TWI389760B - 用於產生具有透光部分之面板之方法及其相關產品 - Google Patents

用於產生具有透光部分之面板之方法及其相關產品 Download PDF

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TWI389760B
TWI389760B TW096119144A TW96119144A TWI389760B TW I389760 B TWI389760 B TW I389760B TW 096119144 A TW096119144 A TW 096119144A TW 96119144 A TW96119144 A TW 96119144A TW I389760 B TWI389760 B TW I389760B
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Gregg E Hardy
Michael S Nashner
Jeffrey E Howerton
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Electro Scient Ind Inc
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
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    • B29C66/74—Joining plastics material to non-plastics material
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    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
    • B60Q3/10—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors for dashboards
    • B60Q3/14—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors for dashboards lighting through the surface to be illuminated
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
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    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
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Description

用於產生具有透光部分之面板之方法及其相關產品
本發明技術標的物之領域係關於用於在鑽孔之前薄化一基板及/或在鑽孔之後結構性地加強一具有通道之薄化基板之方法。
透過一殼體投射光來提供資訊係常見。實例包括但不限於：電腦鍵盤，其包括用於諸如「Caps Lock」或「Num Lock」功能之指示燈；包括「開/關」燈之電腦監視器；汽車，其包括指示加熱座椅是否啟用或氣囊是否打開之指示燈；帶指示燈之電視機；及諸多其他消費者電子器件。
通常提供該種照明之方式係提供投射光，當燈熄滅時該投射光係可見而當燈打開時該投射光係明亮以便進行指示。大量燈或燈用孔可能會破壞業內設計人員之目的。
本發明揭示藉由薄化一基板或面板而大致不減少具有通孔通道之基板之強度及耐用性來改善光傳輸及雷射鑽通過量之方法。
本文所教示之用透光材料填充一基板內通道之方法包括在該基板內形成一空穴，其中該空穴具有一第二厚度。該第二厚度小於該基板之第一厚度。該實例中之方法進一步包括在該空穴中鑽製至少一個通道並用透光材料填充該通道。
本文亦闡述藉由該方法形成之產品。該產品之一個實例，以一面板為例，具有一第一厚度且包括一具有一第二厚度之區段，其中該第二厚度小於該第一厚度。該面板進一步包括一形成於該面板之具有第二厚度之區段內之透光區段，其中該透光區段由至少一個填充有透光材料之通道形成。
本發明此等態樣及其他發明特徵之細節將參照圖示進行論述。
圖1中顯示根據本文教示方法製作之具有通孔通道(由於其相對較小之尺寸，本文亦稱之為微型通道)之薄化基板或面板。可使用標凖的機加工來薄化該基板，或可提供具有一減小厚度區段之基板。如圖2中所示，該基板可在一基板表面內包含一微型通道圖案陣列10。在基板12內鑽製一微型通道圖案陣列10後，可將一透明或半透明材料填充劑32施加至該等鑽製微型通道。如圖3及4中所示，然後，可將一具有透明或半透明及強化性質之材料施加至該鑽製微型通道基板表面以加強該薄化基板之強度。強化材料36可係接合至鑽製表面之固體，或係固化以形成固體之液體或黏性物質。亦可在擬藉由該等微型通道形成照明圖案之應用中使用該加強材料以便進行著色、散射或運用透鏡效果或其他藝術照明效果。
參照圖3－6，圖中顯示一使用透光材料來加強一具有通道10之薄基板12之方法及藉由使用該方法製作之產品，且於下文對其進行闡述。圖5及6中顯示使用透光材料對一具有通道之基板進行結構加強之方法及步驟。提供一面板或基板12。基板12係一相對較薄之連續材料片，例如，陽極氧化鋁。基板12包括一界定基板厚度20之第一或鑽孔表面14及一對置之第二或出口表面18。通常，當該基板係鋁時，基板應約為400微米厚(μm)以便在基板鑽孔表面14內鑽製了通道陣列10之後，基板12可保持其結構完整性。在本發明之一實例中，如圖3中所示，所提供之鋁基板12具有一小於400微米(μm)之薄厚度20a。另一選擇係，如圖4中所示，若提供一具有一約400微米(μm)厚度20之鋁基板12，則可在鑽孔表面14上將基板12之一部分薄化至一較薄之厚度20a。
於提供一具有400微米(μm)厚度之鋁基板12之應用中，該方法包括將鑽孔表面14上之一空穴區域22薄化至一約為100微米(μm)之較薄厚度20a。如圖4中所示，可使用一搪孔機加工裝置或其他機加工裝置來機加工該薄化空穴區域22。薄化空穴區域22之尺寸應足夠大以裝納合意之通道陣列圖案10。圖4中顯示薄化空穴區域22具有一圓形形狀，但應理解，薄化空穴區域22可係其他形狀及組態。基板12之薄化區域22可改善光的傳輸並減少通道之雷射鑽孔時間。
於圖5所示方法之一個應用中，動作(下文中稱之為S)1包括穿過薄化基板12鑽製一個或複數個微型通道或孔24。如圖1中所示，於一態樣中，通道24為圓錐形，且具有側壁26、一於基板鑽孔表面14內之第一開口28及一於基板開口表面18上之對置第二開口30。第一通道開口28之直徑大於第二通道開口30。舉例而言，如圖1A及1B中所示，若基板12為鋁，則第一通道開口28之直徑約為90－100微米(μm)，而第二通道開口30之直徑約為30－40微米(μm)。應理解，亦可使用較大或較小之開口及其他通道形狀及組態。使用一雷射(例如，二極體激發式固態脈衝雷射40)按照一圓形或螺旋圖案在該基板上鑽製或機加工圖1A及1B中之通道24。
任選地，可清潔經鑽製之通道24以移除任何於機加工過程期間形成之碎屑或沈積物。經證明，CO2 雪噴清潔及異丙基對清潔該等通道係有效。亦可使用熟悉此項技術者所習知之其他通道清潔技術。舉例而言，可使用採用超音波浴之超音波清潔。同樣，可藉由一以類似於鑽孔機40之方式移動定位的源來施加高壓空氣(如，雪噴)以清潔該等通道。
於圖5中所示之S2中，所揭示方法可包括將一填充劑材料塗層32施加至通道24內。填充劑材料32可係一能透射可見光之材料。例示性UV可固化填充劑材料32在固化時大致透明。如圖1中最佳所見，在通道24之第二或較小開口30之頂部上將填充劑材料32施加至基板第二表面18，從而填充圖5中所示之通道24。如圖所示，藉由一注射器型裝置34來施加填充劑材料32。儘管圖5中顯示了填充微型通道之步驟，但該方法可在微型通道未填充以填充劑材料32之情形下進行至S3。
參照圖5，於S3中，將一加強材料36施加至薄基板12。將具有透明或半透明性質之加強材料36施加至經鑽製微型通道之基板表面14以加強薄化基板12之強度。如圖5中所示，加強材料36可係一具有透明或半透明性質之固態預形成及/或預固化材料，例如，塑膠或玻璃。可將適合大小之固態透明加強材料36施加至圖3中所示之薄基板，或可將其施加至圖4及5中所示基板之薄化空穴區域22。加強材料36為基板12提供一正常厚度(對於鋁係400微米(μm))基板之結構支撐完整性。
若在S2中對該等通道進行了填充及/或若並未預先固化加強材料36，則該方法可進行至S4，其中較佳地隨後藉由將填充劑材料32暴露於透過透明加強材料36之UV光來固化加強材料36。當固化時，填充劑材料32係光學透明，從而可允許可見光經由通道24通過填充劑材料32、加強材料36及基板12。UV透明之填充劑材料32之固化可將加強材料36接合至基板12。
於另一實例中，圖6中所示之方法包括穿過S11中之薄化基板12鑽製一個或複數個微型通道24。如圖1中所示，如上所述，通道24為圓錐形，且具有側壁26、一於基板第一表面14中之第一開口28及一於基板第二表面18上之對置第二開口30。應理解，可使用更大或更小之開口及其他通道形狀和組態。可清潔經鑽製之通道24以移除任何在機加工過程期間形成之碎屑或沈積物。
填充劑材料32可係一能透射可見光之材料。該例示性UV可固化填充劑材料32在固化時大致透明。相比於可聽音穿過基板12厚度20之傳播，填充劑材料32亦可使可聽音更好地傳播通過填充劑材料32。如圖1中所見，在通道24之第二或較小開口30之頂部上將填充劑材料32施加至基板第二表面18，從而填充圖5中所示之通道24。如圖中所示，藉由一注射器型裝置34來施加填充劑材料32。儘管圖5中顯示了填充該等微型通道之步驟，但該方法可在該等微型通道未填充以填充劑材料32之情形下進行至S3。
於圖6所示之S12中，所揭示方法可包括將一液體填充劑材料塗層32(例如，透明之UV可固化環氧樹脂)施加至通道24內。如圖6中所示，在通道24之第二或較小開口30之頂部上藉由一注射器型裝置34將填充劑材料32施加至基板第二表面18。可使用其他為熟悉此項技術者所習知之填充劑材料32施加裝置及技術。舉例而言，可將一薄的材料膜而並非一可固化液體填充劑材料施加至鋁基板12之鑽孔表面12，從而形成本質上未經填充之通道。
若將一液體可固化填充劑材料32施加至微型通道24，則該方法進行至S13，其中隨後藉由將填充劑材料32暴露於UV光來固化填充劑材料32。自基板12移除任何多餘或未固化之填充劑材料。若必要，該方法可包括：在藉由(例如)簡單的異丙醇擦洗來移除多餘填充劑材料之後，進行額外的固化。
於S14中，如圖4及6中顯示，將一加強材料36施加至基板之薄化空穴區域22。加強材料36可係一固化以形成一固體材料之液體或黏性材料。一液體透明加強材料(例如，透明之環氧樹脂或其他加強材料)為該薄化基板區域提供結構支撐。如圖中所示，藉由一注射器型裝置38施加加強材料36。可使用其他為熟悉此項技術者所習知之施加裝置及技術。強化材料36在固化時可為基板提供如同具有習用厚度之基板之彼結構完整性之均勻結構完整性。
使用通道24及光學透明加強材料36及/或填充劑材料32可提供一對於肉眼而言平滑且連續的基板表面，該基板表面能夠透過該等通道自內部照明顯示受控的影像。獲得之基板12可用於各種應用中。本文揭示之方法及所獲得之基板可適用於幾乎所有如下之應用：期望使用一視覺連續及不間斷並能夠為使用者產生照明訊息、影像或其他感知特徵之面板表面。
舉例而言，圖3及4之基板12係呈一面板之形式。可在一如先前論述之習用殼體中併入面板12，或可使其與一殼體整合在一起。當藉由一LED、螢光或白熾燈或其他發光裝置為面板12(其作為殼體之部分)提供背光時，自該等通道發出的光會形成一能由觀察者看見之圖案。
於另一實例中，可在一小區域中薄化該基板而不施加加強材料至該薄化區域。於該實例中，薄化該基板之小區域不應減少該基板之強度，從而可消除對一加強材料之需要。為保持基板整體的結構完整性，基板中可行的薄化區域尺寸相依於鑽製微型通道陣列之密度、基板材料之強度及/或鑽製通孔之形狀等。
儘管上文結合目前認為最實用及最佳的實施例對該方法進行了闡述，但應理解，該方法並非侷限於所揭示之實施例，相反，本發明意欲涵蓋包含於本發明及任何請求項之精神及範圍內的各種修改及等效步驟和佈置。
10．．．微型通道圖案陣列
12．．．基板
14．．．第一表面、鑽孔表面
18．．．第二表面、出口表面
22．．．空穴區域
24．．．微型通道、孔
26．．．側壁
28．．．第一通道開口
30．．．第二通道開口
32．．．填充劑材料塗層
34．．．注射器型裝置
36．．．加強材料
38．．．注射器型裝置
40．．．二極體激發式固態脈衝雷射
本文說明書參照該等附圖，其中在數個視圖中相同之參考編號指代相同之部件，且圖示中：圖1係一通道幾何形狀之示意圖，而圖1A中係自背側或鑽孔表面拍攝之通道陣列之顯微照片，且圖1B中係自前側或出口表面拍攝之通道陣列之顯微照片；圖2係其中穿過一具有標凖400 μm厚度之基板鑽製通道之應用之示意圖；圖3係其中穿過一具有較薄100 μm厚度之基板鑽製通道之應用之示意圖；圖4係一其中在一基板之薄化空穴區域內鑽製通道之應用之示意圖；圖5係藉由一固體加強材料來加強一具有薄化空穴之基板之方法步驟序列之示意圖；及圖6係藉由一液體加強材料來加強一具有薄化空穴之基板之方法步驟序列之示意圖。
10．．．微型通道圖案陣列
12．．．基板
36．．．加強材料

Claims (14)

  1. 一種產生一透光性區域於一面板中之方法，該方法包括：在該面板中形成一減少厚度區域，該減少厚度區域具有一第一表面，該第一表面比該面板之對側之一第二外部表面更接近該面板之一第一外部表面；在該減少厚度區域之該第一表面及該面板之該第一外部表面之間鑽製多個微觀孔洞之一圖案，以藉由施加一雷射之一雷射光點於該面板以形成該等孔洞之每一者而定義該透光性區域；其中該等孔洞之開口之尺寸經調整以使得該面板之該第一外部表面對於裸眼形成一連續面板表面且其中該面板之一材料為非透光性的；且用一透光材料填充該等孔洞。
  2. 如請求項1之方法，其中該透光材料係一可固化聚合物；且該方法進一步包括：在填充該等孔洞後固化該透光材料。
  3. 如請求項2之方法，其進一步包括：以一透光材料由該減少厚度區域之該第一表面至該面板之該第二外部表面填充於該減少厚度區域。
  4. 如請求項3之方法，其中該面板在該減少厚度區域以外之一厚度等於或大於400微米，而該面板在該減少厚度區域中之一厚度等於或小於100微米。
  5. 如請求項1之方法，其中該等孔洞係圓錐形且該等孔洞之每一者包括：在該減少厚度區域之該第一表面之一第 一端，其具有一介於90微米至100微米之間的第一直徑；及在面板之該第一外部表面之一第二端，其具有一介於30微米至40微米之間的第二直徑。
  6. 如請求項1之方法，其中填充該等微觀孔洞之該圖案包括施加該雷射光點至該減少厚度區域之該第一表面且鑽製至該面板之該第一外部表面；其中該透光材料係液體型式之一可固化聚合物；且其中以一透光材料填充該等孔洞包括將液體型式之該可固化聚合物施加於該減少厚度區域中該面板的該第一外部表面。
  7. 如請求項6之方法，其進一步包括：以一紫外光源固化該可固化聚合物。
  8. 如請求項7之方法，其進一步包括：在固化該可固化聚合物之後，以一透光材料由該減少厚度區域之該第一表面至該面板之該第二外部表面填充於該減少厚度區域。
  9. 如請求項8之方法，其進一步包括：在固化該可固化聚合物之前，以一透光材料由該減少厚度區域之該第一表面至該面板之該第二外部表面填充於該減少厚度區域；且其中固化該可固化聚合物包括將該紫外光源導向填充有該透光材料之該減少厚度區域中該面板之該第二外部表面。
  10. 一種具有一第一厚度之面板，該面板包括一具有一第二厚度之區段，其中該第二厚度小於該第一厚度，該面板包括形成於該面板的具有該第二厚度之區段內之透光區 段，該透光區段由多個微孔洞之一圖案所形成，該等微孔洞以雷射由其一第一表面至對側之一第二表面鑽穿該第二厚度，該等微孔洞具有使得包含該等微孔洞之該面板的一表面對於裸眼形成一連續面板表面之尺寸且該等微孔洞被一透光材料所填充。
  11. 如請求項10之面板，其中具有該第二厚度之該區段在該面板內形成一空穴，該空穴被一透光材料填充。
  12. 如請求項10之面板，其中該透光材料係一UV可固化聚合物。
  13. 如請求項10之面板，其中該第二厚度係等於或小於100微米。
  14. 如請求項11之面板，其中該等微孔洞係圓錐形且每一微孔洞包含介於90微米與100微米之間的一第一直徑及介於30微米與40微米之間的一第二直徑。
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ATE535831T1 (de) 2011-12-15
US7968820B2 (en) 2011-06-28
KR20090016483A (ko) 2009-02-13
EP2024170A4 (en) 2010-07-28
WO2007142877A2 (en) 2007-12-13
WO2007142877A3 (en) 2008-11-27
JP5826777B2 (ja) 2015-12-02
US20110222298A1 (en) 2011-09-15
TW200804013A (en) 2008-01-16
EP2024170A2 (en) 2009-02-18
US8450640B2 (en) 2013-05-28
KR101390452B1 (ko) 2014-04-30
US20070278703A1 (en) 2007-12-06
JP2013101389A (ja) 2013-05-23
JP2009539142A (ja) 2009-11-12
EP2024170B1 (en) 2011-11-30
JP5199248B2 (ja) 2013-05-15

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