646025Y2 (ja) * 1988-12-28 1994-11-24 宮本警報器株式会社 自動車スイッチのイルミネーション
US5744776A (en) 1989-07-14 1998-04-28 Tip Engineering Group, Inc. Apparatus and for laser preweakening an automotive trim cover for an air bag deployment opening
JPH0716778A (ja) 1993-07-06 1995-01-20 Brother Ind Ltd レーザ加工方法
JPH07201260A (ja) * 1993-12-29 1995-08-04 Yamatake Honeywell Co Ltd 電子スイッチの表示窓形成方法
JPH07271309A (ja) * 1994-04-01 1995-10-20 Giichi Ishihara 表示板
DE4421942C2 (de) 1994-06-23 1996-07-11 Porsche Ag Beleuchtbares Feld
JPH08298043A (ja) * 1995-04-27 1996-11-12 Oki Electric Ind Co Ltd 透光部付き押しボタン及びその製造方法
US5632914A (en) 1995-05-24 1997-05-27 Davidson Textron Inc. Motor vehicle air bag cover having a skin with a virtually invisible tear seam formed by miniature holes
US5790151A (en) 1996-03-27 1998-08-04 Imaging Technology International Corp. Ink jet printhead and method of making
WO1997046349A1 (en) * 1996-06-05 1997-12-11 Burgess Larry W Blind via laser drilling system
US5718326A (en) 1996-07-22 1998-02-17 Delco Electronics Corporation Backlit button/switchpad assembly
NL1004433C2 (nl) * 1996-11-05 1998-05-08 Iai Bv Beveiligingskenmerk in de vorm van een perforatiepatroon.
DE19717636A1 (de) 1997-04-25 1998-11-12 Trw Fahrzeugelektrik Verfahren zur Herstellung eines Blendenteils, Betätigungsteils oder dergleichen Teile mit Funktionssymbolen für die Beleuchtung mit Durchlicht
JPH11168281A (ja) 1997-12-02 1999-06-22 Hitachi Aic Inc 薄物多層印刷配線板の製造方法
US6114240A (en) 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
TWI277830B (en) * 1999-01-28 2007-04-01 Sumitomo Chemical Co Resist composition
JP3438066B2 (ja) * 1999-02-15 2003-08-18 独立行政法人 国立印刷局 可変穿孔による偽造防止形成体
AU2001270833A1 (en) 2000-07-18 2002-01-30 Optaglio Limited Diffractive device
US6652128B2 (en) 2001-01-31 2003-11-25 Textron Automotive Company, Inc. Backlighting method for an automotive trim panel
DE20103133U1 (de) 2001-02-22 2001-06-13 Glass, Hagen, 80798 München Hinweisvorrichtung
ATE323569T1 (de) 2001-03-22 2006-05-15 Xsil Technology Ltd Ein laserbearbeitungssystem und -verfahren
DE10123633A1 (de) 2001-05-09 2003-02-06 Ego Elektro Geraetebau Gmbh Sensorelement
DK200101287A (da) * 2001-08-31 2003-03-01 Bang & Olufsen As Udlæsningsenhed og fremgangsmåde til dens fremstilling
JP4048794B2 (ja) 2002-02-25 2008-02-20 カシオ計算機株式会社 電子機器
TWI256719B (en) 2002-03-06 2006-06-11 Via Tech Inc Semiconductor device package module and manufacturing method thereof
JP4389484B2 (ja) 2002-07-15 2009-12-24 株式会社村田製作所 セラミック多層回路基板及びその製造方法
WO2004077387A1 (en) 2003-02-27 2004-09-10 Bang & Olufsen A/S Metal structure with translucent region
JP4247383B2 (ja) * 2003-08-28 2009-04-02 独立行政法人産業技術総合研究所 透明材料の微細アブレーション加工方法
JP2005074639A (ja) * 2003-08-28 2005-03-24 Shigeyuki Sakata 多色発光装飾体
JP2005079385A (ja) 2003-09-01 2005-03-24 Toshiba Corp 光半導体装置および光信号入出力装置
GB2406068B (en) 2003-09-20 2006-04-12 Rolls Royce Plc Laser drilling
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US7057133B2 (en) 2004-04-14 2006-06-06 Electro Scientific Industries, Inc. Methods of drilling through-holes in homogenous and non-homogenous substrates
JP4344297B2 (ja) 2004-08-25 2009-10-14 豊田合成株式会社 加飾装置及びその製造方法
KR101275478B1 (ko) * 2004-11-22 2013-06-14 스미토모덴키고교가부시키가이샤 가공방법, 가공장치 및 그 방법에 의해 제조된 미세구조체
US7485956B2 (en) 2005-08-16 2009-02-03 Tessera, Inc. Microelectronic package optionally having differing cover and device thermal expansivities
US7884315B2 (en) 2006-07-11 2011-02-08 Apple Inc. Invisible, light-transmissive display system
US20070138644A1 (en) 2005-12-15 2007-06-21 Tessera, Inc. Structure and method of making capped chip having discrete article assembled into vertical interconnect
US8394301B2 (en) 2006-06-02 2013-03-12 Electro Scientific Industries, Inc. Process for forming panel with an optically transmissive portion and products related thereto
US7968820B2 (en) 2006-06-02 2011-06-28 Electro Scientific Industries, Inc. Method of producing a panel having an area with light transmissivity
US20100012506A1 (en) 2006-07-13 2010-01-21 Jan Phuklin Prichystal Combined electrochemical and laser micromaching process for creating ultri-thin surfaces
US8237080B2 (en) 2008-03-27 2012-08-07 Electro Scientific Industries, Inc Method and apparatus for laser drilling holes with Gaussian pulses
US7943862B2 (en) 2008-08-20 2011-05-17 Electro Scientific Industries, Inc. Method and apparatus for optically transparent via filling

Also Published As

Publication number Publication date
TWI471074B (zh) 2015-01-21
JP2009539226A (ja) 2009-11-12
KR101435224B1 (ko) 2014-08-28
US9568167B2 (en) 2017-02-14
KR20090021299A (ko) 2009-03-02
TW200806150A (en) 2008-01-16
WO2007142909A3 (en) 2008-10-23
EP2024767A4 (en) 2010-08-04
SG172615A1 (en) 2011-07-28
WO2007142909A2 (en) 2007-12-13
US20170114982A1 (en) 2017-04-27
US20130223044A1 (en) 2013-08-29
EP2024767A2 (en) 2009-02-18

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