CN105323986B - 多层配线板和用于多层配线板的制造方法 - Google Patents

多层配线板和用于多层配线板的制造方法 Download PDF

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CN105323986B
CN105323986B CN201510266350.7A CN201510266350A CN105323986B CN 105323986 B CN105323986 B CN 105323986B CN 201510266350 A CN201510266350 A CN 201510266350A CN 105323986 B CN105323986 B CN 105323986B
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thermoplastic resin
slot
board
resin board
layer
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CN105323986A (zh
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小川贵志
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Denso Corp
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Toyota Motor Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311—Thermal properties
    • B29C66/73115—Melting point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
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Abstract

本公开涉及多层配线板和用于多层配线板的制造方法。根据本公开的用于多层配线板的制造方法包括：在第一热塑性树脂板(10)的表面上形成槽(11)；通过将光施加到第一热塑性树脂板的表面的、除了围绕槽的区域之外的区域，来形成由熔点低于构成第一热塑性树脂板的树脂的熔点的树脂制成的改性层(12b)；利用具有流动性的导电材料填充第一热塑性树脂板的槽；以及通过热压接合来将第二热塑性树脂板(20)接合到第一热塑性树脂板的上面形成有改性层的表面。

Description

多层配线板和用于多层配线板的制造方法
技术领域
本发明涉及多层配线板和用于多层配线板的制造方法。
背景技术
在常用的多层配线板中，通过对接合到树脂板的铜箔施加刻蚀来形成迹线图案。然而，这样的多层配线板不适于在高电流条件下使用，因为多层配线板中使用的铜箔的厚度是有限的。
日本专利申请公布第2013-211349号(JP 2013-211349 A)描述了一种多层配线板，其中通过在树脂板上形成槽并且用导电膏填充槽来形成迹线图案。在该多层配线板中，可以通过增加每个槽的深度来形成较厚的配线层。因而，JP 2013-211349 A中描述的多层配线板较之前述常用的多层配线板更适于在高电流条件下使用。需要将比施加到常用的家用电器的电流高的电流施加到车载多层配线板。因此，需要具有较厚的配线层的车载多层配线板。
根据JP 2013-211349 A中描述的技术，将在槽中形成迹线的多个热塑性树脂板加热到等于或高于其软化温度的温度，并且因而这些热塑性树脂板在压力下接合在一起。换言之，在热压接合期间，热塑性树脂板被整体软化。这导致了槽会变形并且因而迹线未能获得期望的电特性的可能性。
发明内容
本发明提供了多层配线板和用于多层配线板的制造方法。
根据本发明的第一方面的一种用于多层配线板的制造方法包括：在第一热塑性树脂板的表面上形成槽；通过将光施加到第一热塑性树脂板的表面的、除了围绕槽的区域之外的区域，来形成由熔点低于构成第一热塑性树脂板的树脂的熔点的树脂制成的改性层；利用具有流动性的导电材料填充第一热塑性树脂板的槽；以及通过热压接合来将第二热塑性树脂板接合到第一热塑性树脂板的上面形成有改性层的表面。
在根据本发明的第一方面的制造方法中，在第一热塑性树脂板的表面上形成由熔点低于构成第一热塑性树脂板的树脂的熔点的树脂制成的改性层。然而，在第一热塑性树脂板的围绕槽的区域中没有形成改性层。因而，当通过热压接合将第二热塑性树脂板接合到第一热塑性树脂板的表面时，抑制了槽的变形。
在本发明的第一方面中，在热压接合中，第二热塑性树脂板可以被加热到高于构成改性层的树脂的熔点并且低于构成第一热塑性树脂板的树脂的熔点的温度。
在本发明的第一方面中，可以通过重复地施加具有250nm或更小的波长并且在每次施加光时具有1W或更小的功率的紫外激光来形成槽。这样，使槽的表面是亲水的。
此外，可以通过施加用作光的紫外激光来形成改性层。这样，槽和改性层可以同时形成。此外，可以通过仅施加一次用作光的紫外激光来形成改性层。
根据本发明的第二方面的一种多层配线板包括第一热塑性树脂板、第二热塑性树脂板和改性层。第一热塑性树脂板在其表面上形成有槽。在槽中形成迹线。第二热塑性树脂板层叠在第一热塑性树脂板的表面上。改性层形成在第一热塑性树脂板和第二热塑性树脂板之间的界面的、除了围绕槽的区域以外的区域上。改性层由熔点低于构成第一热塑性树脂板的树脂的熔点的树脂制成。
在根据本发明的第二方面的多层配线板中，在第一热塑性树脂板的围绕槽的区域中没有形成改性层。因而，当通过热压接合将第二热塑性树脂板接合到第一热塑性树脂板的表面时，抑制了槽的变形。
如上文所述，本发明的第一方面提供了减少由于热压接合引起的槽变形的出现的制造方法。本发明的第二方面提供了减少由于热压接合引起的槽变形的多层配线板。
附图说明
下文将参照附图描述本发明的示例性实施例的特征、优点以及技术和工业意义，在附图中相同的附图标记表示相同的元件，并且在附图中：
图1是图示根据本发明的第一实施例的用于多层配线板的制造方法的截面图；
图2是图示根据本发明的第一实施例的制造方法的截面图；
图3是图示根据本发明的第一实施例的第一板的迹线槽填充有导电墨水的状态的显微相片；
图4是图示根据比较例的第一板的迹线槽填充有导电墨水的状态的显微相片；
图5是图示根据本发明的第一实施例的制造方法的截面图；
图6是与图5对应的平面图；
图7是图示根据本发明的第一实施例的制造方法的截面图；
图8是图示根据本发明的第一实施例的制造方法的截面图；
图9是图示根据本发明的第一实施例的制造方法的截面图；
图10是图8中所示的制造方法的修改示例；以及
图11是第一板的修改示例。
具体实施方式
以下将参照附图详细描述本发明的示例实施例。然而，本发明不限于以下实施例。以下描述和附图将被适当简化以便提供清楚的说明。
参照图1至图9，将描述根据本发明的第一实施例的用于多层配线板的制造方法。图1、图2、图5和图7至图9是图示根据第一实施例的制造方法的截面图。图3是图示根据本发明的第一实施例的第一板的迹线槽填充有导电墨水的状态的显微相片。图4是图示根据比较例的第一板的迹线槽填充有导电墨水的状态的显微相片。图6是与图5对应的平面图。
首先，如图1中所示，制备由诸如液晶聚合物树脂、聚酰亚胺树脂、聚酰胺-酰亚胺树脂或聚醚醚酮树脂的热塑性树脂制成的平坦的第一板10。第一板10的厚度是例如约30μm至300μm。
接下来，使第一板10的第一表面重复地经历扫描，同时将激光施加到第一表面，从而如图2所示形成迹线槽11。在图2中所示的示例中，形成三个迹线槽11。每个迹线槽11的深度是例如约20μm至200μm。作为激光，优选地使用具有250nm或更小的波长的低功率紫外激光。具体地，优选地使用每次扫描具有1W或更小的功率的受激准分子激光器。在这些条件下，第一板10的第一表面每次被切割例如约0.3μm。因而，为了形成具有30μm深度的每个迹线槽11，第一板10的第一表面经历约100次扫描。
通过使用具有250nm或更小的波长并且每次扫描具有1W或更小的功率的紫外激光，在每个迹线槽11的表面(侧壁和底表面)上形成亲水改性层12a。因此，当迹线槽11在之后执行的步骤中填充有导电墨水时，导电墨水散开到每个迹线槽11的各个角落。结果，形成与迹线槽11的形状一致的迹线13(参见图7)。此外，改进了迹线槽11和迹线13之间的粘合。图3图示了表面上形成亲水改性层的迹线槽11(具有50μm的宽度)填充有导电墨水的状态。迹线槽11具有令人满意的可湿性，并且因而导电墨水散开以与迹线槽11的形状一致。
另一方面，当激光的波长比250nm长时，或者当每次扫描的激光功率大于1W时，不能形成亲水改性层12a并且迹线槽11的表面被碳化。一旦迹线槽11的表面被碳化，则难于使迹线槽11的表面亲水。图4图示了表面被碳化的迹线槽(具有50μm的宽度)填充有导电墨水的状态。该迹线槽的可湿性是差的，并且因而导电墨水不能散开以与迹线槽的形状一致。
接下来，使上面形成有迹线槽11的第一板10的第一表面仅经历一次扫描，同时将激光施加到第一表面，从而如图5中所示形成改性层12b。优选地使用与形成迹线槽11所使用的激光相同的激光。在该情况下，可以同时形成图2中所示的迹线槽11和图5中所示的改性层12b。
改性层12b是与改性层12a相似的膜，并且是亲水的。具体地，由于施加激光，构成改性层12a和改性层12b的树脂中的聚合物之间的键被打破，并且因而构成改性层12a、12b的树脂的熔点低于构成第一板10的树脂的熔点。例如，如果通过前述方式使由熔点为300℃的液晶聚合物树脂制成的板改性，则熔点减少约10℃。同时，诸如羟基的亲水基接合到断开部分。因而，改性层12a和改性层12b是亲水的。
图6是与图5对应的平面图。换言之，图5是沿图6中的线V-V截取的截面图。如图5和图6中所示，在围绕迹线槽11的区域中没有形成在第一板10的第一表面上形成的改性层12b。具体地，每个迹线槽11和改性层12b之间的距离优选地等于或大于10μm，并且例如是约50μm。后面将描述该配置的效果。
执行激光扫描以形成改性层12b的次数可以是两次或更多。然而，如上文所述，每次扫描第一板10的第一表面被切割例如0.3μm。因此，激光扫描的次数优选地尽可能小，并且最优选地是一次。
接下来，全部的每个迹线槽11被填充含有银、铜等细微颗粒的导电墨水并且随后使导电墨水干燥，从而如图7所示在迹线槽11中形成迹线13。由于在迹线槽11的表面上形成亲水改性层12a，因此导电墨水散开到每个迹线槽11的各个角落。当不能一次将所需数量的导电墨水供给到迹线槽11时，可以在首次供给的导电墨水干燥之后再次将导电墨水供给到迹线槽11中。可以在形成迹线13之后形成改性层12b，而非在形成迹线13之前形成改性层12b。
接下来，如图8中所示，在第一板10的第一表面上层叠第二板20的第二表面。在第二板20的第一表面上形成迹线槽21a和过孔21b。迹线槽21a和过孔21b按照与形成第一板10的迹线槽11相同的方式形成。因而，在每个迹线槽21a的表面(侧壁和底表面)上以及在过孔21b的外周壁表面上形成了改性层22a。此外，在第二板20的第一表面上形成改性层22b。改性层22b按照与形成第一板10的改性层12b相同的方式形成。
接下来，第二板20的迹线槽21a和过孔21b被填充导电墨水并且随后使导电墨水干燥，从而如图9所示在迹线槽21a和过孔21b中分别形成迹线23a和埋入过孔23b。由于在迹线槽21a的表面以及过孔21b的表面上形成了亲水改性层22a，因此导电墨水散开到迹线槽21a和过孔21b中的每个的各个角落中。注意，为了形成厚的迹线、大直径的过孔、大的基台(land)(图中未示出)等，优选地是使用粘度高并且以高体积比含有导电材料的导电墨水(还被称为“导电膏”)。
随后，第三板和后继的板按照与在第一板10上层叠第二板20相同的方式被依次层叠。此后，所有板通过热压接合被一次接合在一起。这样，制造了多层配线板。在热压接合时，将板加热到高于构成在板之间形成的改性层12b和改性层22b的树脂的熔点并且低于构成诸如第一板10和第二板20的热塑性树脂的熔点的温度。
因而，在热压接合时，第一板10和第二板20不熔化并且仅板之间形成的改性层12b和改性层22b熔化。在围绕迹线槽11、迹线槽21a和过孔21b的区域中没有形成在热压接合时熔化的改性层12b和改性层22b。结果，在热压接合时，可以有效地减少迹线槽11、迹线槽21a、过孔21b等的变形的发生。板之间的改性层12b、22b一旦被熔化即固化。因此，改性层12b、22b保持在所制造的多层配线板中。
接下来，将参照图10和11描述本发明的其他实施例。图10是图8中所示的制造方法的修改示例。如图10中所示，在将第二板20的第二表面层叠在第一板10的第一表面上时，可以在第二板20的第二表面上形成改性层22c。如在围绕迹线槽11的区域中没有形成改性层12a的情况中的那样，在过孔21b周围的区域中没有形成改性层22c。
该配置使得可以进一步改进板之间的粘合，同时如第一实施例中的那样有效地减少在热压接合时迹线槽11、迹线槽21a、过孔21b等的变形的发生。该修改示例的其他配置与第一实施例相同，并且因而下文将不提供对其他配置的描述。
图11图示了第一板10的修改示例。如图11中所示，两个子板，即子板10a和子板10b，可以构成根据第一实施例的第一板10。子板10a是平坦的板，并且改性层12c形成在子板10a的整个第一表面上。改性层12c按照与形成改性层12b相同的方式形成。另一方面，在子板10b中形成通孔。通过在子板10a上层叠子板10b，形成迹线槽11。
在图11中所示的修改示例中，每个迹线槽11的深度由子板10b的厚度确定。因而，较之第一实施例，在该修改示例中更易于调整每个迹线槽11的深度。该修改示例的其他配置与第一实施例相同，并且因而下文将不提供对其他配置的描述。
本发明不限于前述实施例，并且本发明的前述实施例可以在本发明的范围内按照需要进行修改。例如，可以通过使用掩模和紫外灯使板经历一次性曝光，而非使板经历激光扫描，来形成板表面上的迹线槽、过孔和改性层。然而，在成本方面，由于不需要昂贵的掩模，因而激光扫描更为有利。

Claims (6)

1.一种用于多层配线板的制造方法，所述制造方法的特征在于包括：
在第一热塑性树脂板(10)的表面上形成槽(11)；
在所述槽(11)的表面上形成第一亲水改性层(12a)；
通过将光施加到所述第一热塑性树脂板的所述表面的、除了围绕所述槽的区域之外的区域，来形成由熔点低于构成所述第一热塑性树脂板的树脂的熔点的树脂制成的第二改性层(12b)；
利用具有流动性的导电材料填充所述第一热塑性树脂板的所述槽；以及
通过热压接合来将第二热塑性树脂板(20)接合到所述第一热塑性树脂板的上面形成有所述第二改性层的所述表面。
2.根据权利要求1所述的制造方法，其中在所述热压接合中，所述第二热塑性树脂板被加热到高于构成所述第二改性层的树脂的熔点并且低于构成所述第一热塑性树脂板的树脂的熔点的温度。
3.根据权利要求1或2所述的制造方法，其中，
通过重复地施加具有250nm或更小的波长并且在每次施加光时具有1W或更小的功率的紫外激光来形成所述槽。
4.根据权利要求3所述的制造方法，其中通过施加用作所述光的所述紫外激光来形成所述第二改性层。
5.根据权利要求4所述的制造方法，其中通过仅施加一次用作所述光的所述紫外激光来形成所述第二改性层。
6.一种多层配线板，其特征在于包括：
第一热塑性树脂板(10)，在其表面上形成有槽(11)；
在所述槽(11)的表面上形成的第一亲水改性层(12a)；
在所述槽中形成的迹线(13)；
第二热塑性树脂板(20)，其层叠在所述第一热塑性树脂板的所述表面上；以及
第二改性层(12b)，其由熔点低于构成所述第一热塑性树脂板的树脂的熔点的树脂制成，所述第二改性层形成在所述第一热塑性树脂板和所述第二热塑性树脂板之间的界面的、除了围绕所述槽的区域以外的区域上。
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