CN101447470A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN101447470A
CN101447470A CNA2008101784256A CN200810178425A CN101447470A CN 101447470 A CN101447470 A CN 101447470A CN A2008101784256 A CNA2008101784256 A CN A2008101784256A CN 200810178425 A CN200810178425 A CN 200810178425A CN 101447470 A CN101447470 A CN 101447470A
Authority
CN
China
Prior art keywords
wiring substrate
electronic component
wiring
semiconductor device
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008101784256A
Other languages
English (en)
Chinese (zh)
Inventor
加治木笃典
赤池贞和
坪田崇
山西学雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN101447470A publication Critical patent/CN101447470A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CNA2008101784256A 2007-11-26 2008-11-26 半导体装置 Pending CN101447470A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007304655A JP5230997B2 (ja) 2007-11-26 2007-11-26 半導体装置
JP2007304655 2007-11-26

Publications (1)

Publication Number Publication Date
CN101447470A true CN101447470A (zh) 2009-06-03

Family

ID=40669526

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008101784256A Pending CN101447470A (zh) 2007-11-26 2008-11-26 半导体装置

Country Status (5)

Country Link
US (1) US8208268B2 (https=)
JP (1) JP5230997B2 (https=)
KR (1) KR101498736B1 (https=)
CN (1) CN101447470A (https=)
TW (1) TWI462250B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105393150A (zh) * 2013-08-21 2016-03-09 日东电工株式会社 光电混载模块
CN111564433A (zh) * 2019-02-13 2020-08-21 三星电机株式会社 电子组件模块

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825514B2 (en) * 2007-12-11 2010-11-02 Dai Nippon Printing Co., Ltd. Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
JP2009182202A (ja) * 2008-01-31 2009-08-13 Casio Comput Co Ltd 半導体装置の製造方法
JP4930566B2 (ja) * 2009-10-02 2012-05-16 富士通株式会社 中継基板、プリント基板ユニット、および、中継基板の製造方法
US20130181359A1 (en) * 2012-01-13 2013-07-18 TW Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thinner Package on Package Structures
US9281292B2 (en) * 2012-06-25 2016-03-08 Intel Corporation Single layer low cost wafer level packaging for SFF SiP
US8546932B1 (en) * 2012-08-15 2013-10-01 Apple Inc. Thin substrate PoP structure
CN104347558B (zh) * 2013-08-05 2019-03-15 日月光半导体制造股份有限公司 半导体封装件及其制造方法
JP6570924B2 (ja) * 2015-08-31 2019-09-04 新光電気工業株式会社 電子部品装置及びその製造方法
US10062648B2 (en) 2016-02-26 2018-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and method of forming the same
US9741690B1 (en) * 2016-09-09 2017-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Redistribution layers in semiconductor packages and methods of forming same
US10631410B2 (en) * 2016-09-24 2020-04-21 Apple Inc. Stacked printed circuit board packages
US10388637B2 (en) * 2016-12-07 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
US10797039B2 (en) 2016-12-07 2020-10-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
US10242973B2 (en) * 2017-07-07 2019-03-26 Samsung Electro-Mechanics Co., Ltd. Fan-out-semiconductor package module
JP7001175B2 (ja) * 2018-09-19 2022-01-19 富士通株式会社 電子装置、電子機器、及び電子装置の設計支援方法
KR102509644B1 (ko) * 2018-11-20 2023-03-15 삼성전자주식회사 패키지 모듈
KR102662556B1 (ko) 2018-11-29 2024-05-03 삼성전자주식회사 패키지 모듈
WO2022209751A1 (ja) * 2021-03-31 2022-10-06 株式会社村田製作所 高周波モジュール及び通信装置
JP2024060194A (ja) * 2022-10-19 2024-05-02 株式会社村田製作所 回路モジュール

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07288385A (ja) * 1994-04-19 1995-10-31 Hitachi Chem Co Ltd 多層配線板及びその製造法
EP0774888B1 (en) * 1995-11-16 2003-03-19 Matsushita Electric Industrial Co., Ltd Printed wiring board and assembly of the same
JPH11112121A (ja) 1997-09-30 1999-04-23 Toshiba Corp 回路モジュール及び回路モジュールを内蔵した電子機器
JPH11214819A (ja) * 1998-01-28 1999-08-06 Sony Corp 配線板及びその製造方法
JP3879347B2 (ja) * 1999-12-20 2007-02-14 富士電機システムズ株式会社 モジュール基板接合方法
EP1168445A1 (en) * 1999-12-27 2002-01-02 Mitsubishi Denki Kabushiki Kaisha Integrated circuit
JP2001210954A (ja) * 2000-01-24 2001-08-03 Ibiden Co Ltd 多層基板
JP2002076265A (ja) * 2000-09-01 2002-03-15 Sony Corp 半導体デバイスの実装方法、半導体デバイス及び半導体装置
JP2002314031A (ja) 2001-04-13 2002-10-25 Fujitsu Ltd マルチチップモジュール
JP2003124595A (ja) * 2001-10-11 2003-04-25 Alps Electric Co Ltd 電子回路ユニット
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Industrial Co Ltd Module with built-in components and the manufacturing method thereof
JP2003347722A (ja) * 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法
JP4287733B2 (ja) * 2003-11-04 2009-07-01 日本シイエムケイ株式会社 電子部品内蔵多層プリント配線板
TWI315648B (en) * 2004-11-17 2009-10-01 Phoenix Prec Technology Corp Circuit board structure with embeded adjustable passive components and method for fabricating the same
JP2006278811A (ja) * 2005-03-30 2006-10-12 Alps Electric Co Ltd 実装基板
US7989707B2 (en) * 2005-12-14 2011-08-02 Shinko Electric Industries Co., Ltd. Chip embedded substrate and method of producing the same
KR101019067B1 (ko) * 2006-03-29 2011-03-07 가부시키가이샤 무라타 세이사쿠쇼 복합 기판 및 복합 기판의 제조 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105393150A (zh) * 2013-08-21 2016-03-09 日东电工株式会社 光电混载模块
CN105393150B (zh) * 2013-08-21 2018-12-28 日东电工株式会社 光电混载模块
CN111564433A (zh) * 2019-02-13 2020-08-21 三星电机株式会社 电子组件模块

Also Published As

Publication number Publication date
KR101498736B1 (ko) 2015-03-04
TW200939434A (en) 2009-09-16
JP5230997B2 (ja) 2013-07-10
US20090135575A1 (en) 2009-05-28
KR20090054390A (ko) 2009-05-29
US8208268B2 (en) 2012-06-26
TWI462250B (zh) 2014-11-21
JP2009130196A (ja) 2009-06-11

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C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20090603