FR2929864B1 - Auto-assemblage de puces sur un substrat - Google Patents

Auto-assemblage de puces sur un substrat Download PDF

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Publication number
FR2929864B1
FR2929864B1 FR0852370A FR0852370A FR2929864B1 FR 2929864 B1 FR2929864 B1 FR 2929864B1 FR 0852370 A FR0852370 A FR 0852370A FR 0852370 A FR0852370 A FR 0852370A FR 2929864 B1 FR2929864 B1 FR 2929864B1
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France
Prior art keywords
self
substrate
assembly
chips
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0852370A
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English (en)
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FR2929864A1 (fr
Inventor
Lea Di Ciocco
Francois Grossi
Pierric Gueguen
Laurent Vandroux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique CEA
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Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0852370A priority Critical patent/FR2929864B1/fr
Priority to JP2011503417A priority patent/JP5656825B2/ja
Priority to US12/936,765 priority patent/US8642391B2/en
Priority to PCT/EP2009/054115 priority patent/WO2009124921A1/fr
Priority to EP09731239A priority patent/EP2260508A1/fr
Publication of FR2929864A1 publication Critical patent/FR2929864A1/fr
Application granted granted Critical
Publication of FR2929864B1 publication Critical patent/FR2929864B1/fr
Expired - Fee Related legal-status Critical Current
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
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    • H01L2924/01005—Boron [B]
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    • H01L2924/1025—Semiconducting materials
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

L'invention concerne un procédé de formation, en surface d'un substrat (2), d'au moins une zone d'attache hydrophile (12) en vue d'un auto-assemblage d'un composant ou d'une puce (3), dans lequel on réalise une zone hydrophobe (20), qui délimite ladite zone d'attache hydrophile.
FR0852370A 2008-04-09 2008-04-09 Auto-assemblage de puces sur un substrat Expired - Fee Related FR2929864B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0852370A FR2929864B1 (fr) 2008-04-09 2008-04-09 Auto-assemblage de puces sur un substrat
JP2011503417A JP5656825B2 (ja) 2008-04-09 2009-04-07 基板によるチップの自己組立
US12/936,765 US8642391B2 (en) 2008-04-09 2009-04-07 Self-assembly of chips on a substrate
PCT/EP2009/054115 WO2009124921A1 (fr) 2008-04-09 2009-04-07 Auto-assemblage de puces sur un substrat
EP09731239A EP2260508A1 (fr) 2008-04-09 2009-04-07 Auto-assemblage de puces sur un substrat

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0852370A FR2929864B1 (fr) 2008-04-09 2008-04-09 Auto-assemblage de puces sur un substrat
FR0852370 2008-04-09

Publications (2)

Publication Number Publication Date
FR2929864A1 FR2929864A1 (fr) 2009-10-16
FR2929864B1 true FR2929864B1 (fr) 2020-02-07

Family

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FR0852370A Expired - Fee Related FR2929864B1 (fr) 2008-04-09 2008-04-09 Auto-assemblage de puces sur un substrat

Country Status (5)

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US (1) US8642391B2 (fr)
EP (1) EP2260508A1 (fr)
JP (1) JP5656825B2 (fr)
FR (1) FR2929864B1 (fr)
WO (1) WO2009124921A1 (fr)

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WO2006077739A1 (fr) * 2004-12-28 2006-07-27 Mitsumasa Koyanagi Méthode et appareil de fabrication de dispositif à circuit intégré utilisant une fonction d’auto-organisation
FR2929758B1 (fr) * 2008-04-07 2011-02-11 Commissariat Energie Atomique Procede de transfert a l'aide d'un substrat ferroelectrique
DE102009050703B3 (de) * 2009-10-26 2011-04-21 Evonik Goldschmidt Gmbh Verfahren zur Selbstassemblierung elektrischer, elektronischer oder mikromechanischer Bauelemente auf einem Substrat und damit hergestelltes Erzeugnis
JP5732652B2 (ja) * 2009-11-04 2015-06-10 ボンドテック株式会社 接合システムおよび接合方法
JP2011192663A (ja) * 2010-03-11 2011-09-29 Tokyo Electron Ltd 実装方法及び実装装置
TWI446420B (zh) * 2010-08-27 2014-07-21 Advanced Semiconductor Eng 用於半導體製程之載體分離方法
FR2993096B1 (fr) 2012-07-03 2015-03-27 Commissariat Energie Atomique Dispositif et procede de support individuel de composants
JP5963374B2 (ja) * 2012-09-23 2016-08-03 国立大学法人東北大学 チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法
JP6044592B2 (ja) * 2014-05-29 2016-12-14 トヨタ自動車株式会社 多層配線基板及びその製造方法
KR101713818B1 (ko) 2014-11-18 2017-03-10 피에스아이 주식회사 초소형 led 소자를 포함하는 전극어셈블리 및 그 제조방법
KR101672781B1 (ko) 2014-11-18 2016-11-07 피에스아이 주식회사 수평배열 어셈블리용 초소형 led 소자, 이의 제조방법 및 이를 포함하는 수평배열 어셈블리
KR101730977B1 (ko) * 2016-01-14 2017-04-28 피에스아이 주식회사 초소형 led 전극어셈블리
US9947611B2 (en) * 2016-01-29 2018-04-17 Palo Alto Research Center Incorporated Through hole arrays for flexible layer interconnects
CN108780760B (zh) * 2016-03-17 2022-04-08 东京毅力科创株式会社 使用液体进行的芯片部件相对于基板的校准的方法
KR102608419B1 (ko) * 2016-07-12 2023-12-01 삼성디스플레이 주식회사 표시장치 및 표시장치의 제조방법
FR3063832B1 (fr) * 2017-03-08 2019-03-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede d'auto-assemblage de composants microelectroniques
FR3065321B1 (fr) * 2017-04-14 2019-06-21 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de fabrication d'un dispositif d'affichage emissif a led
KR102513267B1 (ko) 2017-10-13 2023-03-23 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US10777527B1 (en) * 2019-07-10 2020-09-15 Mikro Mesa Technology Co., Ltd. Method for transferring micro device

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US6507989B1 (en) * 1997-03-13 2003-01-21 President And Fellows Of Harvard College Self-assembly of mesoscale objects
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JP2006259687A (ja) * 2005-02-17 2006-09-28 Seiko Epson Corp 膜パターンの形成方法及びデバイスの製造方法、電気光学装置及び電子機器
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Publication number Publication date
US8642391B2 (en) 2014-02-04
FR2929864A1 (fr) 2009-10-16
WO2009124921A1 (fr) 2009-10-15
JP2011517104A (ja) 2011-05-26
JP5656825B2 (ja) 2015-01-21
US20110033976A1 (en) 2011-02-10
EP2260508A1 (fr) 2010-12-15

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