TWI462250B - 半導體裝置 - Google Patents

半導體裝置 Download PDF

Info

Publication number
TWI462250B
TWI462250B TW097145456A TW97145456A TWI462250B TW I462250 B TWI462250 B TW I462250B TW 097145456 A TW097145456 A TW 097145456A TW 97145456 A TW97145456 A TW 97145456A TW I462250 B TWI462250 B TW I462250B
Authority
TW
Taiwan
Prior art keywords
circuit board
electronic component
connection terminal
internal connection
component mounting
Prior art date
Application number
TW097145456A
Other languages
English (en)
Chinese (zh)
Other versions
TW200939434A (en
Inventor
加治木篤典
赤池貞和
坪田崇
山西學雄
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW200939434A publication Critical patent/TW200939434A/zh
Application granted granted Critical
Publication of TWI462250B publication Critical patent/TWI462250B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW097145456A 2007-11-26 2008-11-25 半導體裝置 TWI462250B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007304655A JP5230997B2 (ja) 2007-11-26 2007-11-26 半導体装置

Publications (2)

Publication Number Publication Date
TW200939434A TW200939434A (en) 2009-09-16
TWI462250B true TWI462250B (zh) 2014-11-21

Family

ID=40669526

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145456A TWI462250B (zh) 2007-11-26 2008-11-25 半導體裝置

Country Status (5)

Country Link
US (1) US8208268B2 (https=)
JP (1) JP5230997B2 (https=)
KR (1) KR101498736B1 (https=)
CN (1) CN101447470A (https=)
TW (1) TWI462250B (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825514B2 (en) * 2007-12-11 2010-11-02 Dai Nippon Printing Co., Ltd. Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
JP2009182202A (ja) * 2008-01-31 2009-08-13 Casio Comput Co Ltd 半導体装置の製造方法
JP4930566B2 (ja) * 2009-10-02 2012-05-16 富士通株式会社 中継基板、プリント基板ユニット、および、中継基板の製造方法
US20130181359A1 (en) * 2012-01-13 2013-07-18 TW Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thinner Package on Package Structures
US9281292B2 (en) * 2012-06-25 2016-03-08 Intel Corporation Single layer low cost wafer level packaging for SFF SiP
US8546932B1 (en) * 2012-08-15 2013-10-01 Apple Inc. Thin substrate PoP structure
CN104347558B (zh) * 2013-08-05 2019-03-15 日月光半导体制造股份有限公司 半导体封装件及其制造方法
JP6168598B2 (ja) * 2013-08-21 2017-07-26 日東電工株式会社 光電気混載モジュール
JP6570924B2 (ja) * 2015-08-31 2019-09-04 新光電気工業株式会社 電子部品装置及びその製造方法
US10062648B2 (en) 2016-02-26 2018-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and method of forming the same
US9741690B1 (en) * 2016-09-09 2017-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Redistribution layers in semiconductor packages and methods of forming same
US10631410B2 (en) * 2016-09-24 2020-04-21 Apple Inc. Stacked printed circuit board packages
US10388637B2 (en) * 2016-12-07 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
US10797039B2 (en) 2016-12-07 2020-10-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
US10242973B2 (en) * 2017-07-07 2019-03-26 Samsung Electro-Mechanics Co., Ltd. Fan-out-semiconductor package module
JP7001175B2 (ja) * 2018-09-19 2022-01-19 富士通株式会社 電子装置、電子機器、及び電子装置の設計支援方法
KR102509644B1 (ko) * 2018-11-20 2023-03-15 삼성전자주식회사 패키지 모듈
KR102662556B1 (ko) 2018-11-29 2024-05-03 삼성전자주식회사 패키지 모듈
KR102149387B1 (ko) * 2019-02-13 2020-08-28 삼성전기주식회사 전자 소자 모듈
WO2022209751A1 (ja) * 2021-03-31 2022-10-06 株式会社村田製作所 高周波モジュール及び通信装置
JP2024060194A (ja) * 2022-10-19 2024-05-02 株式会社村田製作所 回路モジュール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5562971A (en) * 1994-04-19 1996-10-08 Hitachi Chemical Company, Ltd. Multilayer printed wiring board
US6324067B1 (en) * 1995-11-16 2001-11-27 Matsushita Electric Industrial Co., Ltd. Printed wiring board and assembly of the same
US20030090883A1 (en) * 2001-10-18 2003-05-15 Matsushita Electric Industrial Co., Ltd. Component built-in module and method for producing the same
US6693362B2 (en) * 2001-04-13 2004-02-17 Fujitsu Limited Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
US7239525B2 (en) * 2004-11-17 2007-07-03 Phoenix Precision Technology Corporation Circuit board structure with embedded selectable passive components and method for fabricating the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11112121A (ja) 1997-09-30 1999-04-23 Toshiba Corp 回路モジュール及び回路モジュールを内蔵した電子機器
JPH11214819A (ja) * 1998-01-28 1999-08-06 Sony Corp 配線板及びその製造方法
JP3879347B2 (ja) * 1999-12-20 2007-02-14 富士電機システムズ株式会社 モジュール基板接合方法
EP1168445A1 (en) * 1999-12-27 2002-01-02 Mitsubishi Denki Kabushiki Kaisha Integrated circuit
JP2001210954A (ja) * 2000-01-24 2001-08-03 Ibiden Co Ltd 多層基板
JP2002076265A (ja) * 2000-09-01 2002-03-15 Sony Corp 半導体デバイスの実装方法、半導体デバイス及び半導体装置
JP2003124595A (ja) * 2001-10-11 2003-04-25 Alps Electric Co Ltd 電子回路ユニット
JP2003347722A (ja) * 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法
JP4287733B2 (ja) * 2003-11-04 2009-07-01 日本シイエムケイ株式会社 電子部品内蔵多層プリント配線板
JP2006278811A (ja) * 2005-03-30 2006-10-12 Alps Electric Co Ltd 実装基板
US7989707B2 (en) * 2005-12-14 2011-08-02 Shinko Electric Industries Co., Ltd. Chip embedded substrate and method of producing the same
KR101019067B1 (ko) * 2006-03-29 2011-03-07 가부시키가이샤 무라타 세이사쿠쇼 복합 기판 및 복합 기판의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5562971A (en) * 1994-04-19 1996-10-08 Hitachi Chemical Company, Ltd. Multilayer printed wiring board
US6324067B1 (en) * 1995-11-16 2001-11-27 Matsushita Electric Industrial Co., Ltd. Printed wiring board and assembly of the same
US6693362B2 (en) * 2001-04-13 2004-02-17 Fujitsu Limited Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
US20030090883A1 (en) * 2001-10-18 2003-05-15 Matsushita Electric Industrial Co., Ltd. Component built-in module and method for producing the same
US7239525B2 (en) * 2004-11-17 2007-07-03 Phoenix Precision Technology Corporation Circuit board structure with embedded selectable passive components and method for fabricating the same

Also Published As

Publication number Publication date
KR101498736B1 (ko) 2015-03-04
TW200939434A (en) 2009-09-16
JP5230997B2 (ja) 2013-07-10
US20090135575A1 (en) 2009-05-28
KR20090054390A (ko) 2009-05-29
CN101447470A (zh) 2009-06-03
US8208268B2 (en) 2012-06-26
JP2009130196A (ja) 2009-06-11

Similar Documents

Publication Publication Date Title
TWI462250B (zh) 半導體裝置
US7586183B2 (en) Multilevel semiconductor module and method for fabricating the same
TWI447880B (zh) 堆疊型半導體封裝、其形成方法以及包含該封裝的電子系統
US9536801B2 (en) Electronic component having encapsulated wiring board and method for manufacturing the same
JP4606849B2 (ja) デカップリングコンデンサを有する半導体チップパッケージ及びその製造方法
US7365416B2 (en) Multi-level semiconductor module and method for fabricating the same
CN101325121B (zh) 电子元件及其制备方法
RU2297736C2 (ru) Способ встраивания компонента в основание и формирования электрического контакта с компонентом
TWI418003B (zh) 嵌埋電子元件之封裝結構及其製法
KR101696705B1 (ko) 칩 내장형 pcb 및 그 제조 방법과, 그 적층 패키지
US8669653B2 (en) Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor
US20120217049A1 (en) Wiring board with built-in imaging device
CN104241255B (zh) 电子组件模块及其制造方法
JP5182448B2 (ja) 部品内蔵基板
US20230115073A1 (en) Semiconductor package
US8415781B2 (en) Electronic component and method for manufacturing the same
CN111009498B (zh) 半导体封装件及其制造方法以及制造再分布结构的方法
JP2004534394A (ja) 少なくとも１つの電子部品を備えた回路基板
US20040009629A1 (en) Electrode forming method in circuit device and chip package and multilayer board using the same
TW201603665A (zh) 印刷電路板、用以製造其之方法及具有其之層疊封裝
KR100816324B1 (ko) 칩 내장형 인쇄회로기판 및 그 제조방법
KR20090079448A (ko) 임베디드 칩을 갖는 인쇄 회로 기판의 제조 방법 및 이를사용한 임베디드 칩을 갖는 인쇄 회로 기판
JP7590881B2 (ja) 配線基板、電子部品、および配線基板の製造方法
US20240387486A1 (en) Semiconductor package
JP2011108973A (ja) 半導体パッケージ、半導体装置、およびその製造方法