KR101498736B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

Info

Publication number
KR101498736B1
KR101498736B1 KR1020080117396A KR20080117396A KR101498736B1 KR 101498736 B1 KR101498736 B1 KR 101498736B1 KR 1020080117396 A KR1020080117396 A KR 1020080117396A KR 20080117396 A KR20080117396 A KR 20080117396A KR 101498736 B1 KR101498736 B1 KR 101498736B1
Authority
KR
South Korea
Prior art keywords
wiring board
electronic component
wiring
internal connection
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020080117396A
Other languages
English (en)
Korean (ko)
Other versions
KR20090054390A (ko
Inventor
아츠노리 카지키
사다카즈 아카이케
타카시 츠보타
노리오 야마니시
Original Assignee
신코 덴키 코교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신코 덴키 코교 가부시키가이샤 filed Critical 신코 덴키 코교 가부시키가이샤
Publication of KR20090054390A publication Critical patent/KR20090054390A/ko
Application granted granted Critical
Publication of KR101498736B1 publication Critical patent/KR101498736B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020080117396A 2007-11-26 2008-11-25 반도체 장치 Active KR101498736B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007304655A JP5230997B2 (ja) 2007-11-26 2007-11-26 半導体装置
JPJP-P-2007-304655 2007-11-26

Publications (2)

Publication Number Publication Date
KR20090054390A KR20090054390A (ko) 2009-05-29
KR101498736B1 true KR101498736B1 (ko) 2015-03-04

Family

ID=40669526

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080117396A Active KR101498736B1 (ko) 2007-11-26 2008-11-25 반도체 장치

Country Status (5)

Country Link
US (1) US8208268B2 (https=)
JP (1) JP5230997B2 (https=)
KR (1) KR101498736B1 (https=)
CN (1) CN101447470A (https=)
TW (1) TWI462250B (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825514B2 (en) * 2007-12-11 2010-11-02 Dai Nippon Printing Co., Ltd. Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
JP2009182202A (ja) * 2008-01-31 2009-08-13 Casio Comput Co Ltd 半導体装置の製造方法
JP4930566B2 (ja) * 2009-10-02 2012-05-16 富士通株式会社 中継基板、プリント基板ユニット、および、中継基板の製造方法
US20130181359A1 (en) * 2012-01-13 2013-07-18 TW Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thinner Package on Package Structures
US9281292B2 (en) * 2012-06-25 2016-03-08 Intel Corporation Single layer low cost wafer level packaging for SFF SiP
US8546932B1 (en) * 2012-08-15 2013-10-01 Apple Inc. Thin substrate PoP structure
CN104347558B (zh) * 2013-08-05 2019-03-15 日月光半导体制造股份有限公司 半导体封装件及其制造方法
JP6168598B2 (ja) * 2013-08-21 2017-07-26 日東電工株式会社 光電気混載モジュール
JP6570924B2 (ja) * 2015-08-31 2019-09-04 新光電気工業株式会社 電子部品装置及びその製造方法
US10062648B2 (en) 2016-02-26 2018-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and method of forming the same
US9741690B1 (en) * 2016-09-09 2017-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Redistribution layers in semiconductor packages and methods of forming same
US10631410B2 (en) * 2016-09-24 2020-04-21 Apple Inc. Stacked printed circuit board packages
US10388637B2 (en) * 2016-12-07 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
US10797039B2 (en) 2016-12-07 2020-10-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
US10242973B2 (en) * 2017-07-07 2019-03-26 Samsung Electro-Mechanics Co., Ltd. Fan-out-semiconductor package module
JP7001175B2 (ja) * 2018-09-19 2022-01-19 富士通株式会社 電子装置、電子機器、及び電子装置の設計支援方法
KR102509644B1 (ko) * 2018-11-20 2023-03-15 삼성전자주식회사 패키지 모듈
KR102662556B1 (ko) 2018-11-29 2024-05-03 삼성전자주식회사 패키지 모듈
KR102149387B1 (ko) * 2019-02-13 2020-08-28 삼성전기주식회사 전자 소자 모듈
WO2022209751A1 (ja) * 2021-03-31 2022-10-06 株式会社村田製作所 高周波モジュール及び通信装置
JP2024060194A (ja) * 2022-10-19 2024-05-02 株式会社村田製作所 回路モジュール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214819A (ja) * 1998-01-28 1999-08-06 Sony Corp 配線板及びその製造方法
JP2001210954A (ja) * 2000-01-24 2001-08-03 Ibiden Co Ltd 多層基板
JP2003347722A (ja) * 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07288385A (ja) * 1994-04-19 1995-10-31 Hitachi Chem Co Ltd 多層配線板及びその製造法
EP0774888B1 (en) * 1995-11-16 2003-03-19 Matsushita Electric Industrial Co., Ltd Printed wiring board and assembly of the same
JPH11112121A (ja) 1997-09-30 1999-04-23 Toshiba Corp 回路モジュール及び回路モジュールを内蔵した電子機器
JP3879347B2 (ja) * 1999-12-20 2007-02-14 富士電機システムズ株式会社 モジュール基板接合方法
EP1168445A1 (en) * 1999-12-27 2002-01-02 Mitsubishi Denki Kabushiki Kaisha Integrated circuit
JP2002076265A (ja) * 2000-09-01 2002-03-15 Sony Corp 半導体デバイスの実装方法、半導体デバイス及び半導体装置
JP2002314031A (ja) 2001-04-13 2002-10-25 Fujitsu Ltd マルチチップモジュール
JP2003124595A (ja) * 2001-10-11 2003-04-25 Alps Electric Co Ltd 電子回路ユニット
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Industrial Co Ltd Module with built-in components and the manufacturing method thereof
JP4287733B2 (ja) * 2003-11-04 2009-07-01 日本シイエムケイ株式会社 電子部品内蔵多層プリント配線板
TWI315648B (en) * 2004-11-17 2009-10-01 Phoenix Prec Technology Corp Circuit board structure with embeded adjustable passive components and method for fabricating the same
JP2006278811A (ja) * 2005-03-30 2006-10-12 Alps Electric Co Ltd 実装基板
US7989707B2 (en) * 2005-12-14 2011-08-02 Shinko Electric Industries Co., Ltd. Chip embedded substrate and method of producing the same
KR101019067B1 (ko) * 2006-03-29 2011-03-07 가부시키가이샤 무라타 세이사쿠쇼 복합 기판 및 복합 기판의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214819A (ja) * 1998-01-28 1999-08-06 Sony Corp 配線板及びその製造方法
JP2001210954A (ja) * 2000-01-24 2001-08-03 Ibiden Co Ltd 多層基板
JP2003347722A (ja) * 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法

Also Published As

Publication number Publication date
TW200939434A (en) 2009-09-16
JP5230997B2 (ja) 2013-07-10
US20090135575A1 (en) 2009-05-28
KR20090054390A (ko) 2009-05-29
CN101447470A (zh) 2009-06-03
US8208268B2 (en) 2012-06-26
TWI462250B (zh) 2014-11-21
JP2009130196A (ja) 2009-06-11

Similar Documents

Publication Publication Date Title
KR101498736B1 (ko) 반도체 장치
US8324513B2 (en) Wiring substrate and semiconductor apparatus including the wiring substrate
US7808799B2 (en) Wiring board
US7473988B2 (en) Wiring board construction including embedded ceramic capacitors(s)
CN1198486C (zh) 具有用于安装电子部件的空腔的印刷线路板
KR101696705B1 (ko) 칩 내장형 pcb 및 그 제조 방법과, 그 적층 패키지
US20080239685A1 (en) Capacitor built-in wiring board
US20150092356A1 (en) Printed wiring board, method for manufacturing printed wiring board and package-on-package
US11075153B2 (en) Electronic component-incorporating substrate
KR20090130727A (ko) 전자부품 내장형 인쇄회로기판 및 그 제조방법
JP2003264253A (ja) 半導体装置及びその製造方法
KR20160095622A (ko) 배선 기판 및 그 코드 정보의 인식 방법
US20040009629A1 (en) Electrode forming method in circuit device and chip package and multilayer board using the same
KR101614856B1 (ko) 반도체 칩의 실장 기판, 이를 갖는 반도체 패키지 및 반도체 패키지의 제조 방법
CN1841728A (zh) 半导体模块及其制造方法
JP2013110329A (ja) コンデンサモジュール内蔵配線基板
US8418356B2 (en) Method of manufacturing an embedded printed circuit board
KR101548786B1 (ko) 반도체 패키지 및 반도체 패키지 제조 방법
KR102669579B1 (ko) 인쇄회로기판 및 이를 포함하는 패키지 기판
JP4814129B2 (ja) 部品内蔵配線基板、配線基板内蔵用部品
CN117917195A (zh) 电路板
JP2876789B2 (ja) 半導体モジュール
KR100733245B1 (ko) 내장된 칩 부품을 갖는 인쇄회로기판 및 그 제조방법
KR20110028838A (ko) 포스트 형성방법, 이를 이용한 인쇄회로기판 제조방법 및 전자소자 제조방법
JPH01175296A (ja) 多層印刷配線板装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20180201

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20190129

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20200129

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 12